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PRELIMINARY
Programmable System-on-Chip (PSoC )
General Description
PSoC(R) 5: CY8C55 Family Datasheet (R)
With its unique array of configurable blocks, PSoC(R) 5 is a true system-level solution providing microcontroller unit (MCU), memory, analog, and digital peripheral functions in a single chip. The CY8C55 family offers a modern method of signal acquisition, signal processing, and control with high accuracy, high bandwidth, and high flexibility. Analog capability spans the range from thermocouples (near DC voltages) to ultrasonic signals. The CY8C55 family can handle dozens of data acquisition channels and analog inputs on every GPIO pin. The CY8C55 family is also a high-performance configurable digital system with some part numbers including interfaces such as USB, multimaster I2C, and controller area network (CAN). In addition to communication interfaces, the CY8C55 family has an easy to configure logic array, flexible routing to all I/O pins, and a high-performance 32-bit ARM(R) CortexTM-M3 microprocessor core. Designers can easily create system-level designs using a rich library of prebuilt components and boolean primitives using PSoC CreatorTM, a hierarchical schematic design entry tool. The CY8C55 family provides unparalleled opportunities for analog and digital bill of materials integration while easily accommodating last minute design changes through simple firmware updates. Library of advanced peripherals Features * Cyclic redundancy check (CRC) 32-bit ARM Cortex-M3 CPU core * Pseudo random sequence (PRS) generator DC to 67 MHz operation * Local interconnect network (LIN) bus 2.0 Flash program memory, up to 256 KB, 100,000 write cycles, * Quadrature decoder 20-year retention, and multiple security features Analog peripherals (1.71 V VDDA 5.5 V) Up to 64 KB SRAM memory 1.024 V 1% internal voltage reference across -40 C to 2-KB electrically erasable programmable read-only memory +85 C (128 ppm/C) (EEPROM) memory, 1 million cycles, and 20 years retention Configurable delta-sigma ADC with 8- to 20-bit resolution 24-channel direct memory access (DMA) with multilayer * Sample rates up to 192 ksps AMBA high-performance bus (AHB) bus access * Programmable gain stage: x0.25 to x16 * Programmable chained descriptors and priorities * 12-bit mode, 192 ksps, 66-dB signal to noise and distortion * High bandwidth 32-bit transfer support ratio (SINAD), 1-bit INL/DNL Low voltage, ultra low power * 16-bit mode, 48 ksps, 84-dB SINAD, 2-bit INL, 1-bit DNL Operating voltage range:1.8 V to 5.5 V [2] Two SAR ADCs, each 12-bit at 1 Msps High-efficiency boost regulator from 1.8 V input to 5.0 V Four 8-bit 8 Msps current IDACs or 1-Msps voltage VDACs output Four comparators with 95-ns response time 2 mA at 6 MHz Four uncommitted opamps with 25-mA drive capability Low power modes including: Four configurable multifunction analog blocks. Example * 2-A sleep mode with real time clock (RTC) and configurations are programmable gain amplifier (PGA), low-voltage detect (LVD) interrupt transimpedance amplifier (TIA), mixer, and Sample and Hold * 300-nA hibernate mode with RAM retention CapSense support Versatile I/O system Programming, debug, and trace 28 to 72 I/Os (62 GPIOs, 8 SIOs, 2 USBIOs) JTAG (4 wire), serial wire debug (SWD) (2 wire), single wire Any GPIO to any digital or analog peripheral routability viewer (SWV), and TRACEPORT interfaces LCD direct drive from any GPIO, up to 46x16 segments Cortex-M3 flash patch and breakpoint (FPB) block (R) support from any GPIO[1] CapSense Cortex-M3 Embedded Trace MacrocellTM (ETMTM) 1.2 V to 5.5 V I/O interface voltages, up to 4 domains generates an instruction trace stream. Maskable, independent IRQ on any pin or port Cortex-M3 data watchpoint and trace (DWT) generates data Schmitt-trigger transistor-transistor logic (TTL) inputs trace information All GPIOs configurable as open drain high/low, Cortex-M3 Instrumentation Trace Macrocell (ITM) can be pull-up/pull-down, High-Z, or strong output used for printf-style debugging 25 mA sink on SIO DWT, ETM, and ITM blocks communicate with off-chip debug and trace systems via the SWV or TRACEPORT Digital peripherals 2 Bootloader programming supportable through I C, SPI, 20 to 24 programmable logic device (PLD) based universal UART, USB, and other interfaces digital blocks (UDBs) [2] Precision, programmable clocking Full CAN 2.0b 16 RX, 8 TX buffers 3 to 62 MHz internal oscillator over full temperature and Full-Speed (FS) USB 2.0 12 Mbps using internal oscillator voltage range Four 16-bit configurable timers, counters, and PWM blocks 4- to 25 MHz crystal oscillator for crystal PPM accuracy 67 MHz, 24-bit fixed point digital filter block (DFB) to Internal PLL clock generation up to 67 MHz implement finite impulse response (FIR) and infinite impulse 32.768 KHz watch crystal oscillator response (IIR) filters Low power internal oscillator at 1, 33, and 100 kHz Library of standard peripherals Temperature and packaging * 8-, 16-, 24-, and 32-bit timers, counters, and PWMs -40 C to +85 C industrial temperature * SPI, UART, and I2C 68-pin QFN and 100-pin TQFP package options. * Many others available in catalog
Notes 1. GPIOs with opamp outputs are not recommended for use with CapSense. 2. This feature on select devices only. See Ordering Information on page 105 for details.
Cypress Semiconductor Corporation Document Number: 001-66235 Rev. **
*
198 Champion Court
*
San Jose, CA 95134-1709
* 408-943-2600 Revised March 28, 2011
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PRELIMINARY
PSoC(R) 5: CY8C55 Family Datasheet
Contents
1. Architectural Overview ..................................................... 3 2. Pinouts ............................................................................... 5 3. Pin Descriptions ................................................................ 9 4. CPU ................................................................................... 10 4.1 ARM Cortex-M3 CPU ............................................... 10 4.2 Cache Controller ...................................................... 12 4.3 DMA and PHUB ....................................................... 12 5. Memory ............................................................................. 16 5.1 Static RAM ............................................................... 16 5.2 Flash Program Memory ............................................ 16 5.3 Flash Security ........................................................... 16 5.4 EEPROM .................................................................. 16 5.5 Memory Map ............................................................ 17 6. System Integration .......................................................... 18 6.1 Clocking System ....................................................... 18 6.1.4 6.2 Power System ................................................. 21 7. Digital Subsystem ........................................................... 32 7.1 Example Peripherals ................................................ 32 7.4 DSI Routing Interface Description ............................ 39 7.5 CAN .......................................................................... 41 7.6 USB .......................................................................... 42 7.7 Timers, Counters, and PWMs .................................. 42 7.8 I2C ............................................................................ 43 7.9 Digital Filter Block ..................................................... 44 8. Analog Subsystem .......................................................... 44 8.1 Analog Routing ......................................................... 46 8.2 Delta-sigma ADC ...................................................... 48 8.3 Successive Approximation ADC ............................... 49 8.4 Comparators ............................................................. 49 8.5 Opamps .................................................................... 51 8.6 Programmable SC/CT Blocks .................................. 51 8.7 LCD Direct Drive ...................................................... 52 8.8 CapSense ................................................................. 53 8.9 Temp Sensor ............................................................ 53 8.10 DAC ........................................................................ 53 8.11 Up/Down Mixer ....................................................... 54 8.12 Sample and Hold .................................................... 54 9. Programming, Debug Interfaces, Resources ............................................................................ 55 9.1 SWD Interface .......................................................... 55 9.2 JTAG Interface ......................................................... 55 9.3 Debug Features ........................................................ 55 9.4 Trace Features ......................................................... 55 9.5 SWV and TRACEPORT Interfaces .......................... 56 9.6 Programming Features ............................................. 56 9.7 Device Security ........................................................ 56 10. Development Support ................................................... 57 10.1 Documentation ....................................................... 57 10.2 Online ..................................................................... 57 10.3 Tools ....................................................................... 57 11. Electrical Specifications ............................................... 58 11.1 Absolute Maximum Ratings .................................... 58 11.2 Device Level Specifications .................................... 59 11.3 Power Regulators ................................................... 61 11.1 Inputs and Outputs ................................................. 64 11.2 Analog Peripherals ................................................. 72 11.6 Digital Peripherals .................................................. 93 11.7 Memory .................................................................. 97 11.8 PSoC System Resources ....................................... 99 11.9 Clocking ................................................................ 101 12. Ordering Information ................................................... 105 12.1 Part Numbering Conventions ............................... 105 13. Packaging ..................................................................... 107 14. Acronyms ..................................................................... 109 15. Reference Documents ................................................. 110 16. Document Conventions .............................................. 111 16.1 Units of Measure .................................................. 111 17. Revision History .......................................................... 112
Document Number: 001-66235 Rev. **
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PRELIMINARY
PSoC(R) 5: CY8C55 Family Datasheet
1. Architectural Overview
Introducing the CY8C55 family of ultra low power, flash Programmable System-on-Chip (PSoC) devices, part of a scalable 8-bit PSoC 3 and 32-bit PSoC 5 platform. The CY8C55 family provides configurable blocks of analog, digital, and interconnect circuitry around a CPU subsystem. The combination of a CPU with a flexible analog subsystem, digital subsystem, routing, and I/O enables a high level of integration in a wide variety of consumer, industrial, and medical applications. Figure 1-1. Simplified Block Diagram
Analog Interconnect Digital Interconnect
GPIOs
Usage Example for UDB
Sequencer
4- 25 MHz ( Optional )
System Wide Resources
Xtal Osc
Digital System
Universal Digital Block Array (24 x UDB)
8- Bit Timer UDB Quadrature Decoder UDB 16- Bit PWM UDB 16- Bit PRS UDB UDB UDB
CAN 2.0
I2C
Master / Slave
SIO
22
UDB UDB
Clock Tree
UDB I 2C Slave UDB
UDB 8- Bit SPI
UDB 12- Bit SPI
UDB 8- Bit Timer Logic UDB
GPIOs
UDB
UDB
UDB
UDB
IMO
4x Timer Counter PWM
FS USB 2.0
USB PHY
32.768 KHz ( Optional )
Logic UDB UART UDB UDB 12- Bit PWM UDB UDB UDB
RTC Timer
System Bus
WDT and Wake GPIOs GPIOs 3 per Opamp GPIOs GPIOs + 4x Opamp + 4x DAC 1x Del Sig ADC 4x CMP -
Memory System
EEPROM SRAM
CPU System
8051 or Cortex M3 CPU Interrupt Controller
Program & Debug
Program Debug & Trace
EMIF ILO Clocking System
Power Management System
FLASH
Cache Controller
PHUB DMA
Boundary Scan
SIOs
LCD Direct Drive
Digital Filter Block
Analog System
ADCs
2x SAR ADC
POR and LVD Sleep Power 1.71 to 5.5 V 1.8 V LDO SMP 4 x SC / CT Blocks (TIA, PGA, Mixer etc) Temperature Sensor CapSense
0. 5 to 5.5 V ( Optional )
Document Number: 001-66235 Rev. **
GPIOs
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PSoC(R) 5: CY8C55 Family Datasheet
Figure 1-1 illustrates the major components of the CY8C55 family. They are:

subsystem is a fast, accurate, configurable delta-sigma ADC with these features:

ARM Cortex-M3 CPU subsystem Nonvolatile subsystem Programming, debug, and test subsystem Inputs and outputs Clocking Power Digital subsystem Analog subsystem
Less than 0.5 mV offset A gain error of 0.2% Integral non linearity (INL) less than 2 LSB Differential non linearity (DNL) less than 1 LSB SINAD better than 84 dB in 16-bit mode
This converter addresses a wide variety of precision analog applications including some of the most demanding sensors. The CY8C55 family also offers up to two SAR ADCs. Featuring 12-bit conversions at up to 1 M samples per second, they also offer low nonlinearity and offset errors and SNR better than 70 dB. They are well-suited for a variety of higher speed analog applications. The output of any of the ADCs can optionally feed the programmable DFB via DMA without CPU intervention. The designer can configure the DFB to perform IIR and FIR digital filters and several user defined custom functions. The DFB can implement filters with up to 64 taps. It can perform a 48-bit multiply-accumulate (MAC) operation in one clock cycle. Four high-speed voltage or current DACs support 8-bit output signals at an update rate of up to 8 Msps. They can be routed out of any GPIO pin. You can create higher resolution voltage DAC outputs using the UDB array. This can be used to create a pulse width modulated (PWM) DAC of up to 10 bits, at up to 48 kHz. The digital DACs in each UDB support PWM, PRS, or delta-sigma algorithms with programmable widths. In addition to the ADCs, DACs, and DFB, the analog subsystem provides multiple:

PSoC's digital subsystem provides half of its unique configurability. It connects a digital signal from any peripheral to any pin through the digital system interconnect (DSI). It also provides functional flexibility through an array of small, fast, low power UDBs. PSoC Creator provides a library of pre-built and tested standard digital peripherals (UART, SPI, LIN, PRS, CRC, timer, counter, PWM, AND, OR, and so on) that are mapped to the UDB array. The designer can also easily create a digital circuit using boolean primitives by means of graphical design entry. Each UDB contains programmable array logic (PAL)/programmable logic device (PLD) functionality, together with a small state machine engine to support a wide variety of peripherals. In addition to the flexibility of the UDB array, PSoC also provides configurable digital blocks targeted at specific functions. For the CY8C55 family, these blocks can include four 16-bit timers, counters, and PWM blocks; I2C slave, master, and multimaster; Full-Speed USB; and Full CAN 2.0b. For more details on the peripherals see the "Example Peripherals" section on page 32 of this data sheet. For information on UDBs, DSI, and other digital blocks, see the "Digital Subsystem" section on page 32 of this data sheet. PSoC's analog subsystem is the second half of its unique configurability. All analog performance is based on a highly accurate absolute voltage reference with less than 1% error over temperature and voltage. The configurable analog subsystem includes:

Comparators Uncommitted opamps
Analog muxes Comparators Analog mixers Voltage references ADCs DACs Digital filter block (DFB)
Configurable switched capacitor/continuous time (SC/CT) blocks. These support: Transimpedance amplifiers Programmable gain amplifiers Mixers Other similar analog components See the "Analog Subsystem" section on page 44 of this data sheet for more details. PSoC's CPU subsystem is built around a 32-bit three-stage pipelined ARM Cortex-M3 processor running at up to 67 MHz. The Cortex-M3 includes a tightly integrated nested vectored interrupt controller (NVIC) and various debug and trace modules. The overall CPU subsystem includes a DMA controller, flash cache, and RAM. The NVIC provides low latency, nested interrupts, and tail-chaining of interrupts and other features to increase the efficiency of interrupt handling. The DMA controller enables peripherals to exchange data without CPU involvement. This allows the CPU to run slower (saving power) or use those CPU cycles to improve the performance of firmware algorithms. The flash cache also reduces system power consumption by allowing less frequent flash access.
All GPIO pins can route analog signals into and out of the device using the internal analog bus. This allows the device to interface up to 62 discrete analog signals. One of the ADCs in the analog
Document Number: 001-66235 Rev. **
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PSoC(R) 5: CY8C55 Family Datasheet
PSoC's nonvolatile subsystem consists of flash and byte-writeable EEPROM. It provides up to 256 KB of on-chip flash. The CPU can reprogram individual blocks of flash, enabling boot loaders. A powerful and flexible protection model secures the user's sensitive information, allowing selective memory block locking for read and write protection. Two KB of byte-writable EEPROM is available on-chip to store application data. The three types of PSoC I/O are extremely flexible. All I/Os have many drive modes that are set at POR. PSoC also provides up to four I/O voltage domains through the VDDIO pins. Every GPIO has analog I/O, LCD drive, flexible interrupt generation, slew rate control, and digital I/O capability. The SIOs on PSoC allow VOH to be set independently of VDDIO when used as outputs. When SIOs are in input mode they are high impedance. This is true even when the device is not powered or when the pin voltage goes above the supply voltage. This makes the SIO ideally suited for use on an I2C bus where the PSoC may not be powered when other devices on the bus are. The SIO pins also have high current sink capability for applications such as LED drives. The programmable input threshold feature of the SIO can be used to make the SIO function as a general purpose analog comparator. For devices with FS USB, the USB physical interface is also provided (USBIO). When not using USB, these pins may also be used for limited digital functionality and device programming. All the features of the PSoC I/Os are covered in detail in the "6.4 I/O System and Routing" section on page 26 of this data sheet. The PSoC device incorporates flexible internal clock generators, designed for high stability and factory trimmed for high accuracy. The Internal Main Oscillator (IMO) is the master clock base for the system, and has one-percent accuracy at 3 MHz. The IMO can be configured to run from 3 MHz up to 62MHz. Multiple clock derivatives can be generated from the main clock frequency to meet application needs. The device provides a PLL to generate system clock frequencies up to 67 MHz from the IMO, external crystal, or external reference clock. It also contains a separate, very low-power ILO for the sleep and watchdog timers. A 32.768 kHz external watch crystal is also supported for use in RTC applications. The clocks, together with programmable clock dividers, provide the flexibility to integrate most timing requirements.
The CY8C55 family supports a wide supply operating range from 1.71 to 5.5 V. This allows operation from regulated supplies such as 1.8 5%, 2.5 V 10%, 3.3 V 10%, or 5.0 V 10%, or directly from a wide range of battery types. In addition, it provides an integrated high efficiency synchronous boost converter that can power the device from supply voltages as low as 1.8 V. This enables the device to be powered directly from a single battery or solar cell. In addition, the designer can use the boost converter to generate other voltages required by the device, such as a 3.3 V supply for LCD glass drive. The boost's output is available on the VBOOST pin, allowing other devices in the application to be powered from the PSoC. PSoC supports a wide range of low power modes. These include a 300-nA hibernate mode with RAM retention and a 2-A sleep mode with RTC. In the second mode, the optional 32.768 kHz watch crystal runs continuously and maintains an accurate RTC. Power to all major functional blocks, including the programmable digital and analog peripherals, can be controlled independently by firmware. This allows low power background processing when some peripherals are not in use. This, in turn, provides a total device current of only 2 mA when the CPU is running at 6 MHz. The details of the PSoC power modes are covered in the "6.2 Power System" section on page 21 of this data sheet. PSoC uses a JTAG (4 wire) or SWD (2 wire) interface for programming, debug, and test. Using these standard interfaces enables the designer to debug or program the PSoC with a variety of hardware solutions from Cypress or third party vendors. The Cortex-M3 debug and trace modules include FPB, DWT, ETM, and ITM. These modules have many features to help solve difficult debug and trace problems. Details of the programming, test, and debugging interfaces are discussed in the "Programming, Debug Interfaces, Resources" section on page 55 of this data sheet.
2. Pinouts
The VDDIO pin that supplies a particular set of pins is indicated by the black lines drawn on the pinout diagrams in Figure 2-1 and Figure 2-2. Using the VDDIO pins, a single PSoC can support multiple interface voltage levels, eliminating the need for off-chip level shifters. Each VDDIO may sink up to 100 mA total to its associated I/O pins and opamps. On the 68-pin and 100-pin devices, each set of VDDIO associated pins may sink up to 100 mA. The 48 pin device may sink up to 100 mA total for all Vddio0 plus Vddio2 associated I/O pins and 100 mA total for all Vddio1 plus Vddio3 associated I/O pins.
Document Number: 001-66235 Rev. **
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PSoC(R) 5: CY8C55 Family Datasheet
Figure 2-1. 68-pin QFN Part Pinout[4]
P2[5] (GPIO, TRACEDATA[1]) Vddio2 P2[4] (GPIO, TRACEDATA[0]) P2[3] (GPIO, TRACECLK) P2[2] (GPIO) P2[1] (GPIO) P2[0] (GPIO) 68 67
66 65 64 63 62 61 60 59
58 57 56
(TRACEDATA[2], GPIO) P2[6] (TRACEDATA[3], GPIO) P2[7] (SIO) P12[4] (SIO) P12[5] Vssb Ind Vboost Vbat Vssd XRES (TMS, SWDIO) P1[0] (TCK, SWDCK) P1[1] (GPIO) P1[2] (TDO, GPIO) P1[3] (TDI, GPIO) P1[4] (GPIO) P1[5] Vddio1
55 54 53 52
P15[5] (GPOI) P15[4] (GPIO) Vddd Vssd Vccd P0[7] (GPIO, IDAC2) P0[6] (GPIO, IDAC0) P0[5] (GPIO, OpAmp2-) P0[4] (GPIO, OpAmp2+) Vddio0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
51 50 Lines show Vddio to I/O supply association 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35
QFN
(Top View)
P0[3] (GPIO, OpAmp0-/Extref0) P0[2] (GPIO, OpAmp0+) P0[1] (GPIO, OpAmp0out) P0[0] (GPIO, OpAmp2out) P12[3] (SIO) P12[2] (SIO) Vssd Vdda Vssa Vcca P15[3] (GPIO, kHz XTAL: Xi) P15[2] (GPIO, kHz XTAL: Xo) P12[1] (SIO) P12[0] (SIO) P3[7] (GPIO, OpAmp3out) P3[6] (GPIO, OpAmp1out) Vddio3
18 19 20 21 22 23 24 25 26 27 (GPIO) P1[6] (GPIO) P1[7] (SIO) P12[6] (SIO) P12[7] [3] (USBIO, D+, SWDIO) P15[6] [3] (USBIO, D-, SWDCK) P15[7] Vddd Vssd Vccd MHz XTAL: Xo
Document Number: 001-66235 Rev. **
Notes 3. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating. 4. The center pad on the QFN package should be connected to digital ground (VSSD) for best mechanical, thermal, and electrical performance. If not connected to ground, it should be electrically floated and not connected to any other signal. Page 6 of 112
MHz XTAL: Xi (IDAC1, GPIO) P3[0] (IDAC3, GPIO) P3[1] (OpAmp3-/Extref1, GPIO) P3[2] (OpAmp3+, GPIO) P3[3] (OpAmp1-, GPIO) P3[4] (OpAmp1+, GPIO) P3[5]
28 29 30 31 32 33 34
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PSoC(R) 5: CY8C55 Family Datasheet
Figure 2-2. 100-pin TQFP Part Pinout
Vddio2 P2[4] (GPIO, TRACEDATA[0]) P2[3] (GPIO, TRACECLK) P2[2] (GPIO) P2[1] (GPIO) P2[0] (GPIO) P15[5] (GPIO)
Vddio1 (GPIO) P1[6] (GPIO) P1[7] (SIO) P12[6] (SIO) P12[7] (GPIO) P5[4] (GPIO) P5[5] (GPIO) P5[6] [5] (GPIO) P5[7] [5] (USBIO, D+, SWDIO) P15[6]
(USBIO, D-, SWDCK) P15[7] Vddd Vssd Vccd NC NC (MHz XTAL: Xo, GPIO) P15[0] (MHz XTAL: Xi, GPIO) P15[1] (IDAC1, GPIO) P3[0] (IDAC3, GPIO) P3[1] (OpAmp3-/Extref1, GPIO) P3[2] (OpAmp3+, GPIO) P3[3] (OpAmp1-, GPIO) P3[4]
Figure 2-3 and Figure 2-4 on page 9 show an example schematic and an example PCB layout, for the 100-pin TQFP part, for optimal analog performance on a two-layer board.

The two pins labeled VDDD must be connected together. The two pins labeled VCCD must be connected together, with capacitance added, as shown in Figure 2-3 and 6.2 Power System on page 21. The trace between the two VCCD pins should be as short as possible. The two pins labeled VSSD must be connected together.
For information on circuit board layout issues for mixed signals, refer to the application note AN57821 - Mixed Signal Circuit Board Layout Considerations for PSoC(R) 3 and PSoC 5.
Note 5. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating.
Document Number: 001-66235 Rev. **
(OpAmp1+, GPIO) P3[5] Vddio3
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
(TRACEDATA[1], GPIO) P2[5] (TRACEDATA[2], GPIO) P2[6] (TRACEDATA[3], GPIO) P2[7] (I2C0: SCL, SIO) P12[4] (I2C0: SDA, SIO) P12[5] (GPIO) P6[4] (GPIO) P6[5] (GPIO) P6[6] (GPIO) P6[7] Vssb Ind Vboost Vbat Vssd XRES (GPIO) P5[0] (GPIO) P5[1] (GPIO) P5[2] (GPIO) P5[3] (TMS, SWDIO, GPIO) P1[0] (TCK, SWDCK, GPIO) P1[1] (configurable XRES, GPIO) P1[2] (TDO, SWV, GPIO) P1[3] (TDI, GPIO) P1[4] (nTRST, GPIO) P1[5]
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 Lines show Vddio to I/O supply association
P4[5] (GPIO) P4[4] (GPIO) P4[3] (GPIO) P4[2] (GPIO) P0[7] (GPIO, IDAC2) P0[6] (GPIO, IDAC0) P0[5] (GPIO, OpAmp2-) P0[4] (GPIO, OpAmp2+) 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 Vddio0 P0[3] (GPIO, OpAmp0-/Extref0) P0[2] (GPIO, OpAmp0+) P0[1] (GPIO, OpAmp0out) P0[0] (GPIO, OpAmp2out) P4[1] (GPIO) P4[0] (GPIO) P12[3] (SIO) P12[2] (SIO) Vssd Vdda Vssa Vcca NC NC NC NC NC NC P15[3] (GPIO, kHz XTAL: Xi) P15[2] (GPIO, kHz XTAL: Xo) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, I2C1: SCL) P3[7] (GPIO, OpAmp3out) P3[6] (GPIO, OpAmp1out)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
P15[4] (GPIO) P6[3] (GPIO) P6[2] (GPIO) P6[1] (GPIO) P6[0] (GPIO) Vddd Vssd Vccd P4[7] (GPIO) P4[6] (GPIO)
TQFP
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PSoC(R) 5: CY8C55 Family Datasheet
Figure 2-3. Example Schematic for 100-pin TQFP Part with Power Connections
Vddd Vddd
Vddd
C1 1 uF
C2 0.1 uF Vccd
C6 0.1 uF Vssd
Vddd 100 99 98 97 96 95 94 93 92 91 90 89 Vddd 88 Vssd 87 86 85 84 83 82 81 80 79 78 77 76 Vssd Vssd Vddio2 P2[4] P2[3] P2[2] P2[1] P2[0] P15[5] P15[4] P6[3] P6[2] P6[1] P6[0] Vddd Vssd Vccd P4[7] P4[6] P4[5] P4[4] P4[3] P4[2] IDAC2, P0[7] IDAC0, P0[6] OA2-, P0[5] OA2+, P0[4]
U2 CY8C55xx
Vddd 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 C8 0.1 uF Vssd Vssd Vssd Vdda Vssa Vcca C9 1 uF
Vdda
Vssd
Vssd
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 P32 47 48 49 50
Vddd
Vddio1 P1[6] P1[7] P12[6], SIO P12[7], SIO P5[4] P5[5] P5[6] P5[7] USB D+, P15[6] USB D-, P15[7] Vddd Vssd Vccd NC NC P15[0], MHzXout P15[1], MHzXin P3[0], IDAC1 P3[1], IDAC3 P3[2], OA3-, REF1 P3[3], OA3+ P3[4], OA1P3[5], OA1+ Vddio3
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
P2[5] P2[6] P2[7] P12[4], SIO P12[5], SIO P6[4] P6[5] P6[6] P6[7] Vssb Ind Vboost Vbat Vssd XRES P5[0] P5[1] P5[2] P5[3] P1[0], SWIO, TMS P1[1], SWDIO, TCK P1[2] P1[3], SWV, TDO P1[4], TDI P1[5], nTRST
Vddio0 OA0-, REF0, P0[3] OA0+, P0[2] OA0out, P0[1] OA2out, P0[0] P4[1] P4[0] SIO, P12[3] SIO, P12[2] Vssd Vdda Vssa Vcca NC NC NC NC NC NC kHzXin, P15[3] kHzXout, P15[2] SIO, P12[1] SIO, P12[0] OA3out, P3[7] OA1out, P3[6]
C17 1 uF
Vssa Vdda
C10 0.1 uF
Vssa
Vddd C11 0.1 uF C14 0.1 uF Vssd
Vssd
Vddd
Vccd
C12 0.1 uF Vssd C16 0.1 uF
C13 10 uF, 6.3 V Vssa
C15 1 uF
Vssa
Vssd
Note The two VCCD pins must be connected together with as short a trace as possible. A trace under the device is recommended, as shown in Figure 2-4.
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Figure 2-4. Example PCB Layout for 100-pin TQFP Part for Optimal Analog Performance
Vssa Vddd Vssd Vdda
Vssd Plane
Vssa Plane
3. Pin Descriptions
IDAC0, IDAC1, IDAC2, IDAC3. Low-resistance output pin for high-current DACs (IDAC). OpAmp0out, OpAmp1out, OpAmp2out, OpAmp3out. High current output of uncommitted opamp.[6] Extref0, Extref1. External reference input to the analog system. OpAmp0-, OpAmp1-, OpAmp2-, OpAmp3-. Inverting input to uncommitted opamp. OpAmp0+, OpAmp1+, OpAmp2+, OpAmp3+. Noninverting input to uncommitted opamp. GPIO. Provides interfaces to the CPU, digital peripherals, analog peripherals, interrupts, LCD segment drive, and CapSense.[6] Ind. Inductor connection to boost pump. kHz XTAL: Xo, kHz XTAL: Xi. 32.768 KHz crystal oscillator pin. MHz XTAL: Xo, MHz XTAL: Xi. 4 to 25 MHz crystal oscillator pin. If a crystal is not used, then Xi must be shorted to ground and Xo must be left floating. nTRST. Optional JTAG Test Reset programming and debug port connection to reset the JTAG connection. SIO. Provides interfaces to the CPU, digital peripherals and interrupts with a programmable high threshold voltage, analog comparator, high sink current, and high impedance state when the device is unpowered. SWDCK. SWD Clock programming and debug port connection. SWDIO. SWD Input and Output programming and debug port connection.
Notes 6. GPIOs with opamp outputs are not recommended for use with CapSense.
TCK. JTAG Test Clock programming and debug port connection. TDI. JTAG Test Data In programming and debug port connection. TDO. JTAG Test Data Out programming and debug port connection. TMS. JTAG Test Mode Select programming and debug port connection. TRACECLK. Cortex-M3 TRACEPORT connection, clocks TRACEDATA pins. TRACEDATA[3:0]. Cortex-M3 TRACEPORT connections, output data. SWV. SWV output. USBIO, D+. Provides D+ connection directly to a USB 2.0 bus. May be used as a digital I/O pin; it is powered from VDDD instead of from a VDDIO. Pins are Do Not Use (DNU) on devices without USB. USBIO, D-. Provides D- connection directly to a USB 2.0 bus. May be used as a digital I/O pin; it is powered from VDDD instead of from a VDDIO. Pins are Do Not Use (DNU) on devices without USB. VBOOST. Power sense connection to boost pump. VBAT. Battery supply to boost pump. VCCA. Output of analog core regulator and input to analog core. Requires a 1 F capacitor to VSSA. Regulator output not for external use. VCCD. Output of digital core regulator and input to digital core. The two VCCD pins must be shorted together, with the trace between them as short as possible, and a 1 F capacitor to VSSD;
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see 6.2 Power System on page 21. Regulator output not for external use. VDDA. Supply for all analog peripherals and analog core regulator. VDDA must be the highest voltage present on the device. All other supply pins must be less than or equal to VDDA. VDDD. Supply for all digital peripherals and digital core regulator. VDDD must be less than or equal to VDDA. VSSA. Ground for all analog peripherals. VSSB. Ground connection for boost pump. VSSD. Ground for all digital logic and I/O pins. VDDIO0, VDDIO1, VDDIO2, VDDIO3. Supply for I/O pins. Each VDDIO must be tied to a valid operating voltage (1.71 V to 5.5 V),
and must be less than or equal to VDDA. If the I/O pins associated with VDDIO0, VDDIO2 or VDDIO3 are not used then that VDDIO should be tied to ground (VSSD or VSSA). XRES. External reset pin. Active low with internal pull-up.
4. CPU
4.1 ARM Cortex-M3 CPU
The CY8C55 family of devices has an ARM Cortex-M3 CPU core. The Cortex-M3 is a low-power 32-bit three-stage pipelined Harvard-architecture CPU that delivers 1.25 DMIPS/MHz. It is intended for deeply embedded applications that require fast interrupt handling features.
Figure 4-1. ARM Cortex-M3 Block Diagram
Interrupt Inputs
Nested Vectored Interrupt Controller (NVIC)
I- Bus D-Bus
Cortex M3 CPU Core
Data Watchpoint and Trace (DWT)
Embedded Trace Module (ETM)
S-Bus
Instrumentation Trace Module (ITM) Trace Port 5 for TRACEPORT or Interface Unit 1 for SWV mode (TPIU)
Trace Pins:
JTAG, SWD
Debug Block (JTAG and SWD)
C-Bus AHB AHB
Flash Patch and Breakpoint (FPB)
Cortex M3 Wrapper
32 KB SRAM
Bus Matrix
Bus Matrix
Cache
256 KB Flash
AHB
32 KB SRAM
Bus Matrix
AHB Bridge & Bus Matrix
PHUB
DMA
AHB Spokes Prog. Digital Prog. Analog Special Functions
GPIO
Peripherals
The Cortex-M3 CPU subsystem includes these features:
ARM Cortex-M3 CPU
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Programmable nested vectored interrupt controller (NVIC), tightly integrated with the CPU core Full featured debug and trace module, tightly integrated with the CPU core Up to 256 KB of flash memory, 2 KB of EEPROM, and 64 KB of SRAM Cache controller Peripheral HUB (PHUB) DMA controller
The processor runs in the handler mode (always at the privileged level) when handling an exception, and in the thread mode when not. 4.1.3 CPU Registers The Cortex-M3 CPU registers are listed in Table 4-2. Registers R0-R15 are all 32 bits wide. Table 4-2. Cortex M3 CPU Registers Register R0-R12 Description General purpose registers R0-R12 have no special architecturally defined uses. Most instructions that specify a general purpose register specify R0-R12.
4.1.1 Cortex-M3 Features The Cortex-M3 CPU features include:
4 GB address space. Predefined address regions for code, data, and peripherals. Multiple buses for efficient and simultaneous accesses of instructions, data, and peripherals. The Thumb(R)-2 instruction set, which offers ARM-level performance at Thumb-level code density. This includes 16-bit and 32-bit instructions. Advanced instructions include: Bit-field control Hardware multiply and divide Saturation If-Then Wait for events and interrupts Exclusive access and barrier Special register access The Cortex-M3 does not support ARM instructions. Bit-band support. Atomic bit-level write and read operations. Unaligned data storage and access. Contiguous storage of data of different byte lengths. Operation at two privilege levels (privileged and user) and in two modes (thread and handler). Some instructions can only be executed at the privileged level. There are also two stack pointers: Main (MSP) and Process (PSP). These features support a multitasking operating system running one or more user-level processes. Extensive interrupt and system exception support.
Low registers: Registers R0-R7 are accessible by all instructions that specify a general purpose register.
R13

R14 R15
xPSR
High registers: Registers R8-R12 are accessible by all 32-bit instructions that specify a general purpose register; they are not accessible by all 16-bit instructions. R13 is the stack pointer register. It is a banked register that switches between two 32-bit stack pointers: the main stack pointer (MSP) and the process stack pointer (PSP). The PSP is used only when the CPU operates at the user level in thread mode. The MSP is used in all other privilege levels and modes. Bits[0:1] of the SP are ignored and considered to be 0, so the SP is always aligned to a word (4 byte) boundary. R14 is the link register (LR). The LR stores the return address when a subroutine is called. R15 is the program counter (PC). Bit 0 of the PC is ignored and considered to be 0, so instructions are always aligned to a half word (2 byte) boundary. The program status registers are divided into three status registers, which are accessed either together or separately:

4.1.2 Cortex-M3 Operating Modes The Cortex-M3 operates at either the privileged level or the user level, and in either the thread mode or the handler mode. Because the handler mode is only enabled at the privileged level, there are actually only three states, as shown in Table 4-1. Table 4-1. Operational Level Condition Privileged User Not used Thread mode Running an exception Handler mode Running main program Thread mode

Application program status register (APSR) holds program execution status bits such as zero, carry, negative, in bits[27:31]. Interrupt program status register (IPSR) holds the current exception number in bits[0:8].
At the user level, access to certain instructions, special registers, configuration registers, and debugging components is blocked. Attempts to access them cause a fault exception. At the privileged level, access to all instructions and registers is allowed.
Execution program status register (EPSR) holds control bits for interrupt continuable and IF-THEN instructions in bits[10:15] and [25:26]. Bit 24 is always set to 1 to indicate Thumb mode. Trying to clear it causes a fault exception. PRIMASK A 1-bit interrupt mask register. When set, it allows only the nonmaskable interrupt (NMI) and hard fault exception. All other exceptions and interrupts are masked. FAULTMASK A 1-bit interrupt mask register. When set, it allows only the NMI. All other exceptions and interrupts are masked.
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Table 4-2. Cortex M3 CPU Registers (continued) Register BASEPRI Description A register of up to nine bits that define the masking priority level. When set, it disables all interrupts of the same or higher priority value. If set to 0 then the masking function is disabled. A 2-bit register for controlling the operating mode. Bit 0: 0 = privileged level in thread mode, 1 = user level in thread mode. Bit 1: 0 = default stack (MSP) is used, 1 = alternate stack is used. If in thread mode or user level then the alternate stack is the PSP. There is no alternate stack for handler mode; the bit must be 0 while in handler mode. Table 4-3. PHUB Spokes and Peripherals PHUB Spokes 0 1 2 SRAM IOs, PICU PHUB local configuration, Power manager, Clocks, IC, EEPROM, Flash programming interface Analog interface and trim, Decimator USB, CAN, I2C, Timers, Counters, and PWMs DFB UDBs group 1 UDBs group 2 Peripherals
CONTROL
3 4 5 6 7
4.2 Cache Controller
The CY8C55 family has a 1 KB instruction cache between the CPU and the flash memory. This improves instruction execution rate and reduces system power consumption by requiring less frequent flash access.
4.3.2 DMA Features

24 DMA channels Each channel has one or more transaction descriptors (TDs) to configure channel behavior. Up to 127 total TDs can be defined TDs can be dynamically updated Eight levels of priority per channel Any digitally routable signal, the CPU, or another DMA channel, can trigger a transaction Each channel can generate up to two interrupts per transfer Transactions can be stalled or canceled Supports transaction size of infinite or 1 to 64k bytes Large transactions may be broken into smaller bursts of 1 to 127 bytes TDs may be nested and/or chained for complex transactions
4.3 DMA and PHUB
The PHUB and the DMA controller are responsible for data transfer between the CPU and peripherals, and also data transfers between peripherals. The PHUB and DMA also control device configuration during boot. The PHUB consists of:

A central hub that includes the DMA controller, arbiter, and router Multiple spokes that radiate outward from the hub to most peripherals
There are two PHUB masters: the CPU and the DMA controller. Both masters may initiate transactions on the bus. The DMA channels can handle peripheral communication without CPU intervention. The arbiter in the central hub determines which DMA channel is the highest priority if there are multiple requests. 4.3.1 PHUB Features

4.3.3 Priority Levels The CPU always has higher priority than the DMA controller when their accesses require the same bus resources. Due to the system architecture, the CPU can never starve the DMA. DMA channels of higher priority (lower priority number) may interrupt current DMA transfers. In the case of an interrupt, the current transfer is allowed to complete its current transaction. To ensure latency limits when multiple DMA accesses are requested simultaneously, a fairness algorithm guarantees an interleaved minimum percentage of bus bandwidth for priority levels 2 through 7. Priority levels 0 and 1 do not take part in the fairness algorithm and may use 100% of the bus bandwidth. If a tie occurs on two DMA requests of the same priority level, a simple round robin method is used to evenly share the allocated bandwidth. The round robin allocation can be disabled for each DMA channel, allowing it to always be at the head of the line. Priority levels 2 to 7 are guaranteed the minimum bus bandwidth shown in Table 4-4 after the CPU and DMA priority levels 0 and 1 have satisfied their requirements. When the fairness algorithm is disabled, DMA access is granted based solely on the priority level; no bus bandwidth guarantees are made.
CPU and DMA controller are both bus masters to the PHUB Eight Multi-layer AHB Bus parallel access paths (spokes) for peripheral access Simultaneous CPU and DMA access to peripherals located on different spokes Simultaneous DMA source and destination burst transactions on different spokes Supports 8-, 16-, 24-, and 32-bit addressing and data
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Table 4-4. Priority Levels Priority Level 0 1 2 3 4 5 6 7 % Bus Bandwidth 100.0 100.0 50.0 25.0 12.5 6.2 3.1 1.5
4.3.4 Transaction Modes Supported The flexible configuration of each DMA channel and the ability to chain multiple channels allow the creation of both simple and complex use cases. General use cases include, but are not limited to: 4.3.4.1 Simple DMA In a simple DMA case, a single TD transfers data between a source and sink (peripherals or memory location). The basic timing diagrams of DMA read and write cycles are shown in Figure 4-5. For more description on other transfer modes, refer to the Technical Reference Manual. Figure 4-5. DMA Timing Diagram
ADDRESS Phase CLK
DATA Phase CLK
ADDRESS Phase
DATA Phase
ADDR 16/32
A
B
ADDR 16/32
A
B
WRITE
WRITE
DATA
DATA (A)
DATA
DATA (A)
READY Basic DMA Read Transfer without wait states
READY Basic DMA Write Transfer without wait states
4.3.4.2 Auto Repeat DMA Auto repeat DMA is typically used when a static pattern is repetitively read from system memory and written to a peripheral. This is done with a single TD that chains to itself. 4.3.4.3 Ping Pong DMA A ping pong DMA case uses double buffering to allow one buffer to be filled by one client while another client is consuming the data previously received in the other buffer. In its simplest form, this is done by chaining two TDs together so that each TD calls the opposite TD when complete. 4.3.4.4 Circular DMA Circular DMA is similar to ping pong DMA except it contains more than two buffers. In this case there are multiple TDs; after the last TD is complete it chains back to the first TD. 4.3.4.5 Indexed DMA In an indexed DMA case, an external master requires access to locations on the system bus as if those locations were shared memory. As an example, a peripheral may be configured as an SPI or I2C slave where an address is received by the external master. That address becomes an index or offset into the internal system bus memory space. This is accomplished with an initial "address fetch" TD that reads the target address location from the peripheral and writes that value into a subsequent TD in the chain. This modifies the TD chain on the fly. When the "address fetch" TD completes it moves on to the next TD, which has the new address information embedded in it. This TD then carries out the data transfer with the address location required by the external master.
4.3.4.6 Scatter Gather DMA In the case of scatter gather DMA, there are multiple noncontiguous sources or destinations that are required to effectively carry out an overall DMA transaction. For example, a packet may need to be transmitted off of the device and the packet elements, including the header, payload, and trailer, exist in various noncontiguous locations in memory. Scatter gather DMA allows the segments to be concatenated together by using multiple TDs in a chain. The chain gathers the data from the multiple locations. A similar concept applies for the reception of data onto the device. Certain parts of the received data may need to be scattered to various locations in memory for software processing convenience. Each TD in the chain specifies the location for each discrete element in the chain. 4.3.4.7 Packet Queuing DMA Packet queuing DMA is similar to scatter gather DMA but specifically refers to packet protocols. With these protocols, there may be separate configuration, data, and status phases associated with sending or receiving a packet. For instance, to transmit a packet, a memory mapped configuration register can be written inside a peripheral, specifying the overall length of the ensuing data phase. The CPU can set up this configuration information anywhere in system memory and copy it with a simple TD to the peripheral. After the configuration phase, a data phase TD (or a series of data phase TDs) can begin (potentially using scatter gather). When the data phase TD(s) finish, a status phase TD can be invoked that reads some memory mapped status information from the peripheral and copies it to a location in system memory specified by the CPU for later inspection. Multiple sets of configuration, data, and
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status phase "subchains" can be strung together to create larger chains that transmit multiple packets in this way. A similar concept exists in the opposite direction to receive the packets. 4.3.4.8 Nested DMA One TD may modify another TD, as the TD configuration space is memory mapped similar to any other peripheral. For example, a first TD loads a second TD's configuration and then calls the Table 4-6. Cortex-M3 Exceptions and Interrupts Exception Number 1 2 3 Exception Type Reset NMI Hard fault Priority -3 (highest) -2 -1
second TD. The second TD moves data as required by the application. When complete, the second TD calls the first TD, which again updates the second TD's configuration. This process repeats as often as necessary.
4.4 Interrupt Controller
The Cortex-M3 NVIC supports 16 system exceptions and 32 interrupts from peripherals, as shown in Table 4-6.
Exception Table Address Offset 0x00 0x04 0x08 0x0C Reset
Function Starting value of R13 / MSP Non maskable interrupt All classes of fault, when the corresponding fault handler cannot be activated because it is currently disabled or masked Memory management fault, for example, instruction fetch from a nonexecutable region Error response received from the bus system; caused by an instruction prefetch abort or data access error Typically caused by invalid instructions or trying to switch to ARM mode Reserved System service call via SVC instruction Debug monitor Reserved Deferred request for system service System tick timer Peripheral interrupt request #0 - #31
4 5 6 7 - 10 11 12 13 14 15 16 - 47
MemManage Bus fault Usage fault SVC Debug monitor PendSV SYSTICK IRQ
Programmable Programmable Programmable Programmable Programmable Programmable Programmable Programmable
0x10 0x14 0x18 0x1C - 0x28 0x2C 0x30 0x34 0x38 0x3C 0x40 - 0x3FC
Bit 0 of each exception vector indicates whether the exception is executed using ARM or Thumb instructions. Because the Cortex-M3 only supports Thumb instructions, this bit must always be 1. The Cortex-M3 non maskable interrupt (NMI) input can be routed to any pin, via the DSI, or disconnected from all pins. See "DSI Routing Interface Description" section on page 39. The Nested Vectored Interrupt Controller (NVIC) handles interrupts from the peripherals, and passes the interrupt vectors to the CPU. It is closely integrated with the CPU for low latency interrupt handling. Features include:

Support for tail-chaining, and late arrival, of interrupts. This enables back-to-back interrupt processing without the overhead of state saving and restoration between interrupts. Processor state automatically saved on interrupt entry, and restored on interrupt exit, with no instruction overhead.
32 interrupts. Multiple sources for each interrupt. Configurable number of priority levels: from 3 to 8. Dynamic reprioritization of interrupts. Priority grouping. This allows selection of preempting and non preempting interrupt levels.
If the same priority level is assigned to two or more interrupts, the interrupt with the lower vector number is executed first. Each interrupt vector may choose from three interrupt sources: Fixed Function, DMA, and UDB. The fixed function interrupts are direct connections to the most common interrupt sources and provide the lowest resource cost connection. The DMA interrupt sources provide direct connections to the two DMA interrupt sources provided per DMA channel. The third interrupt source for vectors is from the UDB digital routing array. This allows any digital signal available to the UDB array to be used as an interrupt source. All interrupt sources may be routed to any interrupt vector using the UDB interrupt source connections.
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Table 4-7. Interrupt Vector Table Interrupt # 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 Cortex-M3 Exception # Fixed Function Low voltage detect (LVD) Cache Reserved Sleep (Pwr Mgr) PICU[0] PICU[1] PICU[2] PICU[3] PICU[4] PICU[5] PICU[6] PICU[12] PICU[15] Comparators Combined Switched Caps Combined I2C CAN Timer/Counter0 Timer/Counter1 Timer/Counter2 Timer/Counter3 USB SOF Int USB Arb Int USB Bus Int USB Endpoint[0] USB Endpoint Data Reserved Reserved DFB Int Decimator Int phub_err_int eeprom_fault_int DMA phub_termout0[0] phub_termout0[1] phub_termout0[2] phub_termout0[3] phub_termout0[4] phub_termout0[5] phub_termout0[6] phub_termout0[7] phub_termout0[8] phub_termout0[9] phub_termout0[10] phub_termout0[11] phub_termout0[12] phub_termout0[13] phub_termout0[14] phub_termout0[15] phub_termout1[0] phub_termout1[1] phub_termout1[2] phub_termout1[3] phub_termout1[4] phub_termout1[5] phub_termout1[6] phub_termout1[7] phub_termout1[8] phub_termout1[9] phub_termout1[10] phub_termout1[11] phub_termout1[12] phub_termout1[13] phub_termout1[14] phub_termout1[15] UDB udb_intr[0] udb_intr[1] udb_intr[2] udb_intr[3] udb_intr[4] udb_intr[5] udb_intr[6] udb_intr[7] udb_intr[8] udb_intr[9] udb_intr[10] udb_intr[11] udb_intr[12] udb_intr[13] udb_intr[14] udb_intr[15] udb_intr[16] udb_intr[17] udb_intr[18] udb_intr[19] udb_intr[20] udb_intr[21] udb_intr[22] udb_intr[23] udb_intr[24] udb_intr[25] udb_intr[26] udb_intr[27] udb_intr[28] udb_intr[29] udb_intr[30] udb_intr[31]
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5. Memory
5.1 Static RAM
CY8C55 static RAM (SRAM) is used for temporary data storage. Code can be executed at full speed from the portion of SRAM that is located in the code space. This process is slower from SRAM above 0x20000000. The device provides up to 64 KB of SRAM. The CPU or the DMA controller can access all of SRAM. The SRAM can be accessed simultaneously by the Cortex-M3 CPU and the DMA controller if accessing different 32-KB blocks.
how to take full advantage of the security features in PSoC, see the PSoC 5 TRM. Table 5-1. Flash Protection Protection Setting Unprotected Factory Upgrade Allowed External read and write - + internal read and write External write + internal read and write External read External read and write External read and write + internal write Not Allowed
5.2 Flash Program Memory
Flash memory in PSoC devices provides nonvolatile storage for user firmware, user configuration data and bulk data storage. The main flash memory area contains up to 256 KB of user program space. Up to an additional 32 KB of flash space is available for storing device configuration data and bulk user data. User code may not be run out of this flash memory section. The flash output is 9 bytes wide with 8 bytes of data and 1 additional byte. The CPU or DMA controller read both user code and bulk data located in flash through the cache controller. This provides higher CPU performance. Flash programming is performed through a special interface and preempts code execution out of flash. Code execution out of cache may continue during flash programming as long as that code is contained inside the cache. The flash programming interface performs flash erasing, programming and setting code protection levels. Flash In System Serial Programming (ISSP), typically used for production programming, is possible through the JTAG and SWD interfaces. In-system programming, typically used for bootloaders, is also possible using serial interfaces such as I2C, USB, UART, and SPI, or any communications protocol.
Field Upgrade Internal read and write Full Protection Internal read Disclaimer
5.3 Flash Security
All PSoC devices include a flexible flash protection model that prevents access and visibility to on-chip flash memory. This prevents duplication or reverse engineering of proprietary code. Flash memory is organized in blocks, where each block contains 256 bytes of program or data and 32 bytes of configuration or general-purpose data. The device offers the ability to assign one of four protection levels to each row of flash. Table 5-1 lists the protection modes available. Flash protection levels can only be changed by performing a complete flash erase. The Full Protection and Field Upgrade settings disable external access (through a debugging tool such as PSoC Creator, for example). If your application requires code update through a boot loader, then use the Field Upgrade setting. Use the Unprotected setting only when no security is needed in your application. The PSoC device also offers an advanced security feature called Device Security which permanently disables all test, programming, and debug ports, protecting your application from external access (see the "Device Security" section on page 56). For more information on
Note the following details of the flash code protection features on Cypress devices. Cypress products meet the specifications contained in their particular Cypress datasheets. Cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Cypress is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress are committed to continuously improving the code protection features of our products.
5.4 EEPROM
PSoC EEPROM memory is a byte addressable nonvolatile memory. The CY8C55 has 2 KB of EEPROM memory to store user data. Reads from EEPROM are random access at the byte level. Reads are done directly; writes are done by sending write commands to an EEPROM programming interface. CPU code execution can continue from flash during EEPROM writes. EEPROM is erasable and writeable at the row level. The EEPROM is divided into two sections, each containing 64 rows of 16 bytes each. The CPU cannot execute out of EEPROM.
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5.5 Memory Map
The Cortex-M3 has a fixed address map, which allows peripherals to be accessed by simple memory access instructions. 5.5.1 Address Map The 4-GB address space is divided into the ranges shown in Table 5-2: Table 5-2. Address Map
Address Range 0x00000000 - 0x1FFFFFFF 0x20000000 - 0x3FFFFFFF Size 0.5 GB Use Program code. This includes the exception vector table at power up, which starts at address 0. Static RAM. This includes a 1 MByte bit-band region starting at 0x20000000 and a 32 Mbyte bit-band alias region starting at 0x22000000. Peripherals. This includes a 1 MByte bit-band region starting at 0x40000000 and a 32 Mbyte bit-band alias region starting at 0x42000000. External RAM. External peripherals. Internal peripherals, including the NVIC and debug and trace modules.
Table 5-3. Peripheral Data Address Map (continued) Address Range 0x40004900 - 0x400049FF I2C 0x40004E00 - 0x40004EFF Decimator 0x40004F00 - 0x40004FFF Fixed timer/counter/PWMs 0x40005000 - 0x400051FF I/O ports control 0x40005800 - 0x40005FFF Analog Subsystem Interface 0x40006000 - 0x400060FF USB Controller 0x40006400 - 0x40006FFF UDB Configuration 0x40007000 - 0x40007FFF PHUB Configuration 0x40008000 - 0x400087FF EEPROM 0x4000A000 - 0x4000A400 CAN 0x4000C000 - 0x4000C800 Digital Filter Block 0x40010000 - 0x4001FFFF Digital Interconnect Configuration 0xE0000000 - 0xE00FFFFF Cortex-M3 PPB Registers, including NVIC, debug, and trace The bit-band feature allows individual bits in words in the bit-band region to be read or written as atomic operations. This is done by reading or writing bit 0 of corresponding words in the bit-band alias region. For example, to set bit 3 in the word at address 0x20000000, write a 1 to address 0x2200000C. To test the value of that bit, read address 0x2200000C and the result is either 0 or 1 depending on the value of the bit. Most memory accesses done by the Cortex-M3 are aligned, that is, done on word (4-byte) boundary addresses. Unaligned accesses of words and 16-bit half-words on nonword boundary addresses can also be done, although they are less efficient. 5.5.2 Address Map and Cortex-M3 Buses The ICode and DCode buses are used only for accesses within the Code address range, 0 - 0x1FFFFFFF. The System bus is used for data accesses and debug accesses within the ranges 0x20000000 - 0xDFFFFFFF and 0xE0100000 - 0xFFFFFFFF. Instruction fetches can also be done within the range 0x20000000 - 0x3FFFFFFF, although these can be slower than instruction fetches via the ICode bus. The private peripheral bus (PPB) is used within the Cortex-M3 to access system control registers and debug and trace module registers. Purpose controller
0.5 GB
0x40000000 - 0x5FFFFFFF
0.5 GB
0x60000000 - 0x9FFFFFFF 0xA0000000 - 0xDFFFFFFF 0xE0000000 - 0xFFFFFFFF
1 GB 1 GB 0.5 GB
Table 5-3. Peripheral Data Address Map Address Range Purpose 0x00000000 - 0x0003FFFF 256 KB flash 0x1FFF8000 - 0x1FFFFFFF 32 KB SRAM in Code region 0x20000000 - 0x20007FFF 32 KB SRAM in SRAM region 0x40004000 - 0x400042FF Clocking, PLLs, and oscillators 0x40004300 - 0x400043FF Power management 0x40004500 - 0x400045FF Ports interrupt control 0x40004700 - 0x400047FF Flash programming interface 0x40004800 - 0x400048FF Cache controller
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6. System Integration
6.1 Clocking System
The clocking system generates, divides, and distributes clocks throughout the PSoC system. For the majority of systems, no external crystal is required. The IMO and PLL together can generate up to a 67 MHz clock, accurate to 4% over voltage and temperature. Additional internal and external clock sources allow each design to optimize accuracy, power, and cost. All of the system clock sources can be used to generate other clock frequencies in the 16-bit clock dividers and UDBs for anything you want, for example a UART baud rate generator. Clock generation and distribution is automatically configured through the PSoC Creator IDE graphical interface. This is based on the complete system's requirements. It greatly speeds the design process. PSoC Creator allows designers to build clocking systems with minimal input. The designer can specify desired clock frequencies and accuracies, and the software locates or builds a clock that meets the required specifications. This is possible because of the programmability inherent PSoC.
Key features of the clocking system include:
Seven general purpose clock sources 3 to 62 MHz IMO, 4% at 3 MHz 4- to 25 MHz external crystal oscillator (MHzECO) Clock doubler provides a doubled clock frequency output for the USB block, see USB Clock Domain on page 21. DSI signal from an external I/O pin or other logic 24 to 67 MHz fractional phase-locked loop (PLL) sourced from IMO, MHzECO, or DSI Clock Doubler 1 KHz, 33 KHz, 100 KHz ILO for watchdog timer (WDT) and Sleep Timer 32.768 KHz external crystal oscillator (ECO) for RTC Independently sourced clock dividers in all clocks Eight 16-bit clock dividers for the digital system Four 16-bit clock dividers for the analog system Dedicated 16-bit divider for the CPU bus and CPU clock Automatic clock configuration in PSoC Creator

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Table 6-1. Oscillator Summary Source IMO MHzECO DSI PLL Doubler ILO kHzECO Fmin 3 MHz 4 MHz 0 MHz 24 MHz 12 MHz 1 kHz 32 kHz Tolerance at Fmin 4% over voltage and temperature Crystal dependent Input dependent Input dependent Input dependent -50%, +100% Crystal dependent Fmax 62 MHz 25 MHz 66 MHz 67 MHz 48 MHz 100 kHz 32 kHz Tolerance at Fmax 10% Crystal dependent Input dependent Input dependent Input dependent -55%, +100% Crystal dependent Startup Time 10 s max 5 ms typ, max is crystal dependent Input dependent 250 s max 1 s max 15 ms max in lowest power mode 500 ms typ, max is crystal dependent
Figure 6-1. Clocking Subsystem
3-24 MHz IMO 4-25 MHz ECO External IO or DSI 0-40 MHz 32 kHz ECO 1,33,100 kHz ILO
12-48 MHz Doubler
CPU Clock
24-40 MHz PLL
System Clock Mux Bus Clock Divider 16 bit
s k e w s k e w s k e w s k e w
Bus Clock
Digital Clock Divider 16 bit
Digital Clock Divider 16 bit
Analog Clock Divider 16 bit
Digital Clock Divider 16 bit 7
Digital Clock Divider 16 bit 7
Analog Clock Divider 16 bit
Digital Clock Divider 16 bit
Digital Clock Divider 16 bit
Analog Clock Divider 16 bit
Digital Clock Divider 16 bit
Digital Clock Divider 16 bit
Analog Clock Divider 16 bit
6.1.1 Internal Oscillators 6.1.1.1 Internal Main Oscillator In most designs the IMO is the only clock source required, due to its 4% accuracy. The IMO operates with no external components and outputs a stable clock. A factory trim for each frequency range is stored in the device. With the factory trim, tolerance varies from 4% at 3 MHz, up to 10% at 62 MHz. The IMO, in conjunction with the PLL, allows generation of CPU and system clocks up to the device's maximum frequency (see USB Clock Domain on page 21). The IMO provides clock outputs at 3, 6, 12, 24, 48, and 62 MHz.
6.1.1.2 Clock Doubler The clock doubler outputs a clock at twice the frequency of the input clock. The doubler works for input frequency ranges of 6 to 24 MHz (providing 12 to 48 MHz at the output). It can be configured to use a clock from the IMO, MHzECO, or the DSI (external pin). The doubler is typically used to clock the USB. 6.1.1.3 Phase-Locked Loop The PLL allows low frequency, high accuracy clocks to be multiplied to higher frequencies. This is a tradeoff between higher clock frequency and accuracy and, higher power consumption and increased startup time.
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The PLL block provides a mechanism for generating clock frequencies based upon a variety of input sources. The PLL outputs clock frequencies in the range of 24 to 67 MHz. Its input and feedback dividers supply 4032 discrete ratios to create almost any desired system clock frequency. The accuracy of the PLL output depends on the accuracy of the PLL input source. The most common PLL use is to multiply the IMO clock at 3 MHz, where it is most accurate, to generate the CPU and system clocks up to the device's maximum frequency. The PLL achieves phase lock within 250 s (verified by bit setting). It can be configured to use a clock from the IMO, MHzECO, or DSI (external pin). The PLL clock source can be used until lock is complete and signaled with a lock bit. The lock signal can be routed through the DSI to generate an interrupt. Disable the PLL before entering low power modes. 6.1.1.4 Internal Low-Speed Oscillator The ILO provides clock frequencies for low power consumption, including the watchdog timer, and sleep timer. The ILO generates up to three different clocks: 1 kHz, 33 kHz, and 100 kHz. The 1 KHz clock (CLK1K) is typically used for a background `heartbeat' timer. This clock inherently lends itself to low power supervisory operations such as the watchdog timer and long sleep intervals using the central timewheel (CTW). The central timewheel is a 1 kHz, free running, 13-bit counter clocked by the ILO. The central timewheel is always enabled except in hibernate mode and when the CPU is stopped during debug on chip mode. It can be used to generate periodic interrupts for timing purposes or to wake the system from a low power mode. Firmware can reset the central timewheel. The central timewheel can be programmed to wake the system periodically and optionally issue an interrupt. This enables flexible, periodic wakeups from low power modes or coarse timing applications. Systems that require accurate timing should use the RTC capability instead of the central timewheel. The 100 KHz clock (CLK100K) works as a low power system clock to run the CPU. It can also generate time intervals such as fast sleep intervals using the fast timewheel. The fast timewheel is a 100 KHz, 5-bit counter clocked by the ILO that can also be used to wake the system. The fast timewheel settings are programmable, and the counter automatically resets when the terminal count is reached. This enables flexible, periodic wakeups of the CPU at a higher rate than is allowed using the central timewheel. The fast timewheel can generate an optional interrupt each time the terminal count is reached. The 33 KHz clock (CLK33K) comes from a divide-by-3 operation on CLK100K. This output can be used as a reduced accuracy version of the 32.768 KHz ECO clock with no need for a crystal. 6.1.2 Internal Oscillators 6.1.2.1 MHz External Crystal Oscillator The MHzECO provides high frequency, high precision clocking using an external crystal (see Figure 6-2). It supports a wide variety of crystal types, in the range of 4 to 25 MHz. When used in conjunction with the PLL, it can generate CPU and system clocks up to the device's maximum frequency (see Phase-Locked Loop on page 19). The GPIO pins connecting to the external crystal and capacitors are fixed. If a crystal is not
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used then Xi must be shorted to ground and Xo must be left floating. MHzECO accuracy depends on the crystal chosen. Figure 6-2. MHzECO Block Diagram
4 - 25 MHz Crystal Osc
XCLK_ MHZ
Xi
Xo 4 - 25 MHz crystal Capacitors
External Components
6.1.2.2 32.768 kHz ECO The 32.768 KHz external crystal oscillator (32kHzECO) provides precision timing with minimal power consumption using an external 32.768 KHz watch crystal (see Figure 6-3). The 32kHzECO also connects directly to the sleep timer and provides the source for the RTC. The RTC uses a 1 second interrupt to implement the RTC functionality in firmware. The oscillator works in two distinct power modes. This allows users to trade off power consumption with noise immunity from neighboring circuits. The GPIO pins connected to the external crystal and capacitors are fixed. Figure 6-3. 32kHzECO Block Diagram
XCLK32K
32 kHz Crystal Osc
Xi (Pin P15[3]) External Components
Xo (Pin P15[2]) 32 kHz crystal Capacitors
6.1.2.3 Digital System Interconnect The DSI provides routing for clocks taken from external clock oscillators connected to I/O. The oscillators can also be generated within the device in the digital system and UDBs. While the primary DSI clock input provides access to all clocking resources, up to eight other DSI clocks (internally or externally
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generated) may be routed directly to the eight digital clock dividers. This is only possible if there are multiple precision clock sources. 6.1.3 Clock Distribution All seven clock sources are inputs to the central clock distribution system. The distribution system is designed to create multiple high precision clocks. These clocks are customized for the design's requirements and eliminate the common problems found with limited resolution prescalers attached to peripherals. The clock distribution system generates several types of clock trees.
6.1.4 USB Clock Domain The USB clock domain is unique in that it operates largely asynchronously from the main clock network. The USB logic contains a synchronous bus interface to the chip, while running on an asynchronous clock to process USB data. The USB logic requires a 48 MHz frequency. This frequency can be generated from different sources, including DSI clock at 48 MHz or doubled value of 24 MHz from internal oscillator, DSI signal, or crystal oscillator.
6.2 Power System
The power system consists of separate analog, digital, and I/O supply pins, labeled VDDA, VDDD, and VDDIOX, respectively. It also includes two internal 1.8 V regulators that provide the digital (VCCD) and analog (VCCA) supplies for the internal core logic. The output pins of the regulators (VCCD and VCCA) and the VDDIO pins must have capacitors connected as shown in Figure 6-4. The two VCCD pins must be shorted together, with as short a trace as possible, and connected to a 1 F 10% X5R capacitor. The power system also contains a sleep regulator and a hibernate regulator.
The system clock is used to select and supply the fastest clock in the system for general system clock requirements and clock synchronization of the PSoC device. Bus clock 16-bit divider uses the system clock to generate the system's bus clock used for data transfers and the CPU. The CPU clock is directly derived from the bus clock. Eight fully programmable 16-bit clock dividers generate digital system clocks for general use in the digital system, as configured by the design's requirements. Digital system clocks can generate custom clocks derived from any of the seven clock sources for any purpose. Examples include baud rate generators, accurate PWM periods, and timer clocks, and many others. If more than eight digital clock dividers are required, the UDBs and fixed function timer/counter/PWMs can also generate clocks. Four 16-bit clock dividers generate clocks for the analog system components that require clocking, such as ADCs and mixers. The analog clock dividers include skew control to ensure that critical analog events do not occur simultaneously with digital switching events. This is done to reduce analog system noise.
Each clock divider consists of an 8-input multiplexer, a 16-bit clock divider (divide by 2 and higher) that generates ~50% duty cycle clocks, system clock resynchronization logic, and deglitch logic. The outputs from each digital clock tree can be routed into the digital system interconnect and then brought back into the clock system as an input, allowing clock chaining of up to 32 bits.
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Figure 6-4. PSoC Power System
Vddio2 1 F Vddd Vddio0
0.1 F Vddd Vccd Vssd Vddio2 I/O Supply
0.1 F I/O Supply Vddio0
I2C Regulator
0.1 F
Digital Domain
Sleep Regulator
Vdda Vdda
Vssd
Digital Regulators
Analog Regulator
Vcca 1 F Vssa
0.1 F .
Analog Domain
Hibernate Regulator
Vddio1 Vccd I/O Supply Vddd Vssd I/O Supply Vddio3 Vddio3
0.1 F 0.1 F Vddio1 Vddd
0.1 F
Note The two VCCD pins must be connected together with as short a trace as possible. A trace under the device is recommended, as shown in Figure 2-4. 6.2.1 Power Modes PSoC 5 devices have four different power modes, as shown in Table 6-2 and Table 6-3. The power modes allow a design to easily provide required functionality and processing power while simultaneously minimizing power consumption and maximizing battery life in low power and portable devices. PSoC 5 power modes, in order of decreasing power consumption are:

Active Alternate active Sleep Hibernate
Active is the main processing mode. Its functionality is configurable. Each power controllable subsystem is enabled or disabled by using separate power configuration template registers. In alternate active mode, fewer subsystems are enabled, reducing power. In sleep mode most resources are disabled regardless of the template settings. Sleep mode is optimized to provide timed sleep intervals and RTC functionality. The lowest power mode is hibernate, which retains register and SRAM state, but no clocks, and allows wakeup only from I/O pins. Figure 6-5 illustrates the allowable transitions between power modes.
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Table 6-2. Power Modes Power Modes Description Active Primary mode of operation, all peripherals available (programmable) Alternate Active Entry Condition Wakeup Source Active Clocks Regulator Wakeup, reset, Any interrupt Any (programAll regulators available. manual register mable) Digital and analog entry regulators can be disabled if external regulation used. Manual register Any interrupt Any (programAll regulators available. entry mable) Digital and analog regulators can be disabled if external regulation used.
Sleep
Similar to Active mode, and is typically configured to have fewer peripherals active to reduce power. One possible configuration is to use the UDBs for processing, with the CPU turned off All subsystems automatically Manual register disabled entry
Comparator, PICU, RTC, CTW, LVD
ILO/kHzECO
Hibernate
Manual register All subsystems automatically entry disabled Lowest power consuming mode with all peripherals and internal regulators disabled, except hibernate regulator is enabled Configuration and memory contents retained
PICU
Both digital and analog regulators buzzed. Digital and analog regulators can be disabled if external regulation used. Only hibernate regulator active.
Table 6-3. Power Modes Wakeup Time and Power Consumption Sleep Modes Active Alternate Active Sleep Hibernate Wakeup Time - - 20 s typ Current (Typ) 2 mA[7] - 2 A Code Execution Yes User defined No Digital Resources All All None Analog Resources All All Comparator Clock Sources Available All All ILO/kHzECO Wakeup Sources Reset Sources - - Comparator, PICU, RTC, CTW, LVD PICU All All XRES, LVD, WDR, XRES
<100 s
300 nA
No
None
None
None
Figure 6-5. Power Mode Transitions
Active
6.2.1.1 Active Mode Active mode is the primary operating mode of the device. When in active mode, the active configuration template bits control which available resources are enabled or disabled. When a resource is disabled, the digital clocks are gated, analog bias currents are disabled, and leakage currents are reduced as appropriate. User firmware can dynamically control subsystem power by setting and clearing bits in the active configuration template. The CPU can disable itself, in which case the CPU is automatically reenabled at the next wakeup event. When a wakeup event occurs, the global mode is always returned to active, and the CPU is automatically enabled, regardless of its template settings. Active mode is the default global power mode upon boot.
Manual Sleep Hibernate
Alternate Active
Note 7. Bus clock off. Execute from CPU instruction buffer at 6 MHz. See Table 11-2 on page 59.
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6.2.1.2 Alternate Active Mode Alternate Active mode is very similar to Active mode. In alternate active mode, fewer subsystems are enabled, to reduce power consumption. One possible configuration is to turn off the CPU and flash, and run peripherals at full speed. 6.2.1.3 Sleep Mode Sleep mode reduces power consumption when a resume time of 15 s is acceptable. The wake time is used to ensure that the regulator outputs are stable enough to directly enter active mode. 6.2.1.4 Hibernate Mode In hibernate mode nearly all of the internal functions are disabled. Internal voltages are reduced to the minimal level to keep vital systems alive. Configuration state is preserved in hibernate mode and SRAM memory is retained. GPIOs configured as digital outputs maintain their previous values and external GPIO pin interrupt settings are preserved. The device can only return from hibernate mode in response to an external I/O interrupt. The resume time from hibernate mode is less than 100 s. 6.2.1.5 Wakeup Events Wakeup events are configurable and can come from an interrupt or device reset. A wakeup event restores the system to active mode. Interrupt sources include internally generated interrupts, power supervisor, central timewheel, and I/O interrupts. Internal interrupt sources can come from a variety of peripherals, such as analog comparators and UDBs. The central timewheel provides periodic interrupts to allow the system to wake up, poll peripherals, or perform real-time functions. Reset event sources include the external reset I/O pin (XRES), WDT, and Precision Reset (PRES). 6.2.2 Boost Converter Applications that use a supply voltage of less than 1.71 V, such as solar or single cell battery supplies, may use the on-chip boost converter. The boost converter may also be used in any system that requires a higher operating voltage than the supply provides. For instance, this includes driving 5.0 V LCD glass in a 3.3 V system. The boost converter accepts an input voltage as low as 1.8 V. With one low cost inductor it produces a selectable output voltage sourcing enough current to operate the PSoC and other on-board components. The boost converter accepts an input voltage from 1.8 V to 5.5 V (VBAT), and can start up with VBAT as low as 1.8 V. The converter provides a user configurable output voltage of 1.8 to 5.0 V (VBOOST). VBAT is typically less than VBOOST; if VBAT is greater than or equal to VBOOST, then VBOOST will be the same as VBAT. The block can deliver up to 50 mA (IBOOST) depending on configuration. Four pins are associated with the boost converter: VBAT, VSSB, VBOOST, and Ind. The boosted output voltage is sensed at the VBOOST pin and must be connected directly to the chip's supply inputs. An inductor is connected between the VBAT and Ind pins. The designer can optimize the inductor value to increase the boost converter efficiency based on input voltage, output voltage, current and switching frequency. The External Schottky diode shown in Figure 6-6 is required only in cases when VBOOST>3.6 V.
Figure 6-6. Application for Boost Converter
Optional Schottky Diode. Only required when Vdd >3.6 V.
Vboost Vdda Vddd
IND PSoC 10 H 22 F 0.1 F
22 F
Vbat Vssb Vssa Vssd
The switching frequency can be set to 100 kHz, 400 kHz, 2 MHz, or 32 kHz to optimize efficiency and component cost. The 100 kHz, 400 kHz, and 2 MHz switching frequencies are generated using oscillators internal to the boost converter block. When the 32 KHz switching frequency is selected, the clock is derived from a 32 kHz external crystal oscillator. The 32 KHz external clock is primarily intended for boost standby mode. At 2 MHz the Vboost output is limited to 2 x Vbat, and at 400 kHz Vboost is limited to 4 x Vbat. The boost converter can be operated in two different modes: active and standby. Active mode is the normal mode of operation where the boost regulator actively generates a regulated output voltage. In standby mode, most boost functions are disabled, thus reducing power consumption of the boost circuit. The converter can be configured to provide low power, low current regulation in the standby mode. The external 32 kHz crystal can be used to generate inductor boost pulses on the rising and falling edge of the clock when the output voltage is less than the programmed value. This is called automatic thump mode (ATM). The boost typically draws 200 A in active mode and 12 A in standby mode. The boost operating modes must be used in conjunction with chip power modes to minimize the total chip power consumption. Table 6-4 lists the boost power modes available in different chip power modes. Table 6-4. Chip and Boost Power Modes Compatibility Chip Power Modes Chip -Active mode Chip -Sleep mode Boost Power Modes Boost can be operated in either active or standby mode. Boost can be operated in either active or standby mode. However, it is recommended to operate boost in standby mode for low power consumption Boost can only be operated in active mode. However, it is recommended not to use boost in chip hibernate mode due to high current consumption in boost active mode
Chip-Hibernate mode
If the boost converter is not used in a given application, tie the VBAT, VSSB, and VBOOST pins to ground and leave the Ind pin unconnected.
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6.3 Reset
CY8C55 has multiple internal and external reset sources available. The reset sources are: Power source monitoring - The analog and digital power voltages, VDDA, VDDD, VCCA, and VCCD are monitored in several different modes during power up, active mode, and sleep mode (buzzing). If any of the voltages goes outside predetermined ranges then a reset is generated. The monitors are programmable to generate an interrupt to the processor under certain conditions before reaching the reset thresholds. External - The device can be reset from an external source by pulling the reset pin (XRES) low. The XRES pin includes an internal pull-up to Vddio1. VDDD, VDDA, and Vddio1 must all have voltage applied before the part comes out of reset. Watchdog timer - A watchdog timer monitors the execution of instructions by the processor. If the watchdog timer is not reset by firmware within a certain period of time, the watchdog timer generates a reset. Software - The device can be reset under program control. Figure 6-7. Resets
Vddd Vdda
Power Voltage Level Monitors Reset Pin
Processor Interrupt
External Reset
Reset Controller
System Reset
It is set to approximately 1 volt, which is below the lowest specified operating voltage but high enough for the internal circuits to be reset and to hold their reset state. The monitor generates a reset pulse that is at least 100 ns wide. It may be much wider if one or more of the voltages ramps up slowly. To save power the IPOR circuit is disabled when the internal digital supply is stable. Voltage supervision is then handed off to the precise low voltage reset (PRES) circuit. When the voltage is high enough for PRES to release, the IMO starts. PRES - Precise Low Voltage Reset This circuit monitors the outputs of the analog and digital internal regulators after power up. The regulator outputs are compared to a precise reference voltage. The response to a PRES trip is identical to an IPOR reset. In normal operating mode, the program cannot disable the digital PRES circuit. The analog regulator can be disabled, which also disables the analog portion of the PRES. The PRES circuit is disabled automatically during sleep and hibernate modes, with one exception: During sleep mode the regulators are periodically activated (buzzed) to provide supervisory services and to reduce wakeup time. At these times the PRES circuit is also buzzed to allow periodic voltage monitoring. ALVI, DLVI, AHVI - Analog/Digital Low Voltage Interrupt, Analog High Voltage Interrupt Interrupt circuits are available to detect when VDDA and VDDD go outside a voltage range. For AHVI, VDDA is compared to a fixed trip level. For ALVI and DLVI, VDDA and VDDD are compared to trip levels that are programmable, as listed in Table 6-5. ALVI and DLVI can also be configured to generate a device reset instead of an interrupt. Table 6-5. Analog/Digital Low Voltage Interrupt, Analog High Voltage Interrupt Interrupt Supply DLVI VDDD VDDA VDDA Normal Voltage Range Available Trip Accuracy Settings 2%
Watchdog Timer
1.71 V-5.5 V 1.70 V-5.45 V in 250 mV increments 1.71 V-5.5 V 1.70 V-5.45 V in 250 mV increments 1.71 V-5.5 V 5.75 V
Software Reset Register
ALVI
2%
AHVI The term system reset indicates that the processor as well as analog and digital peripherals and registers are reset. A reset status register holds the source of the most recent reset or power voltage monitoring interrupt. The program may examine this register to detect and report exception conditions. This register is cleared after a power on reset. 6.3.1 Reset Sources 6.3.1.1 Power Voltage Level Monitors IPOR - Initial Power on Reset At initial power on, IPOR monitors the power voltages VDDD and VDDA, both directly at the pins and at the outputs of the corresponding internal regulators. The trip level is not precise.
2%
The monitors are disabled until after IPOR. During sleep mode these circuits are periodically activated (buzzed). If an interrupt occurs during buzzing then the system first enters its wakeup sequence. The interrupt is then recognized and may be serviced. 6.3.1.2 Other Reset Sources
XRES - External Reset CY8C55 has a dedicated XRES pin which holds the part in reset while held active (low). The response to an XRES is the same as to an IPOR reset. The external reset is active low. It includes an internal pull-up resistor. XRES is active during sleep and hibernate modes.
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Input or output or both for CPU and DMA Eight drive modes Every pin can be an interrupt source configured as rising edge, falling edge or both edges. If required, level sensitive interrupts are supported through the DSI Dedicated port interrupt vector for each port Slew rate controlled digital output drive mode Access port control and configuration registers on either port basis or pin basis Separate port read (PS) and write (DR) data registers to avoid read modify write errors Special functionality on a pin by pin basis

SRES - Software Reset A reset can be commanded under program control by setting a bit in the software reset register. This is done either directly by the program or indirectly by DMA access. The response to a SRES is the same as after an IPOR reset. Another register bit exists to disable this function.
WRES - Watchdog Timer Reset The watchdog reset detects when the software program is no longer being executed correctly. To indicate to the watchdog timer that it is running correctly, the program must periodically reset the timer. If the timer is not reset before a user-specified amount of time, then a reset is generated. Note IPOR disables the watchdog function. The program must enable the watchdog function at an appropriate point in the code by setting a register bit. When this bit is set, it cannot be cleared again except by an IPOR power on reset event.
6.4 I/O System and Routing
PSoC I/Os are extremely flexible. Every GPIO has analog and digital I/O capability. All I/Os have a large number of drive modes, which are set at POR. PSoC also provides up to four individual I/O voltage domains through the VDDIO pins. There are two types of I/O pins on every device; those with USB provide a third type. Both general purpose I/O (GPIO) and special I/O (SIO) provide similar digital functionality. The primary differences are their analog capability and drive strength. Devices that include USB also provide two USBIO pins that support specific USB functionality as well as limited GPIO capability. All I/O pins are available for use as digital inputs and outputs for both the CPU and digital peripherals. In addition, all I/O pins can generate an interrupt. The flexible and advanced capabilities of the PSoC I/O, combined with any signal to any pin routability, greatly simplify circuit design and board layout. All GPIO pins can be used for analog input, CapSense[8], and LCD segment drive, while SIO pins are used for voltages in excess of VDDA and for programmable output voltages.
Additional features only provided on the GPIO pins: LCD segment drive on LCD equipped devices [8] CapSense on CapSense equipped devices Analog input and output capability Continuous 100 A clamp current capability Standard drive strength down to 1.71 V Additional features only provided on SIO pins: Higher drive strength than GPIO Hot swap capability (5 V tolerance at any operating VDD) Programmable and regulated high input and output drive levels down to 1.2 V No analog input or LCD capability Over voltage tolerance up to 5.5 V SIO can act as a general purpose analog comparator USBIO features: Full speed USB 2.0 compliant I/O Highest drive strength for general purpose use Input, output, or both for CPU and DMA Input, output, or both for digital peripherals Digital output (CMOS) drive mode Each pin can be an interrupt source configured as rising edge, falling edge, or both edges
Features supported by both GPIO and SIO: Separate I/O supplies and voltages for up to four groups of I/O Digital peripherals use DSI to connect the pins
Note 8. GPIOs with opamp outputs are not recommended for use with CapSense.
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Figure 6-8. GPIO Block Diagram
Digital Input Path
PRT[x]CTL PRT[x]DBL_SYNC_IN PRT[x]PS Digital System Input PICU[x]INTTYPE[y] PICU[x]INTSTAT Pin Interrupt Signal PICU[x]INTSTAT Input Buffer Disable Interrupt Logic
Naming Convention `x' = Port Number `y' = Pin Number
Digital Output Path
PRT[x]SLW PRT[x]SYNC_OUT PRT[x]DR Digital System Output PRT[x]BYP PRT[x]DM2 PRT[x]DM1 PRT[x]DM0 Bidirectional Control PRT[x]BIE Drive Logic Slew Cntl
0 1
Vddio Vddio In Vddio
PIN
OE
Analog
1
0 1 0 1
Capsense Global Control CAPS[x]CFG1 PRT[x]AG Analog Global Enable PRT[x]AMUX Analog Mux Enable
Switches
LCD
PRT[x]LCD_COM_SEG PRT[x]LCD_EN LCD Bias Bus 5 Display Data Logic & MUX
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Figure 6-9. SIO Input/Output Block Diagram
Digital Input Path
PRT[x]SIO_HYST_EN PRT[x]SIO_DIFF Reference Level PRT[x]DBL_SYNC_IN PRT[x]PS Digital System Input PICU[x]INTTYPE[y] PICU[x]INTSTAT Pin Interrupt Signal PICU[x]INTSTAT Input Buffer Disable Interrupt Logic Buffer Thresholds Naming Convention `x' = Port Number `y' = Pin Number
Digital Output Path
Reference Level PRT[x]SIO_CFG PRT[x]SLW PRT[x]SYNC_OUT PRT[x]DR Digital System Output PRT[x]BYP PRT[x]DM2 PRT[x]DM1 PRT[x]DM0 Bidirectional Control PRT[x]BIE Drive Logic Slew Cntl
0 1
Driver Vhigh
In
PIN
OE
Figure 6-10. USBIO Block Diagram
Digital Input Path
USB Receiver Circuitry PRT[x]DBL_SYNC_IN USBIO_CR1[0,1] Digital System Input PICU[x]INTTYPE[y] PICU[x]INTSTAT Pin Interrupt Signal PICU[x]INTSTAT Interrupt Logic Naming Convention `x' = Port Number `y' = Pin Number
Digital Output Path
PRT[x]SYNC_OUT USBIO_CR1[7] USB SIE Control for USB Mode USBIO_CR1[4,5] Digital System Output PRT[x]BYP USBIO_CR1[2] USBIO_CR1[3] USBIO_CR1[6]
0 1
D+ pin only USB or I/O
Vddd Vddd Vddd Vddd
In
Drive Logic
5k
1.5 k
PIN
D+ 1.5 k D+D- 5 k Open Drain
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6.4.1 Drive Modes Each GPIO and SIO pin is individually configurable into one of the eight drive modes listed in Table 6-6. Three configuration bits are used for each pin (DM[2:0]) and set in the PRTxDM[2:0] registers. Figure 6-11 depicts a simplified pin view based on each of the eight drive modes. Table 6-6 shows the I/O pin's drive state based on the port data register value or digital array signal
if bypass mode is selected. Note that the actual I/O pin voltage is determined by a combination of the selected drive mode and the load at the pin. For example, if a GPIO pin is configured for resistive pull-up mode and driven high while the pin is floating, the voltage measured at the pin is a high logic state. If the same GPIO pin is externally tied to ground then the voltage unmeasured at the pin is a low logic state.
Figure 6-11. Drive Mode
Vddio Vddio
DR PS
Pin
DR PS
Pin
DR PS
Pin
DR PS
Pin
0.
High Impedance Analog
1. High Impedance Digital
Vddio
2. Resistive Pull-Up
Vddio
3. Resistive Pull-Down
Vddio
DR PS
Pin
DR PS
Pin
DR PS
Pin
DR PS
Pin
4. Open Drain , Drives Low
5. Open Drain , Drives High
6. Strong Drive
7. Resistive Pull-Up and Pull-Down
Table 6-6. Drive Modes Diagram 0 1 2 3 4 5 6 7
Drive Mode High impedence analog High Impedance digital Resistive pull-up[9] Resistive pull-down[9] Open drain, drives low Open drain, drive high Strong drive Resistive pull-up and pull-down[9]
PRTxDM2 0 0 0 0 1 1 1 1
PRTxDM1 0 0 1 1 0 0 1 1
PRTxDM0 0 1 0 1 0 1 0 1
PRTxDR = 1 High-Z High-Z Res High (5K) Strong High High-Z Strong High Strong High Res High (5K)
PRTxDR = 0 High-Z High-Z Strong Low Res Low (5K) Strong Low High-Z Strong Low Res Low (5K)
High Impedance Analog The default reset state with both the output driver and digital input buffer turned off. This prevents any current from flowing in the I/O's digital input buffer due to a floating voltage. This state is recommended for pins that are floating or that support an analog voltage. High impedance analog pins do not provide digital input functionality.
To achieve the lowest chip current in sleep modes, all I/Os must either be configured to the high impedance analog mode, or have their pins driven to a power supply rail by the PSoC device or by external circuitry.
High Impedance Digital The input buffer is enabled for digital signal input. This is the standard high impedance (HiZ) state recommended for digital inputs.
Note 9. Resistive pull-up and pull-down are not available with SIO in regulated output mode.
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Resistive Pull-up or Resistive Pull-down Resistive pull-up or pull-down, respectively, provides a series resistance in one of the data states and strong drive in the other. Pins can be used for digital input and output in these modes. Interfacing to mechanical switches is a common application for these modes. Resistive pull-up and pull-down are not available with SIO in regulated output mode. Open Drain, Drives High and Open Drain, Drives Low Open drain modes provide high impedance in one of the data states and strong drive in the other. Pins can be used for digital input and output in these modes. A common application for these modes is driving the I2C bus signal lines. Strong Drive Provides a strong CMOS output drive in either high or low state. This is the standard output mode for pins. Strong Drive mode pins must not be used as inputs under normal circumstances. This mode is often used to drive digital output signals or external FETs. Resistive Pull-up and Pull-down Similar to the resistive pull-up and resistive pull-down modes except the pin is always in series with a resistor. The high data state is pull-up while the low data state is pull-down. This mode is most often used when other signals that may cause shorts can drive the bus. Resistive pull-up and pull-down are not available with SIO in regulated output mode.
6.4.5 Pin Interrupts All GPIO and SIO pins are able to generate interrupts to the system. All eight pins in each port interface to their own Port Interrupt Control Unit (PICU) and associated interrupt vector. Each pin of the port is independently configurable to detect rising edge, falling edge, both edge interrupts, or to not generate an interrupt. Depending on the configured mode for each pin, each time an interrupt event occurs on a pin, its corresponding status bit of the interrupt status register is set to "1" and an interrupt request is sent to the interrupt controller. Each PICU has its own interrupt vector in the interrupt controller and the pin status register providing easy determination of the interrupt source down to the pin level. Port pin interrupts remain active in all sleep modes allowing the PSoC device to wake from an externally generated interrupt. While level sensitive interrupts are not directly supported; Universal Digital Blocks (UDB) provide this functionality to the system when needed. 6.4.6 Input Buffer Mode GPIO and SIO input buffers can be configured at the port level for the default CMOS input thresholds or the optional LVTTL input thresholds. All input buffers incorporate Schmitt triggers for input hysteresis. Additionally, individual pin input buffers can be disabled in any drive mode. 6.4.7 I/O Power Supplies Up to four I/O pin power supplies are provided depending on the device and package. Each I/O supply must be less than or equal to the voltage on the chip's analog (VDDA) pin. This feature allows users to provide different I/O voltage levels for different pins on the device. Refer to the specific device package pinout to determine VDDIO capability for a given port and pin. The SIO port pins support an additional regulated high output capability, as described in 6.4.11 Adjustable Output Level. 6.4.8 Analog Connections These connections apply only to GPIO pins. All GPIO pins may be used as analog inputs or outputs. The analog voltage present on the pin must not exceed the VDDIO supply voltage to which the GPIO belongs. Each GPIO may connect to one of the analog global busses or to one of the analog mux buses to connect any pin to any internal analog resource such as ADC or comparators. In addition, select pins provide direct connections to specific analog features such as the high current DACs or uncommitted opamps. 6.4.9 CapSense This section applies only to GPIO pins. All GPIO pins may be used to create CapSense buttons and sliders[10]. See the "CapSense" section on page 53 for more information. 6.4.10 LCD Segment Drive This section applies only to GPIO pins. All GPIO pins may be used to generate Segment and Common drive signals for direct glass drive of LCD glass. See the "LCD Direct Drive" section on page 52 for details.
6.4.2 Pin Registers Registers to configure and interact with pins come in two forms that may be used interchangeably. All I/O registers are available in the standard port form, where each bit of the register corresponds to one of the port pins. This register form is efficient for quickly reconfiguring multiple port pins at the same time. I/O registers are also available in pin form, which combines the eight most commonly used port register bits into a single register for each pin. This enables very fast configuration changes to individual pins with a single register write. 6.4.3 Bidirectional Mode High speed bidirectional capability allows pins to provide both the high impedance digital drive mode for input signals and a second user selected drive mode such as strong drive (set using PRTxDM[2:0] registers) for output signals on the same pin, based on the state of an auxiliary control bus signal. The bidirectional capability is useful for processor busses and communications interfaces such as the SPI Slave MISO pin that requires dynamic hardware control of the output buffer. The auxiliary control bus routes up to 16 UDB or digital peripheral generated output enable signals to one or more pins. 6.4.4 Slew Rate Limited Mode GPIO and SIO pins have fast and slow output slew rate options for strong and open drain drive modes, not resistive drive modes. Because it results in reduced EMI, the slow edge rate option is recommended for signals that are not speed critical, generally less than 1 MHz. The fast slew rate is for signals between 1 MHz and 33 MHz. The slew rate is individually configurable for each pin, and is set by the PRTxSLW registers.
Note 10. GPIOs with opamp outputs are not recommended for use with CapSense.
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6.4.11 Adjustable Output Level This section applies only to SIO pins. SIO port pins support the ability to provide a regulated high output level for interface to external signals that are lower in voltage than the SIO's respective VDDIO. SIO pins are individually configurable to output either the standard VDDIO level or the regulated output, which is based on an internally generated reference. Typically a voltage DAC (VDAC) is used to generate the reference (see Figure 6-12). The "DAC" section on page 53 has more details on VDAC use and reference routing to the SIO pins. Resistive pull-up and pull-down drive modes are not available with SIO in regulated output mode. 6.4.12 Adjustable Input Level This section applies only to SIO pins. SIO pins by default support the standard CMOS and LVTTL input levels but also support a differential mode with programmable levels. SIO pins are grouped into pairs. Each pair shares a reference generator block which, is used to set the digital input buffer reference level for interface to external signals that differ in voltage from VDDIO. The reference sets the pins voltage threshold for a high logic level (see Figure 6-12). Available input thresholds are: 0.5 x VDDIO 0.4 x VDDIO 0.5 x VREF VREF Typically a voltage DAC (VDAC) generates the VREF reference. "DAC" section on page 53 has more details on VDAC use and reference routing to the SIO pins. Figure 6-12. SIO Reference for Input and Output
Input Path
6.4.13 SIO as Comparator This section applies only to SIO pins. The adjustable input level feature of the SIOs as explained in the 6.4.12 Adjustable Input Level section can be used to construct a comparator. The threshold for the comparator is provided by the SIO's reference generator. The reference generator has the option to set the analog signal routed through the analog global line as threshold for the comparator. Note that a pair of SIO pins share the same threshold. The digital input path in Figure 6-9 on page 28 illustrates this functionality. In the figure, `Reference level' is the analog signal routed through the analog global. The hysteresis feature can also be enabled for the input buffer of the SIO, which increases noise immunity for the comparator. 6.4.14 Hot Swap This section applies only to SIO pins. SIO pins support `hot swap' capability to plug into an application without loading the signals that are connected to the SIO pins even when no power is applied to the PSoC device. This allows the unpowered PSoC to maintain a high impedance load to the external device while also preventing the PSoC from being powered through a GPIO pin's protection diode. 6.4.15 Over Voltage Tolerance All I/O pins provide an over voltage (VDDIO < VIN < VDDA) tolerance feature at any operating VDD.

There are no current limitations for the SIO pins as they present a high impedance load to the external circuit. The GPIO pins must be limited to 100 A using a current limiting resistor. GPIO pins clamp the pin voltage to approximately one diode above the VDDIO supply. In case of a GPIO pin configured for analog input/output, the analog voltage on the pin must not exceed the VDDIO supply voltage to which the GPIO belongs.
Digital Input
Vinref
SIO_Ref
Reference Generator
PIN
Voutref Output Path Driver Vhigh
A common application for this feature is connection to a bus such as I2C where different devices are running from different supply voltages. In the I2C case, the PSoC chip is configured into the Open Drain, Drives Low mode for the SIO pin. This allows an external pull-up to pull the I2C bus voltage above the PSoC pin supply. For example, the PSoC chip could operate at 1.8 V, and an external device could run from 5 V. Note that the SIO pin's VIH and VIL levels are determined by the associated VDDIO supply pin. The I/O pin must be configured into a high impedance drive mode, open drain low drive mode, or pull-down drive mode, for over voltage tolerance to work properly. Absolute maximum ratings for the device must be observed for all I/O pins. 6.4.16 Reset Configuration At reset, all I/Os are reset to the High Impedance Analog state. 6.4.17 Low Power Functionality In all low power modes the I/O pins retain their state until the part is awakened and changed or reset. To awaken the part, use a pin interrupt, because the port interrupt logic continues to function in all low power modes.
Digital Output
Drive Logic
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6.4.18 Special Pin Functionality Some pins on the device include additional special functionality in addition to their GPIO or SIO functionality. The specific special function pins are listed in "Pinouts" on page 5. The special features are:
Figure 7-1. CY8C55 Digital Programmable Architecture
Digital Core System and Fixed Function Peripherals IO Port IO Port UDB Array
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UDB Array
Digital 4- to 25 MHz crystal oscillator 32.768 KHz crystal oscillator JTAG and SWD interface pins SWV interface pins External reset Analog Opamp inputs and outputs High current IDAC outputs External reference inputs
DSI Routing Interface
UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB
The digital programmable system creates application specific combinations of both standard and advanced digital peripherals and custom logic functions. These peripherals and logic are then interconnected to each other and to any pin on the device, providing a high level of design flexibility and IP security. The features of the digital programmable system are outlined here to provide an overview of capabilities and architecture. Designers do not need to interact directly with the programmable digital system at the hardware and register level. PSoC Creator provides a high level schematic capture graphical interface to automatically place and route resources similar to PLDs. The main components of the digital programmable system are:
IO Port
Digital Core System and Fixed Function Peripherals
7.1 Example Peripherals
The flexibility of the CY8C55 family's UDBs and analog blocks allow the user to create a wide range of components (peripherals). The most common peripherals were built and characterized by Cypress and are shown in the PSoC Creator component catalog, however, users may also create their own custom components using PSoC Creator. Using PSoC Creator, users may also create their own components for reuse within their organization, for example sensor interfaces, proprietary algorithms, and display interfaces. The number of components available through PSoC Creator is too numerous to list in the data sheet, and the list is always growing. An example of a component available for use in CY8C55 family, but, not explicitly called out in this data sheet is the UART component. 7.1.1 Example Digital Components The following is a sample of the digital components available in PSoC Creator for the CY8C55 family. The exact amount of hardware resources (UDBs, routing, RAM, flash) used by a component varies with the features selected in PSoC Creator for the component.
Universal Digital Blocks (UDB) - These form the core functionality of the digital programmable system. UDBs are a collection of uncommitted logic (PLD) and structural logic (Datapath) optimized to create all common embedded peripherals and customized functionality that are application or design specific. Universal Digital Block Array - UDB blocks are arrayed within a matrix of programmable interconnect. The UDB array structure is homogeneous and allows for flexible mapping of digital functions onto the array. The array supports extensive and flexible routing interconnects between UDBs and the Digital System Interconnect. Digital System Interconnect (DSI) - Digital signals from Universal Digital Blocks (UDBs), fixed function peripherals, I/O pins, interrupts, DMA, and other system core signals are attached to the Digital System Interconnect to implement full featured device connectivity. The DSI allows any digital function to any pin or other feature routability when used with the Universal Digital Block Array.
Communications 2 I C (1 to 3 UDBs) UART (1 to 3 UDBs) Functions PWM (1 to 2 UDBs) Logic (x CPLD product terms per logic function) NOT OR XOR AND
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IO Port
7. Digital Subsystem
DSI Routing Interface
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7.1.2 Example Analog Components The following is a sample of the analog components available in PSoC Creator for the CY8C55 family. The exact amount of hardware resources (SC/CT blocks, routing, RAM, flash) used by a component varies with the features selected in PSoC Creator for the component.
7.1.4 Designing with PSoC Creator 7.1.4.1 More Than a Typical IDE A successful design tool allows for the rapid development and deployment of both simple and complex designs. It reduces or eliminates any learning curve. It makes the integration of a new design into the production stream straightforward. PSoC Creator is that design tool. PSoC Creator is a full featured Integrated Development Environment (IDE) for hardware and software design. It is optimized specifically for PSoC devices and combines a modern, powerful software development platform with a sophisticated graphical design tool. This unique combination of tools makes PSoC Creator the most flexible embedded design platform available. Graphical design entry simplifies the task of configuring a particular part. You can select the required functionality from an extensive catalog of components and place it in your design. All components are parameterized and have an editor dialog that allows you to tailor functionality to your needs. PSoC Creator automatically configures clocks and routes the I/O to the selected pins and then generates APIs to give the application complete control over the hardware. Changing the PSoC device configuration is as simple as adding a new component, setting its parameters, and rebuilding the project. At any stage of development you are free to change the hardware configuration and even the target processor. To retarget your application (hardware and software) to new devices, even from 8- to 32-bit families, just select the new device and rebuild. You also have the ability to change the C compiler and evaluate an alternative. Components are designed for portability and are validated against all devices, from all families, and against all supported tool chains. Switching compilers is as easy as editing the from the project options and rebuilding the application with no errors from the generated APIs or boot code.
Amplifiers TIA PGA opamp ADCs Delta-Sigma Successive Approximation (SAR) DACs Current Voltage PWM Comparators Mixers

7.1.3 Example System Function Components The following is a sample of the system function components available in PSoC Creator for the CY8C55 family. The exact amount of hardware resources (UDBs, DFB taps, SC/CT blocks, routing, RAM, flash) used by a component varies with the features selected in PSoC Creator for the component.

CapSense LCD Drive LCD Control Filters
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Figure 7-2. PSoC Creator Framework
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7.1.4.2 Component Catalog Figure 7-3. Component Catalog
7.1.4.4 Software Development Figure 7-4. Code Editor
The component catalog is a repository of reusable design elements that select device functionality and customize your PSoC device. It is populated with an impressive selection of content; from simple primitives such as logic gates and device registers, through the digital timers, counters and PWMs, plus analog components such as ADCs, DACs, and filters, and communication protocols, such as I2C, USB and CAN. See "Example Peripherals" section on page 32 for more details about available peripherals. All content is fully characterized and carefully documented in datasheets with code examples, AC/DC specifications, and user code ready APIs. 7.1.4.3 Design Reuse The symbol editor gives you the ability to develop reusable components that can significantly reduce future design time. Just draw a symbol and associate that symbol with your proven design. PSoC Creator allows for the placement of the new symbol anywhere in the component catalog along with the content provided by Cypress. You can then reuse your content as many times as you want, and in any number of projects, without ever having to revisit the details of the implementation.
Anchoring the tool is a modern, highly customizable user interface. It includes project management and integrated editors for C and assembler source code, as well the design entry tools. Project build control leverages compiler technology from top commercial vendors such as ARM(R) Limited, KeilTM, and CodeSourcery (GNU). Free versions of Keil C51 and GNU C Compiler (GCC) for ARM, with no restrictions on code size or end product distribution, are included with the tool distribution. Upgrading to more optimizing compilers is a snap with support for the professional Keil C51 product and ARM RealViewTM compiler. 7.1.4.5 Nonintrusive Debugging Figure 7-5. PSoC Creator Debugger
With JTAG (4-wire) and SWD (2-wire) debug connectivity available on all devices, the PSoC Creator debugger offers full control over the target device with minimum intrusion. Breakpoints and code execution commands are all readily available from toolbar buttons and an impressive lineup of windows--register, locals, watch, call stack, memory and peripherals--make for an unparalleled level of visibility into the system. PSoC Creator contains all the tools necessary to complete a design, and then to maintain and extend that design for years to come. All steps of the design flow are carefully integrated and optimized for ease-of-use and to maximize productivity.
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7.2 Universal Digital Block
The Universal Digital Block (UDB) represents an evolutionary step to the next generation of PSoC embedded digital peripheral functionality. The architecture in first generation PSoC digital blocks provides coarse programmability in which a few fixed functions with a small number of options are available. The new UDB architecture is the optimal balance between configuration granularity and efficient implementation. A cornerstone of this approach is to provide the ability to customize the devices digital operation to match application requirements. To achieve this, UDBs consist of a combination of uncommitted logic (PLD), structured logic (Datapath), and a flexible routing scheme to provide interconnect between these elements, I/O connections, and other peripherals. UDB functionality ranges from simple self contained functions that are implemented in one UDB, or even a portion of a UDB (unused resources are available for other functions), to more complex functions that require multiple UDBs. Examples of basic functions are timers, counters, CRC generators, PWMs, dead band generators, and communications functions, such as UARTs, SPI, and I2C. Also, the PLD blocks and connectivity provide full featured general purpose programmable logic within the limits of the available resources. Figure 7-6. UDB Block Diagram
PLD Chaining Clock and Reset Control PLD 12C4 (8 PTs) PLD 12C4 (8 PTs)
7.2.1 PLD Module The primary purpose of the PLD blocks is to implement logic expressions, state machines, sequencers, look up tables, and decoders. In the simplest use model, consider the PLD blocks as a standalone resource onto which general purpose RTL is synthesized and mapped. The more common and efficient use model is to create digital functions from a combination of PLD and datapath blocks, where the PLD implements only the random logic and state portion of the function while the datapath (ALU) implements the more structured elements. Figure 7-7. PLD 12C4 Structure
PT0 PT1 PT2 PT3 PT4 PT5 PT6 TC TC TC TC TC TC TC TC TC TC TC TC IN0 IN1 IN2 IN3 IN4 IN5 IN6 IN7 IN8 IN9 IN10 IN11 SELIN (carry in) TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC AND Array PT7 T T T T
OUT0 OUT1 OUT2 OUT3
MC0 MC1 MC2 MC3
T T T T
T T T T
T T T T
T T T T
T T T T
T T T T
T T T T
Status and Control
SELOUT (carry out)
Datapath
OR Array
Datapath Chaining
Routing Channel
The main component blocks of the UDB are: PLD blocks - There are two small PLDs per UDB. These blocks take inputs from the routing array and form registered or combinational sum-of-products logic. PLDs are used to implement state machines, state bits, and combinational logic equations. PLD configuration is automatically generated from graphical primitives. Datapath Module - This 8-bit wide datapath contains structured logic to implement a dynamically configurable ALU, a variety of compare configurations and condition generation. This block also contains input/output FIFOs, which are the primary parallel data interface between the CPU/DMA system and the UDB. Status and Control Module - The primary role of this block is to provide a way for CPU firmware to interact and synchronize with UDB operation. Clock and Reset Module - This block provides the UDB clocks and reset selection and control.
One 12C4 PLD block is shown in Figure 7-7. This PLD has 12 inputs, which feed across eight product terms. Each product term (AND function) can be from 1 to 12 inputs wide, and in a given product term, the true (T) or complement (C) of each input can be selected. The product terms are summed (OR function) to create the PLD outputs. A sum can be from 1 to 8 product terms wide. The 'C' in 12C4 indicates that the width of the OR gate (in this case 8) is constant across all outputs (rather than variable as in a 22V10 device). This PLA like structure gives maximum flexibility and insures that all inputs and outputs are permutable for ease of allocation by the software tools. There are two 12C4 PLDs in each UDB. 7.2.2 Datapath Module The datapath contains an 8-bit single cycle ALU, with associated compare and condition generation logic. This datapath block is optimized to implement embedded functions, such as timers, counters, integrators, PWMs, PRS, CRC, shifters and dead band generators and many others.
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Figure 7-8. Datapath Top Level
PHUB System Bus R/W Access to All Registers F1 FIFOs Datapath Control Control Store RAM 8 Word X 16 Bit Input from Programmable Routing Input Muxes 6 F0 A0 A1 D0 D1 Conditions: 2 Compares, 2 Zero Detect, 2 Ones Detect Overflow Detect Output Muxes 6 Output to Programmable Routing
D1 Data Registers D0
A1 Accumulators A0 PI Parallel Input/Output (To/From Programmable Routing) PO
To/From Previous Datapath
Chaining
To/From Next Datapath
ALU Shift Mask
7.2.2.1 Working Registers The datapath contains six primary working registers, which are accessed by CPU firmware or DMA during normal operation. Table 7-1. Working Datapath Registers Name Function Description These are sources and sinks for the ALU and also sources for the compares. These are sources for the ALU and sources for the compares. These are the primary interface to the system bus. They can be a data source for the data registers and accumulators or they can capture data from the accumulators or ALU. Each FIFO is four bytes deep. A0 and A1 Accumulators
sequence, and can be routed from any block connected to the UDB routing matrix, most typically PLD logic, I/O pins, or from the outputs of this or other datapath blocks. ALU The ALU performs eight general purpose functions. They are:

Increment Decrement Add Subtract Logical AND Logical OR Logical XOR Pass, used to pass a value through the ALU to the shift register, mask, or another UDB register
D0 and D1 Data Registers F0 and F1 FIFOs
7.2.2.2 Dynamic Datapath Configuration RAM Dynamic configuration is the ability to change the datapath function and internal configuration on a cycle-by-cycle basis, under sequencer control. This is implemented using the 8-word x 16-bit configuration RAM, which stores eight unique 16-bit wide configurations. The address input to this RAM controls the
Independent of the ALU operation, these functions are available:

Shift left Shift right Nibble swap Bitwise OR mask
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PSoC(R) 5: CY8C55 Family Datasheet
7.2.2.3 Conditionals Each datapath has two compares, with bit masking options. Compare operands include the two accumulators and the two data registers in a variety of configurations. Other conditions include zero detect, all ones detect, and overflow. These conditions are the primary datapath outputs, a selection of which can be driven out to the UDB routing matrix. Conditional computation can use the built in chaining to neighboring UDBs to operate on wider data widths without the need to use routing resources. 7.2.2.4 Variable MSB The most significant bit of an arithmetic and shift function can be programmatically specified. This supports variable width CRC and PRS functions, and in conjunction with ALU output masking, can implement arbitrary width timers, counters and shift blocks. 7.2.2.5 Built in CRC/PRS The datapath has built in support for single cycle Cyclic Redundancy Check (CRC) computation and Pseudo Random Sequence (PRS) generation of arbitrary width and arbitrary polynomial. CRC/PRS functions longer than 8 bits may be implemented in conjunction with PLD logic, or built in chaining may be use to extend the function into neighboring UDBs. 7.2.2.6 Input/Output FIFOs Each datapath contains two four-byte deep FIFOs, which can be independently configured as an input buffer (system bus writes to the FIFO, datapath internal reads the FIFO), or an output buffer (datapath internal writes to the FIFO, the system bus reads from the FIFO). The FIFOs generate status that are selectable as datapath outputs and can therefore be driven to the routing, to interact with sequencers, interrupts, or DMA. Figure 7-9. Example FIFO Configurations
System Bus System Bus
shared with two sets of registers and condition generators. Carry and shift out data from the ALU are registered and can be selected as inputs in subsequent cycles. This provides support for 16-bit functions in one (8-bit) datapath. 7.2.2.9 Datapath I/O There are six inputs and six outputs that connect the datapath to the routing matrix. Inputs from the routing provide the configuration for the datapath operation to perform in each cycle, and the serial data inputs. Inputs can be routed from other UDB blocks, other device peripherals, device I/O pins, and so on. The outputs to the routing can be selected from the generated conditions, and the serial data outputs. Outputs can be routed to other UDB blocks, device peripherals, interrupt and DMA controller, I/O pins, and so on. 7.2.3 Status and Control Module The primary purpose of this circuitry is to coordinate CPU firmware interaction with internal UDB operation. Figure 7-10. Status and Control Registers
System Bus
8-bit Status Register (Read Only)
8-bit Control Register (Write/Read)
Routing Channel
F0
F0
F1
D0/D1 A0/A1/ALU
A0/A1/ALU
A0/A1/ALU
D0 A0
D1 A1
The bits of the control register, which may be written to by the system bus, are used to drive into the routing matrix, and thus provide firmware with the opportunity to control the state of UDB processing. The status register is read-only and it allows internal UDB state to be read out onto the system bus directly from internal routing. This allows firmware to monitor the state of UDB processing. Each bit of these registers has programmable connections to the routing matrix and routing connections are made depending on the requirements of the application. 7.2.3.1 Usage Examples As an example of control input, a bit in the control register can be allocated as a function enable bit. There are multiple ways to enable a function. In one method the control bit output would be routed to the clock control block in one or more UDBs and serve as a clock enable for the selected UDB blocks. A status example is a case where a PLD or datapath block generated a condition, such as a "compare true" condition that is captured and latched by the status register and then read (and cleared) by CPU firmware. 7.2.3.2 Clock Generation Each subcomponent block of a UDB including the two PLDs, the datapath, and Status and Control, has a clock selection and control block. This promotes a fine granularity with respect to allocating clocking resources to UDB component blocks and allows unused UDB resources to be used by other functions for maximum system efficiency.
F1
F0
F1
System Bus TX/RX
System Bus Dual Capture Dual Buffer
7.2.2.7 Chaining The datapath can be configured to chain conditions and signals such as carries and shift data with neighboring datapaths to create higher precision arithmetic, shift, CRC/PRS functions. 7.2.2.8 Time Multiplexing In applications that are over sampled, or do not need high clock rates, the single ALU block in the datapath can be efficiently
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7.3 UDB Array Description
Figure 7-11 shows an example of a 16 UDB array. In addition to the array core, there are a DSI routing interfaces at the top and bottom of the array. Other interfaces that are not explicitly shown include the system interfaces for bus and clock distribution. The UDB array includes multiple horizontal and vertical routing channels each comprised of 96 wires. The wire connections to UDBs, at horizontal/vertical intersection and at the DSI interface are highly permutable providing efficient automatic routing in PSoC Creator. Additionally the routing allows wire by wire segmentation along the vertical and horizontal routing to further increase routing flexibility and capability. Figure 7-11. Digital System Interface Structure
System Connections
utilize the unused PLD blocks in the 8-bit Timer UDB. Programmable resources in the UDB array are generally homogeneous so functions can be mapped to arbitrary boundaries in the array. Figure 7-12. Function Mapping Example in a Bank of UDBs
Sequencer 8-Bit Timer Quadrature Decoder UDB UDB 16-Bit PWM UDB 16-Bit PYRS UDB
HV A
HV B
HV A
HV B
UDB I2C Slave UDB
UDB 8-Bit SPI
UDB
UDB 8-Bit Timer Logic
HV B
HV A
HV B
HV A
12-Bit SPI UDB UDB UDB
UDB
UDB
UDB
UDB
HV A
HV B
HV A
HV B
HV B
HV A Logic
HV B
HV A
UDB
UDB
UDB
UDB
UDB UART
UDB
UDB 12-Bit PWM
UDB
UDB
UDB
UDB
UDB
HV B
HV A
HV B
HV A
7.4 DSI Routing Interface Description
The DSI routing interface is a continuation of the horizontal and vertical routing channels at the top and bottom of the UDB array core. It provides general purpose programmable routing between device peripherals, including UDBs, I/Os, analog peripherals, interrupts, DMA and fixed function peripherals. Figure 7-13 illustrates the concept of the digital system interconnect, which connects the UDB array routing matrix with other device peripherals. Any digital core or fixed function peripheral that needs programmable routing is connected to this interface. Signals in this category include:

UDB
UDB
UDB
UDB
HV A
HV B
HV A
HV B
System Connections
7.3.1 UDB Array Programmable Resources Figure 7-12 shows an example of how functions are mapped into a bank of 16 UDBs. The primary programmable resources of the UDB are two PLDs, one datapath and one status/control register. These resources are allocated independently, because they have independently selectable clocks, and therefore unused blocks are allocated to other unrelated functions. An example of this is the 8-bit Timer in the upper left corner of the array. This function only requires one datapath in the UDB, and therefore the PLD resources may be allocated to another function. A function such as a Quadrature Decoder may require more PLD logic than one UDB can supply and in this case can
Interrupt requests from all digital peripherals in the system. DMA requests from all digital peripherals in the system. Digital peripheral data signals that need flexible routing to I/Os. Digital peripheral data signals that need connections to UDBs. Connections to the interrupt and DMA controllers. Connection to I/O pins. Connection to analog system digital signals.
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Figure 7-13. Digital System Interconnect
Timer Counters CAN I2C Interrupt Controller DMA Controller IO Port Pins Global Clocks
the system clock (see Figure 6-1). Normally all inputs from pins are synchronized as this is required if the CPU interacts with the signal or any signal derived from it. Asynchronous inputs have rare uses. An example of this is a feed through of combinational PLD logic from input pins to output pins. Figure 7-15. I/O Pin Synchronization Routing
Digital System Routing I/F
DO DI
UDB ARRAY
Digital System Routing I/F
Figure 7-16. I/O Pin Output Connectivity
8 IO Data Output Connections from the UDB Array Digital System Interface
Global Clocks
IO Port Pins
EMIF
Del-Sig
SC/CT Blocks
DACs
Comparators
Interrupt and DMA routing is very flexible in the CY8C55 programmable architecture. In addition to the numerous fixed function peripherals that can generate interrupt requests, any data signal in the UDB array routing can also be used to generate a request. A single peripheral may generate multiple independent interrupt requests simplifying system and firmware design. Figure 7-14 shows the structure of the IDMUX (Interrupt/DMA Multiplexer). Figure 7-14. Interrupt and DMA Processing in the IDMUX
Interrupt and DMA Processing in IDMUX Fixed Function IRQs
DO PIN 0
DO PIN1
DO PIN2
DO PIN3
DO PIN4
DO PIN5
DO PIN6
DO PIN7
Port i
0 1 IRQs 2 Edge Detect DRQs DMA termout (IRQs) 0 1 Edge Detect 2 DMA Controller 3
Interrupt Controller
There are four more DSI connections to a given I/O port to implement dynamic output enable control of pins. This connectivity gives a range of options, from fully ganged 8-bits controlled by one signal, to up to four individually controlled pins. The output enable signal is useful for creating tri-state bidirectional pins and buses. Figure 7-17. I/O Pin Output Enable Connectivity
4 IO Control Signal Connections from UDB Array Digital System Interface
UDB Array
Fixed Function DRQs
7.4.1 I/O Port Routing There are a total of 20 DSI routes to a typical 8-bit I/O port, 16 for data and four for drive strength control. When an I/O pin is connected to the routing, there are two primary connections available, an input and an output. In conjunction with drive strength control, this can implement a bidirectional I/O pin. A data output signal has the option to be single synchronized (pipelined) and a data input signal has the option to be double synchronized. The synchronization clock is
Document Number: 001-66235 Rev. **
OE PIN 0 OE PIN1 OE PIN2 OE PIN3 OE PIN4 OE PIN5 OE PIN6 OE PIN7
Port i
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7.5 CAN
The CAN peripheral is a fully functional Controller Area Network (CAN) supporting communication baud rates up to 1 Mbps. The CAN controller implements the CAN2.0A and CAN2.0B specifications as defined in the Bosch specification and conforms to the ISO-11898-1 standard. The CAN protocol was originally designed for automotive applications with a focus on a high level of fault detection. This ensures high communication
reliability at a low cost. Because of its success in automotive applications, CAN is used as a standard communication protocol for motion oriented machine control networks (CANOpen) and factory automation applications (DeviceNet). The CAN controller features allow the efficient implementation of higher level protocols without affecting the performance of the microcontroller CPU. Full configuration support is provided in PSoC Creator.
Figure 7-18. CAN Bus System Implementation
CAN Node 1 PSoC CAN Drivers CAN Controller CAN Node 2 CAN Node n
En
Tx Rx
CAN Transceiver
CAN_H
CAN_L
CAN_H
CAN_L CAN Bus
CAN_H
CAN_L
7.5.1 CAN Features
CAN2.0A/B protocol implementation - ISO 11898 compliant Standard and extended frames with up to 8 bytes of data per frame Message filter capabilities Remote Transmission Request (RTR) support Programmable bit rate up to 1 Mbps Listen Only mode SW readable error counter and indicator Sleep mode: Wake the device from sleep with activity on the Rx pin Supports two or three wire interface to external transceiver (Tx, Rx, and Enable). The three-wire interface is compatible with the Philips PHY; the PHY is not included on-chip. The three wires can be routed to any I/O Enhanced interrupt controller CAN receive and transmit buffers status CAN controller error status including BusOff

Receive path 16 receive buffers each with its own message filter Enhanced hardware message filter implementation that covers the ID, IDE and RTR DeviceNet addressing support Multiple receive buffers linkable to build a larger receive message array Automatic transmission request (RTR) response handler Lost received message notification Transmit path Eight transmit buffers Programmable transmit priority Round robin Fixed priority Message transmissions abort capability
7.5.2 Software Tools Support CAN Controller configuration integrated into PSoC Creator:

CAN Configuration walkthrough with bit timing analyzer Receive filter setup
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Figure 7-19. CAN Controller Block Diagram
TxMessage0 TxReq TxAbort
Tx Buffer Status TxReq Pending
TxMessage1 TxReq TxAbort Priority Arbiter
Bit Timing
TxInterrupt Request (if enabled)
TxMessage6 TxReq TxAbort
Tx CAN Framer
Tx CRC Generator
TxMessage7 TxReq TxAbort
RTR RxMessages 0-15
Error Status Error Active Error Passive Bus Off Tx Error Counter Rx Error Counter
Rx Buffer Status RxMessage Available
RxMessage0 RxMessage1
Acceptance Code 0 Acceptance Code 1
Acceptance Mask 0 Acceptance Mask 1 RxMessage Handler Rx CAN Framer CRC Check Rx
RxMessage14 RxInterrupt Request (if enabled) RxMessage15
Acceptance Code 14 Acceptance Code 15
Acceptance Mask 14 Acceptance Mask 15
ErrInterrupt Request (if enabled)
Error Detection CRC Form ACK Bit Stuffing Bit Error Overload Arbitration
WakeUp Request
7.6 USB
PSoC includes a dedicated Full-Speed (12 Mbps) USB 2.0 transceiver supporting all four USB transfer types: control, interrupt, bulk, and isochronous. PSoC Creator provides full configuration support. USB interfaces to hosts through two dedicated USBIO pins, which are detailed in the "6.4 I/O System and Routing" section on page 26. USB includes the following features:

Figure 7-20. USB
Arbiter System Bus 512 X 8 SRAM D+ SIE (Serial Interface Engine) Interrupts 48 MHz IMO USB I/O D- External 22 Resistors
Eight unidirectional data endpoints One bidirectional control endpoint 0 (EP0) Shared 512-byte buffer for the eight data endpoints Dedicated 8-byte buffer for EP0 Two memory modes Manual Memory Management with No DMA Access Manual Memory Management with Manual DMA Access Internal 3.3 V regulator for transceiver Internal 48 MHz oscillator that auto locks to USB bus clock, requiring no external crystal for USB (USB equipped parts only) Interrupts on bus and each endpoint event, with device wakeup USB Reset, Suspend, and Resume operations Bus powered and self powered modes
7.7 Timers, Counters, and PWMs
The Timer/Counter/PWM peripheral is a 16-bit dedicated peripheral providing three of the most common embedded peripheral features. As almost all embedded systems use some combination of timers, counters, and PWMs. Four of them have been included on this PSoC device family. Additional and more advanced functionality timers, counters, and PWMs can also be instantiated in Universal Digital Blocks (UDBs) as required. PSoC Creator allows designers to choose the timer, counter, and PWM features that they require. The tool set utilizes the most optimal resources available. The Timer/Counter/PWM peripheral can select from multiple clock sources, with input and output signals connected through the DSI routing. DSI routing allows input and output connections
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to any device pin and any internal digital signal accessible through the DSI. Each of the four instances has a compare output, terminal count output (optional complementary compare output), and programmable interrupt request line. The Timer/Counter/PWMs are configurable as free running, one shot, or Enable input controlled. The peripheral has timer reset and capture inputs, and a kill input for control of the comparator outputs. The peripheral supports full 16-bit capture. Timer/Counter/PWM features include:

communication bus. The bus is compliant with Philips `The I2C Specification' version 2.1. Additional I2C interfaces can be instantiated using Universal Digital Blocks (UDBs) in PSoC Creator, as required. To eliminate the need for excessive CPU intervention and overhead, I2C specific support is provided for status detection and generation of framing bits. I2C operates as a slave, a master, or multimaster (Slave and Master). In slave mode, the unit always listens for a start condition to begin sending or receiving data. Master mode supplies the ability to generate the Start and Stop conditions and initiate transactions. Multimaster mode provides clock synchronization and arbitration to allow multiple masters on the same bus. If Master mode is enabled and Slave mode is not enabled, the block does not generate interrupts on externally generated Start conditions. I2C interfaces through the DSI routing and allows direct connections to any GPIO or SIO pins. I2C features include:

16-bit timer/counter/PWM (down count only) Selectable clock source PWM comparator (configurable for LT, LTE, EQ, GTE, GT) Period reload on start, reset, and terminal count Interrupt on terminal count, compare true, or capture Dynamic counter reads Timer capture mode Count while enable signal is asserted mode Free run mode One-shot mode (stop at end of period) Complementary PWM outputs with deadband PWM output kill
Clock Reset Enable Capture Kill
Slave and Master, Transmitter, and Receiver operation Byte processing for low CPU overhead Interrupt or polling CPU interface Support for bus speeds up to 1 Mbps (3.4 Mbps in UDBs) 7 or 10-bit addressing (10-bit addressing requires firmware support)
Figure 7-21. Timer/Counter/PWM
Timer / Counter / PWM 16-bit IRQ TC / Compare! Compare
7.8 I2C
The I2C peripheral provides a synchronous two wire interface designed to interface the PSoC device with a two wire I2C serial
SMBus operation (through firmware support - SMBus supported in hardware in UDBs) Data transfers follow the format shown in Figure 7-22. After the START condition (S), a slave address is sent. This address is 7 bits long followed by an eighth bit which is a data direction bit (R/W) - a 'zero' indicates a transmission (WRITE), a 'one' indicates a request for data (READ). A data transfer is always terminated by a STOP condition (P) generated by the master. However, if a master still wishes to communicate on the bus, it can generate a repeated START condition (Sr) and address another slave without first generating a STOP condition. Various combinations of read/write formats are then possible within such
Figure 7-22. I2C Complete Transfer Timing
SDA
SCL
START Condition
1-7
8
9
1-7
8
9
1-7
8
9
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
STOP Condition
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7.9 Digital Filter Block
Some devices in the CY8C55 family of devices have a dedicated HW accelerator block used for digital filtering. The DFB has a dedicated multiplier and accumulator that calculates a 24-bit by 24-bit multiply accumulate in one system clock cycle. This enables the mapping of a direct form FIR filter that approaches a computation rate of one FIR tap for each clock cycle. The MCU can implement any of the functions performed by this block, but at a slower rate that consumes significant MCU bandwidth. The PSoC Creator interface provides a wizard to implement FIR and IIR digital filters with coefficients for LPF, BPF, HPF, Notch and arbitrary shape filters. 64 pairs of data and coefficients are stored. This enables a 64 tap FIR filter or up to 4 16 tap filters of either FIR or IIR formulation. Figure 7-23. DFB Application Diagram (pwr/gnd not shown)
BUSCLK read_data write_data addr System Bus Data Dest (PHUB) DMA Request DMA CTRL Data Source (PHUB)
8. Analog Subsystem
The analog programmable system creates application specific combinations of both standard and advanced analog signal processing blocks. These blocks are then interconnected to each other and also to any pin on the device, providing a high level of design flexibility and IP security. The features of the analog subsystem are outlined here to provide an overview of capabilities and architecture.

Flexible, configurable analog routing architecture provided by analog globals, analog mux bus, and analog local buses High resolution Delta-Sigma ADC Two successive approximation (SAR) ADCs Four 8-bit DACs that provide either voltage or current output Four comparators with optional connection to configurable LUT outputs Four configurable switched capacitor/continuos time (SC/CT) blocks for functions that include opamp, unity gain buffer, programmable gain amplifier, transimpedance amplifier, and mixer Four opamps for internal use and connection to GPIO that can be used as high current output buffers CapSense subsystem to enable capacitive touch sensing Precision reference for generating an accurate analog voltage for internal analog blocks
Digital Routing
Digital Filter Block

The typical use model is for data to be supplied to the DFB over the system bus from another on-chip system data source such as an ADC. The data typically passes through main memory or is directly transferred from another chip resource through DMA. The DFB processes this data and passes the result to another on chip resource such as a DAC or main memory through DMA on the system bus. Data movement in or out of the DFB is typically controlled by the system DMA controller but can be moved directly by the MCU.
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PSoC(R) 5: CY8C55 Family Datasheet
Figure 8-1. Analog Subsystem Block Diagram
SAR ADC
SAR ADC
A N A L O G R O U T I N G
DAC DelSig ADC
DAC
DAC
Precision Reference
DAC
A N A L O G R O U T I N G
SC/CT Block Op Amp GPIO Port
SC/CT Block
GPIO Port
Op Amp
SC/CT Block
SC/CT Block
Op Amp
Op Amp
Comparators
CMP CMP CMP CMP
CapSense Subsystem
Analog Interface
Config & Status Registers
PHUB
CPU
DSI Array
Clock Distribution
Decimator
The PSoC Creator software program provides a user friendly interface to configure the analog connections between the GPIO and various analog resources and also connections from one analog resource to another. PSoC Creator also provides component libraries that allow you to configure the various analog blocks to perform application specific functions (PGA, transimpedance amplifier, voltage DAC, current DAC, and so on). The tool also generates API interface libraries that allow you to write firmware that allows the communication between the analog peripheral and CPU/Memory.
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PSoC(R) 5: CY8C55 Family Datasheet
Eight analog local buses (abus) to route signals between the different analog blocks Multiplexers and switches for input and output selection of the analog blocks
8.1 Analog Routing
The CY8C38 family of devices has a flexible analog routing architecture that provides the capability to connect GPIOs and different analog blocks, and also route signals between different analog blocks. One of the strong points of this flexible routing architecture is that it allows dynamic routing of input and output connections to the different analog blocks. For information on how to make pin selections for optimal analog routing, refer to the application note, AN58304 - PSoC(R) 3 and PSoC(R) 5 - Pin Selection for Analog Designs. 8.1.1 Features

8.1.2 Functional Description Analog globals (AGs) and analog mux buses (AMUXBUS) provide analog connectivity between GPIOs and the various analog blocks. There are 16 AGs in the CY8C38 family. The analog routing architecture is divided into four quadrants as shown in Figure 8-2. Each quadrant has four analog globals (AGL[0..3], AGL[4..7], AGR[0..3], AGR[4..7]). Each GPIO is connected to the corresponding AG through an analog switch. The analog mux bus is a shared routing resource that connects to every GPIO through an analog switch. There are two AMUXBUS routes in CY8C38, one in the left half (AMUXBUSL) and one in the right half (AMUXBUSR), as shown in Figure 8-2.
Flexible, configurable analog routing architecture 16 analog globals (AG) and two analog mux buses (AMUXBUS) to connect GPIOs and the analog blocks Each GPIO is connected to one analog global and one analog mux bus
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PSoC(R) 5: CY8C55 Family Datasheet
Figure 8-2. CY8C55 Analog Interconnect
Vdda Vssa Vcca Vssd
swinn
swinp
AMUXBUSL AGL[4] AGL[5] AGL[6] AGL[7]
AMUXBUSR AGR[4] AGR[5] AGR[6] AGR[7] 44
*
*
AMUXBUSL
AGL[4] AGL[5]
AGL[6] AGL[7]
ExVrefL ExVrefL1
opamp0 swfol opamp2 swfol
ExVrefL2
GPIO P0[4] GPIO P0[5] GPIO P0[6] GPIO P0[7] GPIO P4[2] GPIO P4[3] GPIO P4[4] GPIO P4[5] GPIO P4[6] GPIO P4[7] Vccd Vssd
swinp
01 2 3 456 7 0123
3210 76543210
opamp3
opamp1
swfol
swfol
swinn
* *
i0 i2
abuf_vref_int (1.024V)
swout swin
in0 out0 + comp0
LPF
5
in1 out1 comp1 + + swin
swout
abuf_vref_int (1.024V)
cmp1_vref
cmp0_vref (1.024V) vref_cmp1 (0.256V) bg_vda_res_en Vdda Vdda/2
refbuf_vref1 (1.024V) refbuf_vref2 (1.2V) cmp_muxvn[1:0]
COMPARATOR
+ - comp2
bg_vda_swabusl0
cmp1_vref
refbufr_ cmp
refbufl_ cmp
cmp0_vref (1.024V)
90
comp3
cmp1_vref
AGR[7] AGR[6] AGR[5]
vssa
ABUSL0 ABUSL1 ABUSL2 ABUSL3 v0 DAC0 i0 v2 DAC2 i2
dac_vref (0.256V)
vcmsel[1:0] en_resvpwra
ABUSR0 ABUSR1 ABUSR2 ABUSR3 DAC1 36 v1 i1 v3 i3
Vddd
AGL[1] AGL[2] AGL[3]
Vddio2
AMUXBUSL AGL[0]
:
TS ADC
VBE Vss ref
LPF
AGL[3] AGL[2] AGL[1] AGL[0] AMUXBUSL
AGR[3] AGR[2] AGR[1] AGR[0] AMUXBUSR
Connection
Vboost
Switch Resistance Small ( ~870 Ohms ) Large ( ~200 Ohms)
Vssb
Vssd
XRES
Vbat
Ind
Notes: * Denotes pins on all packages LCD signals are not shown. Rev #51 2-April-2010
Document Number: 001-66235 Rev. **
Vddio1
GPIO P2[5] GPIO P2[6] GPIO P2[7] SIO P12[4] SIO P12[5] GPIO P6[4] GPIO P6[5] GPIO P6[6] GPIO P6[7]
GPIO P5[2] GPIO P5[3] GPIO P1[0] GPIO P1[1] GPIO P1[2] GPIO P1[3] GPIO P1[4] GPIO P1[5]
Mux Group Switch Group
*
*
*
*
*
*
*
*
13
AGR[0] AMUXBUSR
AGR[3] AGR[2] AGR[1]
GPIO P6[0] GPIO P6[1] GPIO P6[2] GPIO P6[3] GPIO P15[4] GPIO P15[5] GPIO P2[0] GPIO P2[1] GPIO P2[2] GPIO P2[3] * GPIO P2[4] *
VIDAC
DAC3
vpwra vpwra/2 dsm0_vcm_vref1 (0.8V) dsm0_vcm_vref2 (0.7V) dsm0_qtz_vref2 (1.2V) dsm0_qtz_vref1 (1.024V) Vdda Vdda/4
en_resvda
vssa
+ DSM0 -
DSM
28
vcm refs qtz_ref vref_vss_ext
refmux[2:0]
ExVrefL
ExVrefR
AMUXBUSL
01 23456 7 0123
ANALOG ANALOG GLOBALS BUS
ANALOG ANALOG BUS GLOBALS
3210 76543210
AMUXBUSR
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*
104
*
Vin Vref out sc2
SC/CT
Vin Vref out sc3
sc3_bgref (1.024V)
*
sc0_bgref (1.024V) sc1_bgref (1.024V)
sc0 Vin Vref out
sc1 Vin Vref out
Vssa
sc2_bgref (1.024V)
AGR[4] AMUXBUSR
refsel[1:0]
out ref in refbufl
CAPSENSE
refbufr
out ref in
refbuf_vref1 (1.024V) refbuf_vref2 (1.2V)
refsel[1:0]
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Vddio0
Vddio3
GPIO P3[6] GPIO P3[7] SIO P12[0] SIO P12[1] GPIO P15[2] GPIO P15[3]
SIO P12[2] SIO P12[3] GPIO P4[0] GPIO P4[1] GPIO P0[0] GPIO P0[1] GPIO P0[2] GPIO P0[3]
*
swinp
ExVrefR
i3 i1
GPIO P3[5] GPIO swinp P3[4] GPIO swinn P3[3] GPIO P3[2] GPIO P3[1] GPIO P3[0] GPXT *P15[1] GPXT *P15[0]
swinn
* * * * * *
Vccd Vssd Vddd
* P15[7] * P15[6]
GPIO P5[7] GPIO P5[6] GPIO P5[5] GPIO P5[4] SIO P12[7] SIO P12[6] GPIO *P1[7] GPIO *P1[6]
USB IO USB IO
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PSoC(R) 5: CY8C55 Family Datasheet
Analog local buses (abus) are routing resources located within the analog subsystem and are used to route signals between different analog blocks. There are eight abus routes in CY8C38, four in the left half (abusl [0:3]) and four in the right half (abusr [0:3]) as shown in Figure 8-2. Using the abus saves the analog globals and analog mux buses from being used for interconnecting the analog blocks. Multiplexers and switches exist on the various buses to direct signals into and out of the analog blocks. A multiplexer can have only one connection on at a time, whereas a switch can have multiple connections on simultaneously. In Figure 8-2, multiplexers are indicated by grayed ovals and switches are indicated by transparent ovals.
8.2.1 Functional Description The ADC connects and configures three basic components, input buffer, delta-sigma modulator, and decimator. The basic block diagram is shown in Figure 8-4. The signal from the input muxes is delivered to the delta-sigma modulator either directly or through the input buffer. The delta-sigma modulator performs the actual analog to digital conversion. The modulator over-samples the input and generates a serial data stream output. This high speed data stream is not useful for most applications without some type of post processing, and so is passed to the decimator through the Analog Interface block. The decimator converts the high speed serial data stream into parallel ADC results. The modulator/decimator frequency response is [(sin x)/x]4; a typical frequency response is shown in Figure 8-5. Figure 8-4. Delta-sigma ADC Block Diagram
Positive Input Mux (Analog Routing) Negative Input Mux Input Buffer
8.2 Delta-sigma ADC
The CY8C38 device contains one delta-sigma ADC. This ADC offers differential input, high resolution and excellent linearity, making it a good ADC choice for both audio signal processing and measurement applications. The converter's nominal operation is 16 bits at 48 ksps. The ADC can be configured to output 20-bit resolution at data rates of up to 187 sps. At a fixed clock rate, resolution can be traded for faster data rates as shown in Table 8-1 and Figure 8-3. Table 8-1. Delta-sigma ADC Performance Bits 20 16 12 8 Maximum Sample Rate (sps) 187 48 k 192 k 384 k SINAD (dB) - 84 66 43
Delta Sigma Modulator
Decimator
12 to 20 Bit Result EOC
SOC
Figure 8-5. Delta-sigma ADC Frequency Response, Normalized to Output, Sample Rate = 48 kHz
0 -10 -20 -30
frequency Response. dB
-40 -50 -60 -70 -80 -90 -100 100 1,000 10,000
Input Frequency, Hz
Figure 8-3. Delta-sigma ADC Sample Rates, Range = 1.024 V
1000000
100000
100,000
1,000,000
10000
Input frequency, Hz
Sample rate SPS)
1000
Continuous Multi-Sample
100
Multi-SampleTurbo
Resolution and sample rate are controlled by the Decimator. Data is pipelined in the decimator; the output is a function of the last four samples. When the input multiplexer is switched, the output data is not valid until after the fourth sample after the switch. 8.2.2 Operational Modes The ADC can be configured by the user to operate in one of four modes: Single Sample, Multi Sample, Continuos, or Multi Sample (Turbo). All four modes are started by either a write to the start bit in a control register or an assertion of the Start of Conversion (SoC) signal. When the conversion is complete, a status bit is set and the output signal End of Conversion (EoC) asserts high and remains high until the value is read by either the DMA controller or the CPU.
10
1 6 8 10 12 14 16 18 20 22
Resolution, bits Resolution, bits
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8.2.2.1 Single Sample In Single Sample mode, the ADC performs one sample conversion on a trigger. In this mode, the ADC stays in standby state waiting for the SoC signal to be asserted. When SoC is signaled the ADC performs four successive conversions. The first three conversions prime the decimator. The ADC result is valid and available after the fourth conversion, at which time the EoC signal is generated. To detect the end of conversion, the system may poll a control register for status. When the transfer is done the ADC reenters the standby state where it stays until another SoC event. 8.2.2.2 Continuous Continuous sample mode is used to take multiple successive samples of a single input signal. Multiplexing multiple inputs should not be done with this mode. There is a latency of three conversion times before the first conversion result is available. This is the time required to prime the decimator. After the first result, successive conversions are available at the selected sample rate. 8.2.2.3 Multi Sample Multi sample mode is similar to continuous mode except that the ADC is reset between samples. This mode is useful when the input is switched between multiple signals. The decimator is re-primed between each sample so that previous samples do not affect the current conversion. Upon completion of a sample, the next sample is automatically initiated. The results can be transferred using either firmware polling, interrupt, or DMA. 8.2.2.4 Multi Sample (Turbo) The multi sample (turbo) mode operates identical to the Multi-sample mode for resolutions of 8 to 16 bits. For resolutions of 17 to 20 bits, the performance is about four times faster than the multi sample mode, because the ADC is only reset once at the end of conversion. More information on output formats is provided in the Technical Reference Manual. 8.2.3 Start of Conversion Input The SoC signal is used to start an ADC conversion. A digital clock or UDB output can be used to drive this input. It can be used when the sampling period must be longer than the ADC conversion time or when the ADC must be synchronized to other hardware. This signal is optional and does not need to be connected if ADC is running in a continuous mode.
Figure 8-6. SAR ADC Block Diagram
vin vrefp vrefn
S/H DAC array D0:D11 SAR digital
comparator
D0:D11
autozero reset clock clock
POWER GROUND
power filtering
vrefp vrefn
The input is connected to the analog globals and muxes. The frequency of the clock is 16 times the sample rate; the maximum clock rate is 16 MHz. 8.3.2 Conversion Signals Writing a start bit or assertion of a start of frame (SOF) signal is used to start a conversion. SOF can be used in applications where the sampling period is longer than the conversion time, or when the ADC needs to be synchronized to other hardware. This signal is optional and does not need to be connected if the SAR ADC is running in a continuous mode. A digital clock or UDB output can be used to drive this input. When the SAR is first powered up or awakened from any of the sleeping modes, there is a power up wait time of 10 s before it is ready to start the first conversion. When the conversion is complete, a status bit is set and the output signal end of frame (EOF) asserts and remains asserted until the value is read by either the DMA controller or the CPU. The EOF signal may be used to trigger an interrupt or a DMA request. 8.3.3 Operational Modes A ONE_SHOT control bit is used to set the SAR ADC conversion mode to either continuous or one conversion per SOF signal. DMA transfer of continuous samples, without CPU intervention, is supported.
8.4 Comparators
The CY8C55 family of devices contains four comparators. Comparators have these features: Input offset factory trimmed to less than 5 mV Rail-to-rail common mode input range (VSSA to VCCA) Speed and power can be traded off by using one of three modes: fast, slow, or ultra low power Comparator outputs can be routed to look up tables to perform simple logic functions and can also be routed to digital blocks The positive input of the comparators may be optionally passed through a low pass filter. Two filters are provided Comparator inputs can be connections to GPIO, DAC outputs and SC block outputs
8.3 Successive Approximation ADC
The CY8C55 family of devices has two Successive Approximation (SAR) ADCs. These ADCs are 12-bit at up to 1 Msps, with single-ended or differential inputs, making them useful for a wide variety of sampling and control applications. 8.3.1 Functional Description In a SAR ADC an analog input signal is sampled and compared with the output of a DAC. A binary search algorithm is applied to the DAC and used to determine the output bits in succession from MSB to LSB. A block diagram of one SAR ADC is shown in Figure 8-6.
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8.4.1 Input and Output Interface The positive and negative inputs to the comparators come from the analog global buses, the analog mux line, the analog local bus and precision reference through multiplexers. The output from each comparator could be routed to any of the two input LUTs. The output of that LUT is routed to the UDB DSI. Figure 8-7. Analog Comparator
From Analog Routing
+ comp0 _
ANAIF
+
comp1
_
From Analog Routing
From Analog Routing
comp2
+ _
comp3
+ _
From Analog Routing
4
4
4
4
4
4
4
4
LUT0
LUT1
LUT2
LUT3
UDBs
8.4.2 LUT The CY8C55 family of devices contains four LUTs. The LUT is a two input, one output lookup table that is driven by any one or two of the comparators in the chip. The output of any LUT is routed to the digital system interface of the UDB array. From the digital system interface of the UDB array, these signals can be connected to UDBs, DMA controller, I/O, or the interrupt controller. The LUT control word written to a register sets the logic function on the output. The available LUT functions and the associated control word is shown in Table 8-2.
Table 8-2. LUT Function vs. Program Word and Inputs Control Word 0000b 0001b 0010b 0011b 0100b 0101b 0110b 0111b 1000b 1001b 1010b 1011b 1100b 1101b 1110b 1111b Output (A and B are LUT inputs) FALSE (`0') A AND B A AND (NOT B) A (NOT A) AND B B A XOR B A OR B A NOR B A XNOR B NOT B A OR (NOT B) NOT A (NOT A) OR B A NAND B TRUE (`1')
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8.5 Opamps
The CY8C55 family of devices contain four general purpose opamps. Figure 8-8. Opamp
GPIO Analog Global Bus Analog Global Bus VREF Analog Internal Bus GPIO
operation at low current output, within 50 mV of the rails. When driving high current loads (about 25 mA) the output voltage may only get within 500 mV of the rails.
8.6 Programmable SC/CT Blocks
The CY8C55 family of devices contains four switched capacitor/continuous time (SC/CT) blocks. Each switched capacitor/continuous time block is built around a single rail-to-rail high bandwidth opamp.
Opamp
GPIO
=
Analog Switch
Switched capacitor is a circuit design technique that uses capacitors plus switches instead of resistors to create analog functions. These circuits work by moving charge between capacitors by opening and closing different switches. Nonoverlapping in phase clock signals control the switches, so that not all switches are ON simultaneously. The PSoC Creator tool offers a user friendly interface, which allows you to easily program the SC/CT blocks. Switch control and clock phase control configuration is done by PSoC Creator so users only need to determine the application use parameters such as gain, amplifier polarity, VREF connection, and so on. The same opamps and block interfaces are also connectable to an array of resistors which allows the construction of a variety of continuous time functions. The opamp and resistor array is programmable to perform various analog functions including

The opamp is uncommitted and can be configured as a gain stage or voltage follower on external or internal signals. See Figure 8-9. In any configuration, the input and output signals can all be connected to the internal global signals and monitored with an ADC, or comparator. The configurations are implemented with switches between the signals and GPIO pins. Figure 8-9. Opamp Configurations
a) Voltage Follower
Naked Operational Amplifier - Continuous Mode Unity-Gain Buffer - Continuous Mode Programmable Gain Amplifier (PGA) - Continuous Mode Transimpedance Amplifier (TIA) - Continuous Mode Up/Down Mixer - Continuous Mode Sample and Hold Mixer (NRZ S/H) - Switched Cap Mode First Order Analog to Digital Modulator - Switched Cap Mode
Opamp Vin
Vout to Pin

b) External Uncommitted Opamp

8.6.1 Naked Opamp
Opamp Vout to GPIO
Vp to GPIO Vn to GPIO
The Naked Opamp presents both inputs and the output for connection to internal or external signals. The opamp has a unity gain bandwidth greater than 6.0 MHz and output drive current up to 650 A. This is sufficient for buffering internal signals (such as DAC outputs) and driving external loads greater than 7.5 kohms. 8.6.2 Unity Gain The Unity Gain buffer is a Naked Opamp with the output directly connected to the inverting input for a gain of 1.00. It has a -3 dB bandwidth greater than 6.0 MHz.
c) Internal Uncommitted Opamp Vn
To Internal Signals
Opamp
Vout to Pin
8.6.3 PGA The PGA amplifies an external or internal signal. The PGA can be configured to operate in inverting mode or noninverting mode. The PGA function may be configured for both positive and negative gains as high as 50 and 49 respectively. The gain is adjusted by changing the values of R1 and R2 as illustrated in Figure 8-10. The schematic in Figure 8-10 shows the configuration and possible resistor settings for the PGA. The gain is switched from inverting and non inverting by changing the
Vp GPIO Pin
The opamp has three speed modes, slow, medium, and fast. The slow mode consumes the least amount of quiescent power and the fast mode consumes the most power. The inputs are able to swing rail-to-rail. The output swing is capable of rail-to-rail
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shared select value of the both the input muxes. The bandwidth for each gain case is listed in Table 8-3. Table 8-3. Bandwidth
Gain 1 24 48 50 Bandwidth 6.0 MHz 340 kHz 220 kHz 215 kHz
Figure 8-11. Continuous Time TIA Schematic
R fb
I in V ref V out
Figure 8-10. PGA Resistor Settings
Vin Vref S Vref Vin 0 1 0 1 R1 20 k or 40 k R2 20 k to 980 k
The TIA configuration is used for applications where an external sensor's output is current as a function of some type of stimulus such as temperature, light, magnetic flux etc. In a common application, the voltage DAC output can be connected to the VREF TIA input to allow calibration of the external sensor bias current by adjusting the voltage DAC output voltage.
8.7 LCD Direct Drive
The PSoC Liquid Crystal Display (LCD) driver system is a highly configurable peripheral designed to allow PSoC to directly drive a broad range of LCD glass. All voltages are generated on chip, eliminating the need for external components. With a high multiplex ratio of up to 1/16, the CY8C55 family LCD driver system can drive a maximum of 736 segments. The PSoC LCD driver module was also designed with the conservative power budget of portable devices in mind, enabling different LCD drive modes and power down modes to conserve power. PSoC Creator provides an LCD segment drive component. The component wizard provides easy and flexible configuration of LCD resources. You can specify pins for segments and commons along with other options. The software configures the device to meet the required specifications. This is possible because of the programmability inherent to PSoC devices. Key features of the PSoC LCD segment system are: LCD panel direct driving Type A (standard) and Type B (low power) waveform support Wide operating voltage range support (2 V to 5 V) for LCD panels Static, 1/2, 1/3, 1/4, 1/5 bias voltage levels Internal bias voltage generation through internal resistor ladder Up to 62 total common and segment outputs Up to 1/16 multiplex for a maximum of 16 backplane/common outputs Up to 62 front plane/segment outputs for direct drive Drives up to 736 total segments (16 backplane x 46 front plane) Up to 64 levels of software controlled contrast Ability to move display data from memory buffer to LCD driver through DMA (without CPU intervention) Adjustable LCD refresh rate from 10 Hz to 150 Hz Ability to invert LCD display for negative image Three LCD driver drive modes, allowing power optimization LCD driver configurable to be active when PSoC is in limited active mode
The PGA is used in applications where the input signal may not be large enough to achieve the desired resolution in the ADC, or dynamic range of another SC/CT block such as a mixer. The gain is adjustable at runtime, including changing the gain of the PGA prior to each ADC sample. 8.6.4 TIA The Transimpedance Amplifier (TIA) converts an internal or external current to an output voltage. The TIA uses an internal feedback resistor in a continuous time configuration to convert input current to output voltage. For an input current Iin, the output voltage is Iin x Rfb +VREF, where VREF is the value placed on the non inverting input. The feedback resistor Rfb is programmable between 20 K and 1 M through a configuration register. Table 8-4 shows the possible values of Rfb and associated configuration settings. Table 8-4. Feedback Resistor Settings
Configuration Word 000b 001b 010b 011b 100b 101b 110b 111b Nominal Rfb (K) 20 30 40 60 120 250 500 1000
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Figure 8-12. LCD System
Global Clock LCD DAC
voltages plus ground, based on the selected bias ratio. The bias voltages are driven out to GPIO pins on a dedicated LCD bias bus, as required.
8.8 CapSense
UDB LCD Driver Block DMA Display RAM PIN
The CapSense system provides a versatile and efficient means for measuring capacitance in applications such as touch sense buttons, sliders, proximity detection, etc. The CapSense system uses a configuration of system resources, including a few hardware functions primarily targeted for CapSense. Specific resource usage is detailed in the CapSense component in PSoC Creator. A capacitive sensing method using a Delta-Sigma Modulator (CSD) is used. It provides capacitance sensing using a switched capacitor technique with a delta-sigma modulator to convert the sensing current to a digital code.
PHUB
8.7.1 LCD Segment Pin Driver Each GPIO pin contains an LCD driver circuit. The LCD driver buffers the appropriate output of the LCD DAC to directly drive the glass of the LCD. A register setting determines whether the pin is a common or segment. The pin's LCD driver then selects one of the six bias voltages to drive the I/O pin, as appropriate for the display data. 8.7.2 Display Data Flow The LCD segment driver system reads display data and generates the proper output voltages to the LCD glass to produce the desired image. Display data resides in a memory buffer in the system SRAM. Each time you need to change the common and segment driver voltages, the next set of pixel data moves from the memory buffer into the Port Data Registers via DMA. 8.7.3 UDB and LCD Segment Control A UDB is configured to generate the global LCD control signals and clocking. This set of signals is routed to each LCD pin driver through a set of dedicated LCD global routing channels. In addition to generating the global LCD control signals, the UDB also produces a DMA request to initiate the transfer of the next frame of LCD data. 8.7.4 LCD DAC The LCD DAC generates the contrast control and bias voltage for the LCD system. The LCD DAC produces up to five LCD drive
8.9 Temp Sensor
Die temperature is used to establish programming parameters for writing flash. Die temperature is measured using a dedicated sensor based on a forward biased transistor. The temperature sensor has its own auxiliary ADC.
8.10 DAC
The CY8C55 parts contain four Digital to Analog Convertors (DACs). Each DAC is 8-bit and can be configured for either voltage or current output. The DACs support CapSense, power supply regulation, and waveform generation. Each DAC has the following features.

Adjustable voltage or current output in 255 steps Programmable step size (range selection) Eight bits of calibration to correct 25% of gain error Source and sink option for current output 8 Msps conversion rate for current output 1 Msps conversion rate for voltage output Monotonic in nature Data and strobe inputs can be provided by the CPU or DMA, or routed directly from the DSI Dedicated low-resistance output pin for high-current mode
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Figure 8-13. DAC Block Diagram
I source Range 1x ,8x ,64x
Reference Source
Scaler
Vout R 3R I sink Range 1x ,8x ,64x
Iout
8.10.1 Current DAC The current DAC (IDAC) can be configured for the ranges 0 to 32 A, 0 to 256 A, and 0 to 2.048 mA. The IDAC can be configured to source or sink current. 8.10.2 Voltage DAC For the voltage DAC (VDAC), the current DAC output is routed through resistors. The two ranges available for the VDAC are 0 to 1.024 V and 0 to 4.096 V. In voltage mode any load connected to the output of a DAC should be purely capacitive (the output of the VDAC is not buffered).
8.12 Sample and Hold
The main application for a sample and hold, is to hold a value stable while an ADC is performing a conversion. Some applications require multiple signals to be sampled simultaneously, such as for power calculations (V and I). Figure 8-15. Sample and Hold Topology (1 and 2 are opposite phases of a clock)
1
Vi
C1
1 2
C2
1
n
V ref V out
2
2
8.11 Up/Down Mixer
In continuous time mode, the SC/CT block components are used to build an up or down mixer. Any mixing application contains an input signal frequency and a local oscillator frequency. The polarity of the clock, Fclk, switches the amplifier between inverting or noninverting gain. The output is the product of the input and the switching function from the local oscillator, with frequency components at the local oscillator plus and minus the signal frequency (Fclk + Fin and Fclk - Fin) and reduced-level frequency components at odd integer multiples of the local oscillator frequency. The local oscillator frequency is provided by the selected clock source for the mixer. Continuous time up and down mixing works for applications with input signals and local oscillator frequencies up to 1 MHz. Figure 8-14. Mixer Configuration
C2 = 1.7 pF C1 = 850 fF
1 1 2 1
V ref
2
C3
C4
2
Vref
8.12.1 Down Mixer The S+H can be used as a mixer to down convert an input signal. This circuit is a high bandwidth passive sample network that can sample input signals up to 14 MHz. This sampled value is then held using the opamp with a maximum clock rate of 4 MHz. The output frequency is at the difference between the input frequency and the highest integer multiple of the Local Oscillator that is less than the input. 8.12.2 First Order Modulator - SC Mode A first order modulator is constructed by placing the switched capacitor block in an integrator mode and using a comparator to provide a 1-bit feedback to the input. Depending on this bit, a reference voltage is either subtracted or added to the input signal. The block output is the output of the comparator and not the integrator in the modulator case. The signal is downshifted and buffered and then processed by a decimator to make a delta-sigma converter or a counter to make an incremental converter. The accuracy of the sampled data from the first-order modulator is determined from several factors. The main application for this modulator is for a low frequency ADC with high accuracy. Applications include strain gauges, thermocouples, precision voltage, and current measurement.
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Rmix 0 20 k or 40 k
Rmix 0 20 k or 40 k Vin
0
sc_clk Vout
Vref sc_clk
1
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9. Programming, Debug Interfaces, Resources
The Cortex-M3 has internal debugging components, tightly integrated with the CPU, providing the following features: JTAG or SWD access Flash Patch and Breakpoint (FPB) block for implementing breakpoints and code patches Data Watchpoint and Trigger (DWT) block for implementing watchpoints, trigger resources, and system profiling Embedded Trace Macrocell (ETM) for instruction trace Instrumentation Trace Macrocell (ITM) for support of printf-style debugging PSoC devices include extensive support for programming, testing, debugging, and tracing both hardware and firmware. JTAG and SWD support all programming and debug features of the device. The SWV and TRACEPORT provide trace output from the DWT, ETM, and ITM. TRACEPORT is faster but uses more pins. SWV is slower but uses only one pin. Cortex-M3 debug and trace functionality enables full device debugging in the final system using the standard production device. It does not require special interfaces, debugging pods, simulators, or emulators. Only the standard programming connections are required to fully support debug. The PSoC Creator IDE software provides fully integrated programming and debug support for PSoC devices. The low cost MiniProg3 programmer and debugger is designed to provide full programming and debug support of PSoC devices in conjunction with the PSoC Creator IDE. PSoC interfaces are fully compatible with industry standard third party tools. All Cortex-M3 debug and trace modules are disabled by default and can only be enabled in firmware. If not enabled, the only way to reenable them is to erase the entire device, clear flash protection, and reprogram the device with new firmware that enables them. Disabling debug and trace features, robust flash protection, and hiding custom analog and digital functionality inside the PSoC device provide a level of security not possible with multichip application solutions. Additionally, all device interfaces can be permanently disabled (Device Security) for applications concerned about phishing attacks due to a maliciously reprogrammed device. Permanently disabling interfaces is not recommended in most applications because the designer then cannot access the device. Because all programming, debug, and test interfaces are disabled when Device Security is enabled, PSoCs with Device Security enabled may not be returned for failure analysis.
pins are useful for in system programming of USB solutions that would otherwise require a separate programming connector. One pin is used for the data clock and the other is used for data input and output. SWD can be enabled on only one of the pin pairs at a time. SWD is used for debugging or for programming the flash memory. In addition, the SWD interface supports the SWV trace output if desired.
9.2 JTAG Interface
The IEEE 1149.1 compliant JTAG interface exists on four pins. The JTAG clock frequency can be up to 8 MHz, or 1/3 of the CPU clock frequency for 8 and 16-bit transfers, or 1/5 of the CPU clock frequency for 32-bit transfers, whichever is least. The JTAG interface is used for programming the flash memory and debugging. Note that, while the debug interface at reset is always SWD, any standard SWD or JTAG debugging tool can switch from SWD to 4-pin JTAG or vice versa without requiring port acquisition, using a standard sequence defined by ARM. When using JTAG pins as standard GPIO, make sure that the GPIO functionality and PCB circuits do not interfere with JTAG use.
9.3 Debug Features
The CY8C55 supports the following debug features: Halt and single-step the CPU View and change CPU and peripheral registers, and RAM addresses Six program address breakpoints and two literal access breakpoints Data watchpoint events to CPU Patch and remap instruction from flash to SRAM Debugging at the full speed of the CPU Debug operations are possible while the device is reset, or in low power modes Compatible with PSoC Creator and MiniProg3 programmer and debugger Standard JTAG or SWD programming and debugging interface makes CY8C55 compatible with other popular third-party tools (for example, ARM / Keil)
9.4 Trace Features
The following trace features are supported: Instruction trace Data watchpoint on access to data address, address range, or data value Trace trigger on data watchpoint Debug exception trigger Code profiling Counters for measuring clock cycles, folded instructions, load/store operations, sleep cycles, cycles per instruction, interrupt overhead Interrupt events trace Software event monitoring, "printf-style" debugging
9.1 SWD Interface
SWD is the default debug interface and is always enabled after any reset, including POR. This means that the two pins used for SWD (P1.0 and P1.1) should not generally be used for any other purpose since they always revert to being SWD pins after any reset. The SWD interface is the preferred alternative to JTAG, as it requires only two pins. The SWD clock frequency can be up to 1/3 of the CPU clock frequency. SWD uses two pins, either two port 1 pins or the USBIO D+ and D- pins. The SWD pins cannot be used as GPIO. The USBIO
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9.5 SWV and TRACEPORT Interfaces
The SWV and TRACEPORT interfaces provide trace data to a debug host via the Cypress MiniProg3 or an external trace port analyzer. The 5 pin TRACEPORT is used for rapid transmission of large trace streams. The single pin SWV mode is used to minimize the number of trace pins. SWV is shared with a JTAG pin. If debugging and tracing are done at the same time then SWD may be used with either SWV or TRACEPORT, or JTAG may be used with TRACEPORT, as shown in Table 9-1. Table 9-1. Debug Configurations Debug and Trace Configuration All debug and trace disabled JTAG SWD SWV TRACEPORT JTAG + TRACEPORT SWD + SWV SWD + TRACEPORT GPIO Pins Used 0 4 2 1 5 9 3 7
9.6 Programming Features
The JTAG or SWD interface provides full programming support. The entire device can be erased, programmed, and verified. Designers can increase flash protection levels to protect firmware IP. Flash protection can only be reset after a full device erase. Individual flash blocks can be erased, programmed, and verified, if block security settings permit.
majority is not reached. When the output is 1, the Write Once NV latch locks the part out of Debug and Test modes; it also permanently gates off the ability to erase or alter the contents of the latch. Matching all bits is intentionally not required, so that single (or few) bit failures do not deassert the WOL output. The state of the NVL bits after wafer processing is truly random with no tendency toward 1 or 0. The WOL only locks the part after the correct 32-bit key (0x50536F43) is loaded into the NVL's volatile memory, programmed into the NVL's nonvolatile cells, and the part is reset. The output of the WOL is only sampled on reset and used to disable the access. This precaution prevents anyone from reading, erasing, or altering the contents of the internal memory. The user can write the key into the WOL to lock out external access only if no flash protection is set (see "Flash Security" section on page 16). However, after setting the values in the WOL, a user still has access to the part until it is reset. Therefore, a user can write the key into the WOL, program the flash protection data, and then reset the part to lock it. If the device is protected with a WOL setting, Cypress cannot perform failure analysis and, therefore, cannot accept RMAs from customers. The WOL can be read out via Serial Wire Debug (SWD) port to electrically identify protected parts. The user can write the key in WOL to lock out external access only if no flash protection is set. For more information on how to take full advantage of the security features in PSoC see the PSoC 5 TRM. Disclaimer Note the following details of the flash code protection features on Cypress devices. Cypress products meet the specifications contained in their particular Cypress datasheets. Cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Cypress is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress are committed to continuously improving the code protection features of our products.
9.7 Device Security
PSoC 5 offers an advanced security feature called device security, which permanently disables all test, programming, and debug ports, protecting your application from external access. The device security is activated by programming a 32-bit key (0x50536F43) to a Write Once Latch (WOL). The WOL must be programmed at VDDD 3.3 V. The Write Once Latch is a type of nonvolatile latch (NVL). The cell itself is an NVL with additional logic wrapped around it. Each WOL device contains four bytes (32 bits) of data. The wrapper outputs a `1' if a super-majority (28 of 32) of its bits match a pre-determined pattern (0x50536F43); it outputs a `0' if this
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PSoC(R) 5: CY8C55 Family Datasheet
10. Development Support
The CY8C55 family has a rich set of documentation, development tools, and online resources to assist you during your development process. Visit psoc.cypress.com/getting-started to find out more.
motor control and on-chip filtering. Application notes often include example projects in addition to the application note document. Technical Reference Manual: PSoC Creator makes designing with PSoC as easy as dragging a peripheral onto a schematic, but, when low level details of the PSoC device are required, use the technical reference manual (TRM) as your guide. Note Visit www.arm.com for detailed documentation about the Cortex-M3 CPU.
10.1 Documentation
A suite of documentation, to ensure that you can find answers to your questions quickly, supports the CY8C55 family. This section contains a list of some of the key documents. Software User Guide: A step-by-step guide for using PSoC Creator. The software user guide shows you how the PSoC Creator build process works in detail, how to use source control with PSoC Creator, and much more. Component Datasheets: The flexibility of PSoC allows the creation of new peripherals (components) long after the device has gone into production. Component datasheets provide all of the information needed to select and use a particular component, including a functional description, API documentation, example code, and AC/DC specifications. Application Notes: PSoC application notes discuss a particular application of PSoC in depth; examples include brushless DC
10.2 Online
In addition to print documentation, the Cypress PSoC forums connect you with fellow PSoC users and experts in PSoC from around the world, 24 hours a day, 7 days a week.
10.3 Tools
With industry standard cores, programming, and debugging interfaces, the CY8C55 family is part of a development tool ecosystem. Visit us at www.cypress.com/go/psoccreator for the latest information on the revolutionary, easy to use PSoC Creator IDE, supported third party compilers, programmers, debuggers, and development kits.
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11. Electrical Specifications
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. The unique flexibility of the PSoC UDBs and analog blocks enable many functions to be implemented in PSoC Creator components, see the component datasheets for full AC/DC specifications of individual functions. See the "Example Peripherals" section on page 32 for further explanation of PSoC Creator components.
11.1 Absolute Maximum Ratings
Table 11-1. Absolute Maximum Ratings DC Specifications Parameter TSTG Description Storage temperature Conditions Recommended storage temperature is +25 C 25 C. Extended duration storage temperatures above 85 C degrade reliability. Min -55 Typ 25 Max 100 Units C
VDDA VDDD VDDIO VCCA VCCD VSSA VGPIO[11] VSIO VIND VBAT Ivddio Vextref LU ESDHBM ESDCDM
Analog supply voltage relative to VSSA Digital supply voltage relative to VSSD I/O supply voltage relative to VSSD Direct analog core voltage input Direct digital core voltage input Analog ground voltage DC input voltage on GPIO DC input voltage on SIO Voltage at boost converter input Boost converter supply Current per VDDIO supply pin ADC external reference inputs Latch up current[12] Human body model Charge device model Electrostatic discharge voltage ESD voltage Pins P0[3], P3[2] Includes signals sourced by VDDA and routed internal to the pin. Output disabled Output enabled
-0.5 -0.5 -0.5 -0.5 -0.5 VSSD - 0.5 VSSD - 0.5 VSSD - 0.5 VSSD - 0.5 0.5 VSSD - 0.5 - - -140 750 500
- - - - - - - - - - - - - - - -
6 6 6 1.95 1.95 VSSD + 0.5 VDDIO + 0.5 7 6 5.5 5.5 20 2 140 - -
V V V V V V V V V V V mA V mA V V
Note Usage above the absolute maximum conditions listed in Table 11-1 may cause permanent damage to the device. Exposure to maximum conditions for extended periods of time may affect device reliability. When used below maximum conditions but above normal operating conditions the device may not operate to specification.
Notes 11. The VDDIO supply voltage must be greater than the maximum analog voltage on the associated GPIO pins. Maximum analog voltage on GPIO pin VDDIO VDDA. 12. Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch-up Test.
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11.2 Device Level Specifications
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.2.1 Device Level Specifications Table 11-2. DC Specifications
Parameter Description VDDA Analog supply voltage and input to analog core regulator VDDA Analog supply voltage, analog regulator bypassed VDDD Digital supply voltage relative to VSSD Digital supply voltage, digital regulator bypassed VDDD [14] VDDIO I/O supply voltage relative to VSSIO Direct analog core voltage input (Analog regulator VCCA bypass) VCCD Direct digital core voltage input (Digital regulator bypass) Active Mode, VDD = 1.71 V-5.5 V IDD[15] Execute from Flash cache, see Cache Controller on page 12 and Flash Program Memory on page 16 Sleep Mode[16] CPU = OFF VDD = VDDIO = 4.5-5.5 V RTC = ON (= ECO32K ON, in low power mode) [17] Sleep timer = ON (= ILO ON at 1 kHz) WDT = OFF Comparator = OFF VDD = VDDIO = 2.7-3.6 V POR = ON Boost = OFF SIO pins in single ended input, unregulated output mode VDD = VDDIO = 1.71-1.95 V T = -40 C T = 25 C T = 85 C T = -40 C T = 25 C T = 85 C T = -40 C T = 25 C T = 85 C T = 25 C - - - - - - - - - - - - - - 2 - - - - - - - - - - - - - - - A A A A A A A A A A Conditions Analog core regulator enabled Analog core regulator disabled Digital core regulator enabled Digital core regulator disabled Analog core regulator disabled Digital core regulator disabled Min 1.8 1.71 1.8 1.71 1.71 1.71 1.71 Typ - 1.8 - 1.8 - 1.8 1.8 Max 5.5 1.89 VDDA[13] 1.89 VDDA[13] 1.89 1.89 Units V V V V V V V
CPU at 6 MHz
T = -40 C T = 25 C T = 85 C
- - -
- 2 -
- - -
mA mA mA
Comparator = ON VDD = VDDIO = 2.7-3.6V CPU = OFF RTC = OFF Sleep timer = OFF WDT = OFF POR = ON Boost = OFF SIO pins in single ended input, unregulated output mode Hibernate Mode[18] VDD = VDDIO = 4.5-5.5 V
T = -40 C T = 25 C Hibernate mode current T = 85 C All regulators and oscillators off. SRAM retention VDD = VDDIO = 2.7 - 3.6 V T = -40 C GPIO interrupts are active T = 25 C Boost = OFF T = 85 C SIO pins in single ended input, unregulated output mode VDD = VDDIO = 1.71-1.95 V T = -40 C T = 25 C T = 85 C
- - - - - - - - -
- - - - 300 - - - -
- - - - - - - - -
nA nA nA nA nA nA nA nA nA
Notes 13. The power supplies can be brought up in any sequence however once stable Vdda must be greater than or equal to all other supplies. 14. The VDDIO supply voltage must be greater than the maximum analog voltage on the associated GPIO pins. Maximum analog voltage on GPIO pin VDDIO VDDA. 15. The current consumption of additional peripherals that are implemented only in programmed logic blocks can be found in their respective datasheets, available in PSoC Creator, the integrated design environment. To estimate total current, find CPU current at frequency of interest and add peripheral currents for your particular system from the device data sheet and component datasheets. 16. If VCCD and VCCA are externally regulated, the voltage difference between VCCD and VCCA must be less than 50 mV. 17. Sleep timer generates periodic interrupts to wake up the CPU. This specification applies only to those times that the CPU is off.
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Table 11-3. AC Specifications[19] Parameter FCPU FBUSCLK Svdd TIO_INIT TSTARTUP TSLEEP Description CPU frequency Bus frequency VDD ramp rate Time from VDDD/VDDA/VCCD/VCCA IPOR to I/O ports set to their reset states Time from VDDD/VDDA/VCCD/VCCA VCCA/VCCD = regulated from VDDA/VDDD, PRES to CPU executing code at no PLL used, IMO boot mode 12 MHz typ. reset vector Wakeup from limited active mode - Application of non-LVD interrupt to beginning of execution of next CPU instruction Conditions 1.71 V VDDD 5.5 V 1.71 V VDDD 5.5 V Min DC DC - - Typ - - - - Max 67.01 67.01 1 10 Units MHz MHz V/ns s
-
-
66
s
-
20
-
s
THIBERNATE Wakeup form hibernate mode - Application of external interrupt to beginning of execution of next CPU instruction
-
-
100
s
Notes 18. If VCCD and VCCA are externally regulated, the voltage difference between VCCD and VCCA must be less than 50 mV. 19. Based on device characterization (Not production tested).
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11.3 Power Regulators
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.3.1 Digital Core Regulator Table 11-4. Digital Core Regulator DC Specifications Parameter Description Input voltage VDDD Output voltage VCCD Regulator output capacitor Conditions Min 1.8 - - Typ - 1.80 1 Max 5.5 - - Units V V F
10%, X5R ceramic or better. The two VCCD pins must be shorted together, with as short a trace as possible, see 6.2 Power System on page 21
Figure 11-1. Regulators VCC vs VDD
Figure 11-2. Digital Regulator PSRR vs Frequency and VDDy
11.3.2 Analog Core Regulator Table 11-3. Analog Core Regulator DC Specifications Parameter Description VDDA Input voltage VCCA Output voltage Regulator output capacitor Conditions Min 1.8 - - Typ - 1.80 1 Max 5.5 - - Units V V F
10%, X5R ceramic or better
Figure 11-3. Analog Regulator PSRR vs Frequency and VDD
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11.3.3 Inductive Boost Regulator. Table 11-6. Inductive Boost Regulator DC Specifications Unless otherwise specified, operating conditions are: VBAT = 2.4 V, VOUT = 2.7 V, IOUT = 40 mA, FSW = 400 kHz, LBOOST = 10 H, CBOOST = 22 F || 0.1 F Parameter VBAT IOUT Description Input voltage Includes startup Load current[20, 21] VBAT = 1.8 - 3.6 V, VOUT = 3.6 - 5.0 V, external diode VBAT = 1.8 - 3.6 V, VOUT = 1.8 - 3.6 V, internal diode ILPK IQ Inductor peak current Quiescent current Boost active mode Boost standby mode, 32 khz external crystal oscillator, IOUT < 1 A VOUT Boost voltage range[22, 23] 1.8 V 1.9 V 2.0 V 2.4 V 2.7 V 3.0 V 3.3 V 3.6 V 5.0 V RegLOAD RegLINE Load regulation Line regulation Efficiency LBOOST = 10 H LBOOST = 22 H Table 11-7. Inductive Boost Regulator AC Specifications Unless otherwise specified, operating conditions are: VBAT = 2.4 V, VOUT = 2.7 V, IOUT = 40 mA, FSW = 400 kHz, LBOOST = 10 H, CBOOST = 22 F || 0.1 F. Parameter VRIPPLE FSW Description Ripple voltage (peak-to-peak) Switching frequency Conditions VOUT = 1.8 V, FSW = 400 kHz, IOUT = 10 mA Min - - Typ - 0.1, 0.4, or 2 Max 100 - Units mV MHz External diode required 1.71 1.81 1.90 2.28 2.57 2.85 3.14 3.42 4.75 - - 70 82 1.80 1.90 2.00 2.40 2.70 3.00 3.30 3.60 5.00 - - 85 90 1.89 2.00 2.10 2.52 2.84 3.15 3.47 3.78 5.25 3.8 4.1 - - V V V V V V V V V % % % % Conditions Min 1.8 - - - - - Typ - - - - 200 12 Max 3.6 50 75 700 - - Units V mA mA mA A A
Notes 20. For output voltages above 3.6 V, an external diode is required. 21. Maximum output current applies for output voltages 4x input voltage. 22. Based on device characterization (Not production tested). 23. At boost frequency of 2 MHz, VOUT is limited to 2 x VBAT. At 400 kHz,VOUT is limited to 4 x VBAT.
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Table 11-8. Recommended External Components for Boost Circuit Parameter LBOOST CBOOST IF VR Figure 11-4. Efficiency vs VOUT IOUT = 30 mA, VBAT ranges from 0.7 V to VOUT, LBOOST = 22 H Filter Description Boost inductor capacitor[24] External Schottky diode is required for VOUT > 3.6 V External Schottky diode average forward current Conditions Min 4.7 10 1 20 Typ 10 22 - - Max 47 47 - - Units H F A V
Figure 11-5. Efficiency vs VBAT IOUT = 30 mA, VOUT = 3.3 V, LBOOST = 22 H
Figure 11-6. Efficiency vs IOUT VBAT = 2.4 V, VOUT = 3.3 V
Figure 11-7. Efficiency vs IOUT VBAT ranges from 0.7 V to 3.3 V, LBOOST = 22 H
Note 24. Based on device characterization (Not production tested).
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Figure 11-8. Efficiency vs Switching Frequency VOUT = 3.3 V, VBAT = 2.4 V, IOUT = 40 mA
11.1 Inputs and Outputs
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Unless otherwise specified, all charts and graphs show typical values. 11.1.1 GPIO Table 11-1. GPIO DC Specifications Parameter Description VIH Input voltage high threshold VIL Input voltage low threshold VIH VIH VIL VIL VOH VOL Input voltage high threshold Input voltage high threshold Input voltage low threshold Input voltage low threshold Output voltage high Output voltage low Conditions CMOS Input, PRT[x]CTL = 0 CMOS Input, PRT[x]CTL = 0 Min 0.7 x VDDIO - Typ - - - - - - - - - - 5.6 5.6 - - - 40 - 320 220 Max - 0.3 x VDDIO - - 0.3 x VDDIO 0.8 - - 0.6 0.6 8.5 8.5 2 7 18 - 100 - - Units V V V V V V V V V V k k nA pF pF mV A
LVTTL Input, PRT[x]CTL = 1, VDDIO < 2.7 V 0.7 x VDDIO LVTTL Input, PRT[x]CTL = 1, VDDIO 2.7 V 2.0 LVTTL Input, PRT[x]CTL = 1, VDDIO < 2.7 V - LVTTL Input, PRT[x]CTL = 1, VDDIO 2.7 V - IOH = 4 mA at 3.3 VDDIO VDDIO - 0.6 IOH = 1 mA at 1.8 VDDIO VDDIO - 0.5 IOL = 8 mA at 3.3 VDDIO IOL = 4 mA at 1.8 VDDIO - - 3.5 3.5 - - - - - - -
Rpullup Pull-up resistor Rpulldown Pull-down resistor IIL Input leakage current (absolute value)[25] CIN Input capacitance[25] VH Idiode Rglobal Rmux Input voltage hysteresis (Schmitt-Trigger)[25] Current through protection diode to VDDIO and VSSIO
25 C, VDDIO = 3.0 V GPIOs without opamp outputs GPIOs with opamp outputs
Resistance pin to analog global bus 25 C, VDDIO = 3.0 V
Resistance pin to analog mux bus 25 C, VDDIO = 3.0 V
Note 25. Based on device characterization (Not production tested).
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Figure 11-9. GPIO Output High Voltage and Current
Figure 11-10. GPIO Output Low Voltage and Current
Table 11-11. GPIO AC Specifications Parameter TriseF TfallF TriseS TfallS Description Rise time in Fast Strong Mode[26] Fall time in Fast Strong Mode[26] Rise time in Slow Strong Mode[26] Fall time in Slow Strong Mode[26] GPIO output operating frequency 2.7 V < VDDIO < 5.5 V, fast strong drive mode 1.71 V < VDDIO < 2.7 V, fast strong drive mode 3.3 V < VDDIO < 5.5 V, slow strong drive mode 1.71 V < VDDIO < 3.3 V, slow strong drive mode GPIO input operating frequency 1.71 V < VDDIO < 5.5 V Conditions 3.3 V VDDIO Cload = 25 pF 3.3 V VDDIO Cload = 25 pF 3.3 V VDDIO Cload = 25 pF 3.3 V VDDIO Cload = 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO Min - - - - - - - - - Typ - - - - - - - - - Max 12 12 60 60 33 20 7 3.5 66 Units ns ns ns ns MHz MHz MHz MHz MHz
Fgpioout
Fgpioin
Figure 11-11. GPIO Output Rise and Fall Times, Fast Strong Mode, VDDIO = 3.3 V, 25 pF Load
Figure 11-12. GPIO Output Rise and Fall Times, Slow Strong Mode, VDDIO = 3.3 V, 25 pF Load
Note 26. Based on device characterization (Not production tested).
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11.1.2 SIO Table 11-13. SIO DC Specifications Parameter Vinmax Vinref Description Maximum input voltage Conditions All allowed values of Vddio and Vddd, see Section 11.2.1 Min - Typ - - Max 5.5 0.52 x VDDIO Units V V
Voutref
VIH
VIL
VOH
VOL Rpullup Rpulldown IIL
CIN VH Idiode
Input voltage reference (differential 0.5 input mode) Output voltage reference (regulated output mode) VDDIO > 3.7 1 1 VDDIO < 3.7 Input voltage high threshold GPIO mode CMOS input 0.7 x VDDIO Hysteresis disabled SIO_ref + 0.2 Differential input mode[27] Input voltage low threshold GPIO mode CMOS input - Hysteresis disabled - Differential input mode[27] Output voltage high Unregulated mode IOH = 4 mA, VDDIO = 3.3 V VDDIO - 0.4 IOH = 1 mA SIO_ref - 0.65 Regulated mode[27] Regulated mode[27] IOH = 0.1 mA SIO_ref - 0.3 Output voltage low - VDDIO = 3.30 V, IOL = 25 mA VDDIO = 1.80 V, IOL = 4 mA - Pull-up resistor 3.5 Pull-down resistor 3.5 Input leakage current (absolute value)[28] VIH < Vddsio 25 C, Vddsio = 3.0 V, VIH = 3.0 V - VIH > Vddsio 25 C, Vddsio = 0 V, VIH = 3.0 V - Input Capacitance[28] - Input voltage hysteresis Single ended mode (GPIO mode) - (Schmitt-Trigger)[28] Differential mode - - Current through protection diode to VSSIO
- - - - - - - - - - - 5.6 5.6
VDDIO - 1 VDDIO - 0.5 - - 0.3 x VDDIO SIO_ref - 0.2 - SIO_ref + 0.2 SIO_ref + 0.2 0.8 0.4 8.5 8.5
V V V V V V V V V V V k k
- - - 40 35 -
14 10 7 - - 100
nA A pF mV mV A
Notes 27. See Figure 6-9 on page 28 and Figure 6-12 on page 31 for more information on SIO reference. 28. Based on device characterization (Not production tested).
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Figure 11-13. SIO Output High Voltage and Current, Unregulated Mode
Figure 11-14. SIO Output Low Voltage and Current, Unregulated Mode
Figure 11-15. SIO Output High Voltage and Current, Regulated Mode
Table 11-16. SIO AC Specifications Parameter TriseF TfallF TriseS TfallS Description Rise time in fast strong mode (90/10%)[29] Fall time in fast strong mode (90/10%)[29] Rise time in slow strong mode (90/10%)[29] Fall time in slow strong mode (90/10%)[29] Conditions Cload = 25 pF, VDDIO = 3.3 V Cload = 25 pF, VDDIO = 3.3 V Cload = 25 pF, VDDIO = 3.0 V Cload = 25 pF, VDDIO = 3.0 V Min - - - - Typ - - - - Max 12 12 75 60 Units ns ns ns ns
Note 29. Based on device characterization (Not production tested).
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Table 11-16. SIO AC Specifications (continued) Parameter Description SIO output operating frequency 2.7 V < VDDIO < 5.5 V, Unregulated output (GPIO) mode, fast strong drive mode 1.71 V < VDDIO < 2.7 V, Unregulated output (GPIO) mode, fast strong drive mode 3.3 V < VDDIO < 5.5 V, Unregulated output (GPIO) mode, slow strong drive mode 1.71 V < VDDIO < 3.3 V, Unregulated output (GPIO) mode, slow strong drive mode 2.7 V < VDDIO < 5.5 V, Regulated output mode, fast strong drive mode 1.71 V < VDDIO < 2.7 V, Regulated output mode, fast strong drive mode 1.71 V < VDDIO < 5.5 V, Regulated output mode, slow strong drive mode SIO input operating frequency 1.71 V < VDDIO < 5.5 V Conditions 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF Output continuously switching into 25 pF Output continuously switching into 25 pF Output continuously switching into 25 pF Min - Typ - Max 33 Units MHz
-
-
16
MHz
-
-
5
MHz
Fsioout
-
-
4
MHz
-
-
20
MHz
-
-
10
MHz
-
-
2.5
MHz
Fsioin
90/10% VDDIO
-
-
66
MHz
Figure 11-16. SIO Output Rise and Fall Times, Fast Strong Mode, VDDIO = 3.3 V, 25 pF Load
Figure 11-17. SIO Output Rise and Fall Times, Slow Strong Mode, VDDIO = 3.3 V, 25 pF Load
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11.1.3 USBIO For operation in GPIO mode, the standard range for VDDD applies, see Device Level Specifications on page 59. Table 11-18. USBIO DC Specifications Parameter Rusbi Rusba Vohusb Volusb Vihgpio Vilgpio Vohgpio Volgpio Vdi Vcm Vse Rps2 Rext Zo CIN IIL Description USB D+ pull-up resistance USB D+ pull-up resistance Static output high Static output low Input voltage high, GPIO mode Input voltage low, GPIO mode Output voltage high, GPIO mode Output voltage low, GPIO mode Differential input sensitivity Differential input common mode range Single ended receiver threshold PS/2 pull-up resistance External USB series resistor USB driver output impedance USB transceiver input capacitance Input leakage current (absolute value) 25 C, VDDD = 3.0 V In PS/2 mode, with PS/2 pull-up enabled In series with each USB pin Including Rext Conditions With idle bus While receiving traffic 15 k 5% to Vss, internal pull-up enabled 15 k 5% to Vss, internal pull-up enabled VDDD 3 V VDDD 3 V IOH = 4 mA, VDDD 3 V IOL = 4 mA, VDDD 3 V |(D+)-(D-)| Min 0.900 1.425 2.8 - 2 - 2.4 - - 0.8 0.8 3 21.78 (-1%) 28 - - Typ - - - - - - - - - - - - 22 - - - Max 1.575 3.090 3.6 0.3 - 0.8 - 0.3 0.2 2.5 2 7 22.22 (+1%) 44 20 2 Units k k V V V V V V V V V k pF nA
Figure 11-18. USBIO Output High Voltage and Current, GPIO Mode
Figure 11-19. USBIO Output Low Voltage and Current, GPIO Mode
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Table 11-20. USBIO AC Specifications Parameter Tdrate Tjr1 Tjr2 Tdj1 Tdj2 Tfdeop Tfeopt Tfeopr Tfst Fgpio_out Tr_gpio Tf_gpio Description Full-speed data rate average bit rate Receiver data jitter tolerance to next transition Receiver data jitter tolerance to pair transition Driver differential jitter to next transition Driver differential jitter to pair transition Source jitter for differential transition to SE0 transition Source SE0 interval of EOP Receiver SE0 interval of EOP Width of SE0 interval during differential transition GPIO mode output operating frequency 3 V VDDD 5.5 V VDDD = 1.71 V Rise time, GPIO mode, 10%/90% VDDD VDDD > 3 V, 25 pF load VDDD = 1.71 V, 25 pF load Fall time, GPIO mode, 90%/10% VDDD VDDD > 3 V, 25 pF load VDDD = 1.71 V, 25 pF load Figure 11-20. USBIO Output Rise and Fall Times, GPIO Mode, VDDD = 3.3 V, 25 pF Load Conditions Min 12 - 0.25% -8 -5 -3.5 -4 -2 160 82 - - - - - - - Typ 12 - - - - - - - - - - - - - - Max 12 + 0.25% 8 5 3.5 4 5 175 - 14 20 6 12 40 12 40 Units MHz ns ns ns ns ns ns ns ns MHz MHz ns ns ns ns
Table 11-21. USB Driver AC Specifications Parameter Tr Tf TR Vcrs Description Transition rise time Transition fall time Rise/fall time matching Output signal crossover voltage VUSB_5, VUSB_3.3, see USB DC Specifications on page 96 Conditions Min - - 90% 1.3 Typ - - - - Max 20 20 111% 2 V Units ns ns
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11.1.4 XRES Table 11-22. XRES DC Specifications Parameter VIH VIL Rpullup CIN VH Idiode Description Input voltage high threshold Input voltage low threshold Pull-up resistor Input capacitance[30] Input voltage hysteresis (Schmitt-Trigger)[30] Current through protection diode to VDDIO and VSSIO Conditions Min 0.7 x VDDIO - 3.5 - - - Typ - - 5.6 3 100 - Max Units - V 0.3 x VDDIO V 8.5 k pF - mV 100 A
Table 11-23. XRES AC Specifications Parameter TRESET Description Reset pulse width Conditions Min 1 Typ - Max - Units s
Note 30. Based on device characterization (Not production tested).
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11.2 Analog Peripherals
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.2.1 Opamp Table 11-24. Opamp DC Specifications Parameter Description VIOFF Input offset voltage
Vos Input offset voltage Operating temperature -40 C to 70 C TCVos Ge1 Cin Vo Iout Input offset voltage drift with temperature Power mode = high Gain error, unity gain buffer mode Input capacitance Output voltage range Output current, source or sink Rload = 1 k Routing from pin
Conditions
Min -
- - - - -
Typ -
- - 12 - - - - - 200 250 330 1000 - - -
Max 2
2.5 2 - 0.1 18 VDDA - 0.05 - - 270 400 950 2500 - - -
Units mV
mV mV V/C % pF V mA mA uA uA uA uA dB dB dB
1 mA, source or sink, power mode = VSSA + 0.05 high VSSA + 500 mV Vout VDDA -500 mV, VDDA > 2.7 V VSSA + 500 mV Vout VDDA -500 mV, 1.7 V = VDDA 2.7 V 25 16 - - - - 80 Vdda 2.7 V Vdda < 2.7 V 85 70
Idd
Quiescent current
Power mode = min Power mode = low Power mode = med Power mode = high
CMRR PSRR
Common mode rejection ratio Power supply rejection ratio
Figure 11-21. Opamp Voffset Histogram, 3388 samples/847 parts, 25 C, Vdda = 5 V
Figure 11-22. Opamp Voffset vs Temperature, Vdda = 5V
Note 31. Based on device characterization (Not production tested).
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Figure 11-23. Opamp Voffset vs Vcommon and Vdda, 25 C
Figure 11-24. Opamp Output Voltage vs Load Current and Temperature, High Power Mode, 25 C, Vdda = 2.7 V
Figure 11-25. Opamp Operating Current vs Vdda and Power Mode
O
Table 11-19. Opamp AC Specifications Parameter Description GBW Gain-bandwidth product Conditions Power mode = minimum, 200 pF load Power mode = low, 200 pF load Power mode = medium, 200 pF load Power mode = high, 200 pF load Power mode = low, 200 pF load Power mode = medium, 200 pF load Power mode = high, 200 pF load Power mode = high, Vdda = 5 V, at 100 kHz Min 1 2 1 3 1.1 0.9 3 - Typ - - - - - - - 45 Max - - - - - - - - Units MHz MHz MHz MHz V/s V/s V/s nV/sqrtHz
SR
Slew rate, 20% - 80%
en
Input noise density
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Figure 11-26. Opamp Noise vs Frequency, Power Mode = High, Vdda = 5V
Figure 11-27. Opamp Step Response, Rising
Figure 11-28. Opamp Step Response, Falling
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11.2.2 Delta-Sigma ADC Unless otherwise specified, operating conditions are:

Operation in continuous sample mode fclk = 3.072 MHz for resolution = 16 to 20 bits; fclk = 6.144 MHz for resolution = 8 to 15 bits Reference = 1.024 V internal reference bypassed on P3.2 or P0.3 Unless otherwise specified, all charts and graphs show typical values Description Resolution Number of channels, single ended Number of channels, differential Monotonic Differential pair is formed using a pair of GPIOs. Yes Buffered, buffer gain = 1, Range = 1.024 V, 16-bit mode, 25 C Buffered, buffer gain = 1, Range = 1.024 V, 16-bit mode Buffered, 16-bit mode, VDDA = 2.7 V, 25 C Buffer gain = 1, 16-bit, Range = 1.024 V Conditions Min 8 - - - - - - - VSSA VSSA VSSA 90 85 - - - - - - - - 10 Typ - - - - - - - - - - - - - - - - - - - - - - Max 20 No. of GPIO No. of GPIO/2 - 0.2 50 0.5 55 VDDA VDDA VDDA - 1 - - 32 1 2 1 1 1 1 1 - Units bits - - - % ppm/ C mV V/C V V V dB dB LSB LSB LSB LSB LSB LSB LSB LSB M
Table 11-20. 20-bit Delta-sigma ADC DC Specifications Parameter
Ge Gd Vos TCVos
Gain error Gain drift Input offset voltage Temperature coefficient, input offset voltage Input voltage range, single ended[32] Input voltage range, differential unbuffered[32] Input voltage range, differential, buffered[32] Power supply rejection ratio, buffered[32]
PSRRb CMRRb INL20 DNL20 INL16 DNL16 INL12 DNL12 INL8 DNL8 Rin_Buff
Buffer gain = 1, 16-bit, Range = 1.024 V Buffer gain = 1, 16 bit, Common mode rejection ratio, buffered[32] Range = 1.024 V Range = 1.024 V, unbuffered, using Integral non linearity[32] external clock source Range = 1.024 V, unbuffered, using [32] Differential non linearity external clock source Range = 1.024 V, unbuffered, using Integral non linearity[32] external clock source Range = 1.024 V, unbuffered, using [32] Differential non linearity external clock source Range = 1.024 V, unbuffered, using [32] Integral non linearity external clock source Range = 1.024 V, unbuffered, using Differential non linearity[32] external clock source Range = 1.024 V, unbuffered, using [32] Integral non linearity external clock source Range = 1.024 V, unbuffered, using Differential non linearity[32] external clock source ADC input resistance Input buffer used
Notes 32. Based on device characterization (not production tested). 33. By using switched capacitors at the ADC input an effective input resistance is created. Holding the gain and number of bits constant, the resistance is proportional to the inverse of the clock frequency. This value is calculated, not measured. For more information see the Technical Reference Manual.
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Table 11-20. 20-bit Delta-sigma ADC DC Specifications (continued) Parameter Description Conditions Input buffer bypassed, 16-bit, Range = 1.024 V Input buffer bypassed, 12 bit, Range = 1.024 V Pins P0[3], P3[2] Min - - 0.9 Typ 74[33] 148[33] - Max - - 1.3 Units k k V
Rin_ADC16 ADC input resistance Rin_ADC12 ADC input resistance Vextref ADC external reference input voltage, see also internal reference in Voltage Reference on page 79 Current Consumption IDD_20 Current consumption, 20 bit[34] Current consumption, 16 bit[34] IDD_16 Current consumption, 12 bit[34] IDD_12 IBUFF Buffer current consumption[34]
187 sps, unbuffered 48 ksps, unbuffered 192 ksps, unbuffered
- - - -
- - - -
1.25 1.2 1.4 2.5
mA mA mA mA
Table 11-21. Delta-sigma ADC AC Specifications Parameter Startup time THD Total harmonic distortion[34] Buffer gain = 1, 16 bit, Range = 1.024 V Range = 1.024 V, unbuffered rate[34] Range = 1.024 V, unbuffered Range = 1.024 V, unbuffered Range = 1.024 V, unbuffered Range = 1.024V, unbuffered Range = 1.024 V, unbuffered Description Conditions Min - - Typ - - Max 4 0.0032 Units Samples %
20-Bit Resolution Mode SR20 BW20 SR16 BW16 SINAD16int Sample rate[34] Input bandwidth at max sample Sample rate[34] Input bandwidth at max sample rate[34] Signal to noise ratio, 16-bit, internal reference[34] 7.8 - 2 - 81 84 - 40 - 11 - - 187 - 48 - - - sps Hz ksps kHz dB dB
16-Bit Resolution Mode
SINAD16ext Signal to noise ratio, 16-bit, external reference[34] 12-Bit Resolution Mode SR12 BW12 SINAD12int Sample rate, continuous, high power[34] Input bandwidth at max sample rate[34] Signal to noise ratio, 12-bit, internal reference[34] Sample rate, continuous, high power[34] Input bandwidth at max sample rate[34] Signal to noise ratio, 8-bit, internal reference[34]
Range = 1.024 V, unbuffered Range = 1.024 V, unbuffered Range = 1.024 V, unbuffered
4 - 66
- 44 -
192 - -
ksps kHz dB
8-Bit Resolution Mode SR8 BW8 SINAD8int Range = 1.024 V, unbuffered Range = 1.024 V, unbuffered Range = 1.024 V, unbuffered 8 - 43 - 88 - 384 - - ksps kHz dB
Note 34. Based on device characterization (not production tested).
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Table 11-22. Delta-sigma ADC Sample Rates, Range = 1.024 V Resolution, Bits 8 9 10 11 12 13 14 15 16 17 18 19 20 Continuous Min 8000 6400 5566 4741 4000 3283 2783 2371 2000 500 125 16 8 Max 384000 307200 267130 227555 192000 157538 133565 113777 48000 12000 3000 375 187.5 Multi-Sample Min 1911 1543 1348 1154 978 806 685 585 495 124 31 4 2 Max 91701 74024 64673 55351 46900 38641 32855 28054 11861 2965 741 93 46 Multi-Sample Turbo Min 1829 1489 1307 1123 956 791 674 577 489 282 105 15 8 Max 87771 71441 62693 53894 45850 37925 32336 27675 11725 6766 2513 357 183
Figure 11-29. Delta-sigma ADC IDD vs sps, Range = 1.024 V, Figure 11-30. Delta-sigma ADC Noise Histogram, 1000 SamContinuous Sample Mode, Input Buffer Bypassed ples, 20-Bit, 187 sps, Ext Ref, VIN = VREF/2, Range = 1.024 V
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Figure 11-31. Delta-sigma ADC Noise Histogram, 1000 sam- Figure 11-32. Delta-sigma ADC Noise Histogram, 1000 samples, 16-bit, 48 ksps, Ext Ref, VIN = VREF/2, Range = 1.024 V ples, 16-bit, 48 ksps, Int Ref, VIN = VREF/2, Range = 1.024 V
Table 11-23. Delta-sigma ADC RMS Noise in Counts vs. Input Range and Sample Rate, 16-bit, Internal Reference, Single Ended Sample rate, sps 2000 3000 6000 12000 24000 48000 0 to VREF 1.21 1.28 1.36 1.44 1.67 1.91 1.02 1.15 1.22 1.33 1.50 1.60 Input Voltage Range 0 to VREF x 2 VSSA to VDDA 1.14 1.25 1.38 1.43 1.43 1.85 0 to VREF x 6 0.99 1.22 1.22 1.40 1.53 1.67
Table 11-24. Delta-sigma ADC RMS Noise in Counts vs. Input Range and Sample Rate, 16-bit, Internal Reference, Differential Sample rate, sps 2000 4000 8000 15625 32000 43750 48000 VREF 0.56 0.58 0.53 0.58 0.60 0.58 0.59 VREF / 2 0.65 0.72 0.72 0.72 0.76 0.75 Input Voltage Range VREF / 4 0.74 0.81 0.82 0.85 VREF / 8 1.02 1.10 1.12 1.13 VREF / 16 1.77 1.98 2.18 2.20
INVALID OPERATING REGION
Table 11-25. Delta-sigma ADC RMS Noise in Counts vs. Input Range and Sample Rate, 20-bit, External Reference, Single Ended Sample rate, sps 8 23 45 90 187 0 to VREF 1.28 1.33 1.77 1.65 1.87 Input Voltage Range 0 to VREF x 2 1.24 1.28 1.26 0.91 1.06 VSSA to VDDA 6.02 6.09 6.28 6.84 7.97 0 to VREF x 6 0.97 0.98 0.96 0.95 1.01
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Table 11-26. Delta-sigma ADC RMS Noise in Counts vs. Input Range and Sample Rate, 20-bit, External Reference, Differential Sample rate, sps VREF 8 11.3 22.5 45 61 170 187 0.70 0.69 0.73 0.76 0.75 0.75 0.73 Figure 11-34. Delta-sigma ADC INL vs Output Code, 16-bit, 48 ksps, 25 C VDDA = 3.3 V VREF / 2 0.84 0.86 0.82 0.94 1.01 0.98 Input Voltage Range VREF / 4 1.02 0.96 1.25 1.02 1.13 VREF / 8 1.40 1.40 1.77 1.76 1.65 INVALID OPERATING REGION VREF / 16 2.65 2.69 2.67 2.75 2.98
Figure 11-33. Delta-sigma ADC DNL vs Output Code, 16-bit, 48 ksps, 25 C VDDA = 3.3 V
11.5.3 Voltage Reference Table 11-25. Voltage Reference Specifications See also ADC external reference specifications in Section 11.2.2. Parameter VREF Description Precision reference voltage Temperature drift[35] Long term drift Thermal cycling drift (stability)[35] Conditions Initial trimming Min 1.017 (-0.7%) - - - Typ 1.024 - 100 100 Max 1.033 (+0.9%) 20 - - Units V ppm/C ppm/Khr ppm
Note 35. Based on device characterization (Not production tested).
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11.5.4 SAR ADC Table 11-26. SAR ADC DC Specifications Parameter Resolution Number of channels - single-ended Number of channels - differential Monotonicity[36] Gain error Input offset voltage Current consumption Input voltage range - single-ended[36] Input voltage range - differential[36] Input CIN resistance[36] Input capacitance[36] Differential pair is formed using a pair of neighboring GPIO. Description Conditions Min - - - Yes - - - VSSA VSSA - 7 Typ - - - - - - - - - - 8 Max 12 No of GPIO No of GPIO/2 - 0.1 0.2 500 VDDA VDDA 2 9 % mV A V V K pF Units bits
Table 11-27. SAR ADC AC Specifications Parameter PSRR CMRR SNR INL DNL THD Description Sample and hold droop[36] Power supply rejection ratio[36] Common mode rejection ratio Sample rate[36] Signal-to-noise ratio (SNR)[36] Input bandwidth[36] Integral non linearity[36] Differential non linearity[36] Total harmonic distortion[36] Internal reference Internal reference Conditions Min - 80 80 - 70 - - - - Typ - - - - - 500 - - - Max 1 - - 1 - -
1 1
Units V/s dB dB Msps dB KHz LSB LSB %
0.005
11.5.5 Analog Globals Table 11-28. Analog Globals AC Specifications Parameter Rppag Rppmuxbus Description Resistance pin-to-pin through analog global[37] Resistance pin-to-pin through analog mux bus[37] Conditions VDDA = 3.0 V VDDA = 3.0 V Min - - Typ 939 721 Max 1461 1135 Units
Note 36. Based on device characterization (Not production tested). 37. The resistance of the analog global and analog mux bus is high if VDDA 2.7 V, and the chip is in either sleep or hibernate mode. Use of analog global and analog mux bus under these conditions is not recommended.
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11.5.6 Comparator Table 11-29. Comparator DC Specifications Parameter VOS Input offset voltage in slow mode VOS VOS VHYST VICM Input offset voltage in slow mode[39] Input offset voltage in ultra low power mode Hysteresis Input common mode voltage Hysteresis enable mode High current / fast mode Low current / slow mode Ultra low power mode CMRR ICMP Common mode rejection ratio High current mode/fast Ultra low power mode[40] Low current mode/slow mode[40] mode[40] Description Input offset voltage in fast mode Conditions Factory trim, Vdda > 2.7 V, Vin 0.5 V Factory trim, Vin 0.5 V Custom trim Min - - - - - - VSSA VSSA VSSA - - - - - - 12 10 - - - 50 - - 6 Typ Max 10 9 4 4 - 32 VDDA - 0.1 VDDA VDDA - 0.9 - 400 100 - dB A A A Units mV mV mV mV mV mV V V
Input offset voltage in fast mode[39] Custom trim
Table 11-30. Comparator AC Specifications Parameter Description Response time, high current mode[40] TRESP Response time, low current mode[40] Response time, ultra low power mode[40] Conditions 50 mV overdrive, measured pin-to-pin 50 mV overdrive, measured pin-to-pin 50 mV overdrive, measured pin-to-pin Min - - - Typ 75 155 55 Max 110 200 - Units ns ns s
Notes 38. The resistance of the analog global and analog mux bus is high if VDDA 2.7 V, and the chip is in either sleep or hibernate mode. Use of analog global and analog mux bus under these conditions is not recommended. 39. The recommended procedure for using a custom trim value for the on-chip comparators can be found in the TRM. 40. Based on device characterization (Not production tested).
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11.5.7 Current Digital-to-analog Converter (IDAC) See the IDAC component data sheet in PSoC Creator for full electrical specifications and APIs. Unless otherwise specified, all charts and graphs show typical values. Table 11-31. IDAC DC Specifications Parameter Resolution IOUT Output current at code = 255 Range = 2.048 mA, code = 255, VDDA 2.7 V, Rload = 600 Range = 2.048 mA, High mode, code = 255, VDDA 2.7 V, Rload = 300 Range = 255 A, code = 255, Rload = 600 Range = 31.875 A, code = 255, Rload = 600 Monotonicity Ezs Eg TC_Eg Zero scale error Gain error Temperature coefficient of gain error Integral nonlinearity Differential nonlinearity, non-monotonic Dropout voltage, source or sink mode Range = 2.048 mA Range = 255 A Range = 31.875 A INL DNL Vcompliance Range = 255 A, Codes 8 - 255, Rload = 2.4 k, Cload = 15 pF Range = 255 A, Rload = 2.4 k, Cload = 15 pF Voltage headroom at max current, Rload to Vdda or Rload to Vssa, Vdiff from Vdda Description Conditions Min - - - Typ - 2.048 2.048 Max 8 - - Units bits mA mA
- - - - - - - - - - 1
255 31.875 - 0 - - - - - - -
- - Yes 2.5 5 0.04 0.04 0.05 3 0.6 -
A A
LSB % % / C % / C % / C LSB LSB V
Note 41. Based on device characterization (Not production tested).
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Table 11-31. IDAC DC Specifications (continued) Parameter IDD Description Operating current, code = 0 Conditions Slow mode, source mode, range = 31.875 A Slow mode, source mode, range = 255 A, Slow mode, source mode, range = 2.04 mA Slow mode, sink mode, range = 31.875 A Slow mode, sink mode, range = 255 A Slow mode, sink mode, range = 2.04 mA Fast mode, source mode, range = 31.875 A Fast mode, source mode, range = 255 A Fast mode, source mode, range = 2.04 mA Fast mode, sink mode, range = 31.875 A Fast mode, sink mode, range = 255 A Fast mode, sink mode, range = 2.04 mA Figure 11-35. IDAC INL vs Input Code, Range = 255 A, Source Mode Min - - - - - - - - - - - - Typ 44 33 33 36 33 33 310 305 305 310 300 300 Max 100 100 100 100 100 100 500 500 500 500 500 500 Units A A A A A A A A A A A A
Figure 11-36. IDAC INL vs Input Code, Range = 255 A, Sink Mode
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Figure 11-37. IDAC DNL vs Input Code, Range = 255 A, Source Mode
Figure 11-38. IDAC DNL vs Input Code, Range = 255 A, Sink Mode
Figure 11-39. IDAC INL vs Temperature, Range = 255 A, Fast Mode
Figure 11-40. IDAC DNL vs Temperature, Range = 255 A, Fast Mode
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Figure 11-41. IDAC Full Scale Error vs Temperature, Range = 255 A, Source Mode
Figure 11-42. IDAC Full Scale Error vs Temperature, Range = 255 A, Sink Mode
Figure 11-43. IDAC Operating Current vs Temperature, Range = 255 A, Code = 0, Source Mode
Figure 11-44. IDAC Operating Current vs Temperature, Range = 255 A, Code = 0, Sink Mode
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Table 11-32. IDAC AC Specifications Parameter FDAC TSETTLE Description Update rate Settling time to 0.5 LSB Range = 31.875 A or 255 A, full scale transition, fast mode, 600 15-pF load Conditions Min - - Typ - - Max 8 125 Units Msps ns
Figure 11-45. IDAC Step Response, Codes 0x40 - 0xC0, 255 A Mode, Source Mode, Fast Mode, Vdda = 5 V
Figure 11-46. IDAC Glitch Response, Codes 0x7F - 0x80, 255 A Mode, Source Mode, Fast Mode, Vdda = 5 V
Figure 11-47. IDAC PSRR vs Frequency
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11.5.8 Voltage Digital to Analog Converter (VDAC) See the VDAC component data sheet in PSoC Creator for full electrical specifications and APIs. Unless otherwise specified, all charts and graphs show typical values. Table 11-48. VDAC DC Specifications Parameter Resolution INL1 DNL1 Rout VOUT Integral nonlinearity Differential nonlinearity Output resistance Output voltage range, code = 255 Monotonicity VOS Eg TC_Eg IDD Zero scale error Gain error 1 V scale 4 V scale Temperature coefficient, gain error 1 V scale 4 V scale Operating current Slow mode Fast mode Figure 11-48. VDAC INL vs Input Code, 1 V Mode 1 V scale 1 V scale 1 V scale 4 V scale 1 V scale 4 V scale, Vdda = 5 V Description Conditions Min - - - - - - - - - - - - - - - Typ 8 2.1 0.3 4 16 1 4 - 0 - - - - - - Max - 2.5 1 - - - - Yes 0.9 2.5 2.5 0.03 0.03 100 500 Units bits LSB LSB k k V V - LSB % % %FSR / C %FSR / C A A
Figure 11-49. VDAC DNL vs Input Code, 1 V Mode
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Figure 11-50. VDAC INL vs Temperature, 1 V Mode
Figure 11-51. VDAC DNL vs Temperature, 1 V Mode
Figure 11-52. VDAC Full Scale Error vs Temperature, 1 V Mode
Figure 11-53. VDAC Full Scale Error vs Temperature, 4 V Mode
Figure 11-54. VDAC Operating Current vs Temperature, 1V Mode, Slow Mode
Figure 11-55. VDAC Operating Current vs Temperature, 1 V Mode, Fast Mode
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Table 11-34. VDAC AC Specifications Parameter FDAC TsettleP Description Update rate 1 V scale 4 V scale Settling time to 0.1%, step 25% to 1 V scale, Cload = 15 pF 75% 4 V scale, Cload = 15 pF TsettleN Settling time to 0.1%, step 75% to 1 V scale, Cload = 15 pF 25% 4 V scale, Cload = 15 pF Figure 11-56. VDAC Step Response, Codes 0x40 - 0xC0, 1 V Mode, Fast Mode, Vdda = 5 V Conditions Min - - - - - - Typ - - 0.45 0.8 0.45 0.7 Max 1000 250 1 3.2 1 3 Units ksps ksps s s s s
Figure 11-57. VDAC Glitch Response, Codes 0x7F - 0x80, 1 V Mode, Fast Mode, Vdda = 5 V
Figure 11-58. VDAC PSRR vs Frequency
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11.5.9 Mixer The mixer is created using a SC/CT analog block; see the Mixer component data sheet in PSoC Creator for full electrical specifications and APIs. Table 11-59. Mixer DC Specifications Parameter VOS G Description Input offset voltage Quiescent current Gain Conditions Min - - - Typ - 0.9 0 Max 20 2 - Units mV mA dB
Table 11-60. Mixer AC Specifications Parameter fLO fin fLO fin SR Description Local oscillator frequency Input signal frequency Local oscillator frequency Input signal frequency Slew rate Conditions Down mixer mode Down mixer mode Up mixer mode Up mixer mode Min - - - - 3 Typ - - - - - Max 4 14 1 1 - Units MHz MHz MHz MHz V/s
11.5.10 Transimpedance Amplifier The TIA is created using a SC/CT analog block; see the TIA component data sheet in PSoC Creator for full electrical specifications and APIs. Table 11-61. Transimpedance Amplifier (TIA) DC Specifications Parameter VIOFF Rconv Description Input offset voltage Conversion resistance[42] R = 20K; 40 pF load R = 30K; 40 pF load R = 40K; 40 pF load R = 80K; 40 pF load R = 120K; 40 pF load R = 250K; 40 pF load R= 500K; 40 pF load R = 1M; 40 pF load Quiescent current Table 11-62. Transimpedance Amplifier (TIA) AC Specifications Parameter BW Description Input bandwidth (-3 dB) Conditions R = 20K; -40 pF load, VDDA 1.9 V R = 120K; -40 pF load, VDDA 1.9 V R = 1M; -40 pF load, VDDA 1.9 V Min 1500 240 25 Typ - - - Max - - - Units kHz kHz kHz Conditions Min - -25 -25 -25 -25 -25 -25 -25 -25 - Typ - - - - - - - - - 1.1 Max 20 +35 +35 +35 +35 +35 +35 +35 +35 2 Units mV % % % % % % % % mA
Note 42. Conversion resistance values are not calibrated. Calibrated values and details about calibration are provided in PSoC Creator component datasheets. External precision resistors can also be used.
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11.5.11 Programmable Gain Amplifier The PGA is created using a SC/CT analog block; see the PGA component data sheet in PSoC Creator for full electrical specifications and APIs. Unless otherwise specified, operating conditions are:

Operating temperature = 25 C for typical values Unless otherwise specified, all charts and graphs show typical values
Table 11-63. PGA DC Specifications Parameter Vin Vos TCVos Ge1 Ge16 Ge50 Vonl Cin Voh Description Input voltage range Input offset voltage Input offset voltage drift with temperature Gain error, gain = 1 Gain error, gain = 16 Gain error, gain = 50 DC output nonlinearity Input capacitance Output voltage swing Power mode = high, gain = 1, Rload = 100 k to VDDA / 2 Power mode = high, gain = 1, Rload = 100 k to VDDA / 2 Iload = 250 A, Vdda 2.7V, power mode = high Power mode = high Gain = 1 Conditions Power mode = minimum Power mode = high, gain = 1 Power mode = high, gain = 1 Min Vssa - - - - - - - VDDA - 0.15 Typ - - - - - - - - - Max Vdda 20 30 0.61 6.1 9 0.01 7 - Units V mV V/C % % % % of FSR pF V
Vol
Output voltage swing
-
-
VSSA + 0.15
V
Vsrc Idd PSRR
Output voltage under load Operating current Power supply rejection ratio
- - 48
- 1.5 -
300 1.65 -
mV mA dB
Figure 11-59. PGA Voffset Histogram, 4096 samples/ 1024 parts
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Table 11-40. PGA AC Specifications Parameter BW1 Description -3 dB bandwidth Conditions Power mode = high, gain = 1, input = 100 mV peak-to-peak Power mode = high, gain = 1, 20% to 80% Power mode = high, Vdda = 5 V, at 100 kHz Min 6.7 Typ 8 Max - Units MHz
SR1 en
Slew rate Input noise density
3 -
- 43
- -
V/s nV/sqrtHz
Figure 11-60. Bandwidth vs. Temperature, at Different Gain Settings, Power Mode = High
Figure 11-61. Noise vs. Frequency, Vdda = 5 V, Power Mode = High
11.5.12 Temperature Sensor Table 11-41. Temperature Sensor Specifications Parameter Description Temp sensor accuracy 11.5.13 LCD Direct Drive Table 11-42. LCD Direct Drive DC Specifications Parameter ICC Description LCD system operating current Conditions Device sleep mode with wakeup at 400-Hz rate to refresh LCDs, bus clock = 3 Mhz, Vddio = Vdda = 3 V, 4 commons, 16 segments, 1/4 duty cycle, 50 Hz frame rate, no glass connected Strong drive mode Min - Typ 63 Max - Units A Conditions Range: -40 C to +85 C Min - Typ 8 Max - Units C
ICC_SEG VBIAS
Current per segment driver
- 2 - - -
260 - 9.1 x VDDA 500 - -
- 5 - 5000 20 710
A V mV pF mV A
LCD bias range (VBIAS refers to the VDDA 3 V and VDDA VBIAS main output voltage(V0) of LCD DAC) LCD bias step size LCD capacitance per segment/common driver Long term segment offset VDDA 3 V and VDDA VBIAS Drivers may be combined
IOUT
Output drive current per segment driver)
Vddio = 5.5V, strong drive mode
355
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Table 11-43. LCD Direct Drive AC Specifications Parameter fLCD Description LCD frame rate Conditions Min 10 Typ 50 Max 150 Units Hz
11.6 Digital Peripherals
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.6.1 Timer The following specifications apply to the Timer/Counter/PWM peripheral in timer mode. Timers can also be implemented in UDBs; for more information, see the Timer component data sheet in PSoC Creator. Table 11-44. Timer DC Specifications Parameter Description Block current consumption 3 MHz 12 MHz 48 MHz 67 MHz Table 11-45. Timer AC Specifications Parameter Description Operating frequency Capture pulse width (Internal) Capture pulse width (external) Timer resolution Enable pulse width Enable pulse width (external) Reset pulse width Reset pulse width (external) Conditions Min DC 13 30 13 13 30 13 30 Typ - - - - - - - - Max 67.01 - - - - - - - Units MHz ns ns ns ns ns ns ns Conditions 16-bit timer, at listed input clock frequency Min - - - - - Typ - 15 60 260 350 Max - - - - - Units A A A A A
11.6.2 Counter The following specifications apply to the Timer/Counter/PWM peripheral, in counter mode. Counters can also be implemented in UDBs; for more information, see the Counter component data sheet in PSoC Creator. Table 11-46. Counter DC Specifications Parameter Description Block current consumption 3 MHz 12 MHz 48 MHz 67 MHz Table 11-47. Counter AC Specifications Parameter Description Operating frequency Capture pulse Resolution Conditions Min DC 13 13 Typ - - - Max 67.01 - - Units MHz ns ns Conditions 16-bit counter, at listed input clock frequency Min - - - - - Typ - 15 60 260 350 Max - - - - - Units A A A A A
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Table 11-47. Counter AC Specifications (continued) Parameter Description Pulse width Pulse width (external) Enable pulse width Enable pulse width (external) Reset pulse width Reset pulse width (external) 11.6.3 Pulse Width Modulation The following specifications apply to the Timer/Counter/PWM peripheral, in PWM mode. PWM components can also be implemented in UDBs; for more information, see the PWM component data sheet in PSoC Creator. Table 11-48. PWM DC Specifications Parameter Description Block current consumption 3 MHz 12 MHz 48 MHz 67 MHz Table 11-49. PWM AC Specifications Parameter Pulse width Pulse width (external) Kill pulse width Kill pulse width (external) Enable pulse width Enable pulse width (external) Reset pulse width Reset pulse width (external) 11.6.4 I2C Table 11-50. Fixed I2C DC Specifications Parameter Description Block current consumption Conditions Enabled, configured for 100 kbps Enabled, configured for 400 kbps Table 11-51. Fixed I2C AC Specifications Parameter Bit rate Description Conditions Min - Typ - Max 1 Units Mbps Min - - Typ - - Max 64 74 Units A A Description Operating frequency Conditions Min DC 13 30 13 30 13 30 13 30 Typ - - - - - - - - - Max 67.01 - - - - - - - - Units MHz ns ns ns ns ns ns ns ns Conditions 16-bit PWM, at listed input clock frequency Min - - - - - Typ - 15 60 260 350 Max - - - - - Units A A A A A Conditions Min 13 30 13 30 13 30 Typ - - - - - Max - - - - - Units ns ns ns ns ns ns
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Controller Area Network[43] Table 11-53. CAN DC Specifications Parameter Description Block current consumption IDD Table 11-52. CAN AC Specifications Parameter Bit rate 11.6.5 Digital Filter Block Table 11-54. DFB DC Specifications Parameter Description DFB operating current Conditions 64-tap FIR at FDFB 100 kHz (1.3 ksps) 500 kHz (6.7 ksps) 1 MHz (13.4 ksps) 10 MHz (134 ksps) 48 MHz (644 ksps) 67 MHz (900 ksps) Table 11-55. DFB AC Specifications Parameter FDFB Description DFB operating frequency Conditions Min DC Typ - Max 67.01 Units MHz - - - - - - 0.03 0.16 0.33 3.3 15.7 21.8 0.05 0.27 0.53 5.3 25.5 35.6 mA mA mA mA mA mA Min Typ Max Units Description Conditions Minimum 8 MHz clock Min - Typ - Max 1 Units Mbit Conditions Min - Typ - Max 200 Units A
Note 43. Refer to ISO 11898 specification for details.
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11.6.6 USB Table 11-56. USB DC Specifications Parameter VUSB_5 VUSB_3.3 VUSB_3 Description Device supply for USB operation Conditions USB configured, USB regulator enabled USB configured, USB regulator bypassed USB configured, USB regulator bypassed[44] Min 4.35 3.15 2.85 - - - Typ - - - 10 8 0.5 Max 5.25 3.6 3.6 - - - Units V V V mA mA mA
IUSB_Configured Device supply current in device active VDDD = 5 V, FCPU = 1.5 MHz mode, bus clock and IMO = 24 MHz V DDD = 3.3 V, FCPU = 1.5 MHz IUSB_Suspended Device supply current in device sleep VDDD = 5 V, connected to USB mode host, PICU configured to wake on USB resume signal VDDD = 5 V, disconnected from USB host VDDD = 3.3 V, connected to USB host, PICU configured to wake on USB resume signal VDDD = 3.3 V, disconnected from USB host 11.6.7 Universal Digital Blocks (UDBs)
- -
0.3 0.5
- -
mA mA
-
0.3
-
mA
PSoC Creator provides a library of pre-built and tested standard digital peripherals (UART, SPI, LIN, PRS, CRC, timer, counter, PWM, AND, OR, and so on) that are mapped to the UDB array. See the component datasheets in PSoC Creator for full AC/DC specifications, APIs, and example code. Table 11-57. UDB AC Specifications Parameter Datapath Performance FMAX_TIMER Maximum frequency of 16-bit timer in a UDB pair FMAX_ADDER Maximum frequency of 16-bit adder in a UDB pair FMAX_CRC Maximum frequency of 16-bit CRC/PRS in a UDB pair Maximum frequency of a two-pass PLD function in a UDB pair Propagation delay for clock in to data 25 C, Vddd 2.7 V out, see Figure 11-62. Propagation delay for clock in to data Worst-case placement, routing, out, see Figure 11-62. and pin selection - - - - - - 67.01 67.01 67.01 MHz MHz MHz Description Conditions Min Typ Max Units
PLD Performance FMAX_PLD - - 67.01 MHz
Clock to Output Performance tCLK_OUT tCLK_OUT - - 20 - 25 55 ns ns
Note 44. Rise/fall time matching (TR) not guaranteed, see USB Driver AC Specifications on page 70.
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Figure 11-62. Clock to Output Performance
11.7 Memory
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.7.1 Flash Table 11-57. Flash DC Specifications Parameter Description Erase and program voltage Table 11-58. Flash AC Specifications Parameter TWRITE TERASE TBULK Description Row write time (erase + program) Row erase time Row program time Bulk erase time (256 KB) Sector erase time (16 KB) Total device program time (including JTAG or SWD and other overhead Flash data retention time, retention period measured from last erase cycle Average ambient temp. TA 55 C, 100 K erase/program cycles -40 C TA 85 C, 10 K erase/program cycles Conditions Min - - - - - - Typ 15 10 5 - - - Max 20 13 7 320 15 20 Units ms ms ms ms ms Seconds VDDD pin Conditions Min 1.71 Typ - Max 5.5 Units V
20
-
-
Years
10
-
-
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11.7.2 EEPROM Table 11-59. EEPROM DC Specifications Parameter Description Erase and program voltage Table 11-60. EEPROM AC Specifications Parameter TWRITE Description Single row erase/write cycle time EEPROM endurance Conditions Min - 1M Typ 2 - Max 20 - Units ms program/ erase cycles years Conditions Min 1.71 Typ - Max 5.5 Units V
EEPROM data retention time
Retention period measured from last erase cycle (up to 100 K cycles)
20
-
-
11.7.3 SRAM Table 11-61. SRAM DC Specifications Parameter VSRAM Description SRAM retention voltage Conditions Min 1.2 Typ - Max - Units V
Table 11-62. SRAM AC Specifications Parameter FSRAM Description SRAM operating frequency Conditions Min DC Typ - Max 67.01 Units MHz
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11.8 PSoC System Resources
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.8.1 POR with Brown Out For brown out detect in regulated mode, VDDD and VDDA must be 2.0 V. Brown out detect is not available in externally regulated mode. Table 11-63. Precise Power On Reset (PRES) with Brown Out DC Specifications Parameter PRESR PRESF Description Precise POR (PPOR) Rising trip voltage Falling trip voltage Factory trim 1.64 1.62 - - 1.68 1.66 V V Conditions Min Typ Max Units
Table 11-64. Power On Reset (POR) with Brown Out AC Specifications Parameter Description VDDD/VDDA droop rate 11.8.2 Voltage Monitors Table 11-65. Voltage Monitors DC Specifications Parameter LVI Trip voltage LVI_A/D_SEL[3:0] = 0000b LVI_A/D_SEL[3:0] = 0001b LVI_A/D_SEL[3:0] = 0010b LVI_A/D_SEL[3:0] = 0011b LVI_A/D_SEL[3:0] = 0100b LVI_A/D_SEL[3:0] = 0101b LVI_A/D_SEL[3:0] = 0110b LVI_A/D_SEL[3:0] = 0111b LVI_A/D_SEL[3:0] = 1000b LVI_A/D_SEL[3:0] = 1001b LVI_A/D_SEL[3:0] = 1010b LVI_A/D_SEL[3:0] = 1011b LVI_A/D_SEL[3:0] = 1100b LVI_A/D_SEL[3:0] = 1101b LVI_A/D_SEL[3:0] = 1110b LVI_A/D_SEL[3:0] = 1111b HVI Trip voltage 1.68 1.89 2.14 2.38 2.62 2.87 3.11 3.35 3.59 3.84 4.08 4.32 4.56 4.83 5.05 5.30 5.57 1.73 1.95 2.20 2.45 2.71 2.95 3.21 3.46 3.70 3.95 4.20 4.45 4.70 4.98 5.21 5.47 5.75 1.77 2.01 2.27 2.53 2.79 3.04 3.31 3.56 3.81 4.07 4.33 4.59 4.84 5.13 5.37 5.63 5.92 V V V V V V V V V V V V V V V V V Description Conditions Min Typ Max Units Conditions Sleep mode Min - - Typ - 5 Max 0.5 - Units s V/sec PRES_TR Response time
Table 11-66. Voltage Monitors AC Specifications Parameter Description Response time Conditions Min - Typ - Max 1 Units s
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11.8.3 Interrupt Controller Table 11-67. Interrupt Controller AC Specifications Parameter Description Delay from interrupt signal input to ISR code execution from main line code Delay from interrupt signal input to ISR code execution from ISR code (tail-chaining) 11.8.4 JTAG Interface Table 11-68. JTAG Interface AC Specifications[45] Parameter f_TCK T_TDI_setup T_TMS_setup T_TDI_hold T_TDO_valid T_TDO_hold Description TCK frequency TDI setup before TCK high TMS setup before TCK high TDI, TMS hold after TCK high TCK low to TDO valid TDO hold after TCK high T = 1/f_TCK T = 1/f_TCK T = 1/f_TCK Conditions 3.3 V VDDD 5 V 1.71 V VDDD < 3.3 V Min - - (T/10) - 5 T/4 T/4 - T/4 Typ - - - - - - - Max 14[46] 7[46] - - - 2T/5 - Units MHz MHz ns Conditions Min - - Typ - - Max 12 6 Units Tcy CPU Tcy CPU
11.8.5 SWD Interface Table 11-69. SWD Interface AC Specifications[45] Parameter f_SWDCK Description SWDCLK frequency Conditions 3.3 V VDDD 5 V 1.71 V VDDD < 3.3 V 1.71 V VDDD < 3.3 V, SWD over USBIO pins T_SWDI_setup SWDIO input setup before SWDCK high T = 1/f_SWDCK max T_SWDI_hold SWDIO input hold after SWDCK high T = 1/f_SWDCK max T = 1/f_SWDCK max T = 1/f_SWDCK max T_SWDO_valid SWDCK high to SWDIO output T_SWDO_hold SWDIO output hold after SWDCK low 11.8.6 TPIU Interface Table 11-70. TPIU Interface AC Specifications[45] Parameter SWV bit rate Description TRACEPORT (TRACECLK) frequency Conditions Min - - Typ - - Max 33[48] 33[48] Units MHz Mbit Min - - - T/4 T/4 - T/4 Typ - - - - - - - Max 14[47] 7[47] 5.5[47] - - 2T/5 - Units MHz MHz MHz
Notes 45. Based on device characterization (Not production tested). 46. f_TCK must also be no more than 1/3 CPU clock frequency. 47. f_SWDCK must also be no more than 1/3 CPU clock frequency. 48. TRACEPORT signal frequency and bit rate are limited by GPIO output frequency, see "GPIO AC Specifications" on page 65.
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11.9 Clocking
Specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Unless otherwise specified, all charts and graphs show typical values. 11.9.1 32 kHz External Crystal Table 11-71. 32 kHz External Crystal DC Specifications[49] Parameter ICC CL DL Description Operating current External crystal capacitance Drive level Conditions Low power mode Min - - - Typ 0.25 6 - Max 1.0 - 1 Units A pF W
Table 11-72. 32 kHz External Crystal AC Specifications Parameter F TON Frequency Startup time High power mode Description Conditions Min - - Typ 32.768 1 Max - - Units kHz s
11.9.2 Internal Main Oscillator) Table 11-73. IMO DC Specifications Parameter 62.6 MHz 48 MHz 24 MHz 12 MHz 6 MHz 3 MHz Description Supply current - - - - - - - - - - - - 600 500 300 200 180 150 A A A A A A Conditions Min Typ Max Units
Note 49. Based on device characterization (Not production tested).
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Figure 11-63. IMO Current vs. Frequency
Table 11-1. IMO AC Specifications Parameter 62.6 MHz 48 MHz FIMO 24 MHz 12 MHz 6 MHz 3 MHz Startup time[49] Jitter (peak to peak)[50] Jp-p F = 24 MHz F = 3 MHz Jitter (long term)[19] Jperiod F = 24 MHz F = 3 MHz Figure 11-64. IMO Frequency Variation vs. Temperature - - 0.9 12 - - ns ns - - 0.9 1.6 - - ns ns From enable (during normal system operation) or wakeup from low power state Description IMO frequency stability (with factory trim) -10 -10 -6 -6 -4 -4 - - - - - - - - 10 10 6 6 4 4 12 % % % % % % s Conditions Min Typ Max Units
Figure 11-65. IMO Frequency Variation vs. VDD
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11.9.3 Internal Low Speed Oscillator Table 11-66. ILO DC Specifications Parameter ICC Leakage current Table 11-67. ILO AC Specifications Parameter Description Startup time, all frequencies ILO frequencies (trimmed) 100 kHz FILO 1 kHz ILO frequencies (untrimmed) 100 kHz 1 kHz Figure 11-66. ILO Frequency Variation vs. Temperature 30 0.3 100 1 300 3.5 kHz kHz 45 0.5 100 1 200 2 kHz kHz Conditions Turbo mode Min - Typ - Max 2 Units ms Description Operating current Conditions FOUT = 1 kHz FOUT = 33 kHz FOUT = 100 kHz Power down mode Min - - - - Typ 0.3 1.0 1.0 2.0 Max 1.7 2.6 2.6 15 Units A A A nA
Figure 11-67. ILO Frequency Variation vs. VDD
Note 50. Based on device characterization (Not production tested).
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11.9.4 External Crystal Oscillator Table 11-68. ECO AC Specifications Parameter F Description Crystal frequency range Conditions Min 4 Typ - Max 25 Units MHz
11.9.5 External Clock Reference Table 11-69. External Clock Reference AC Specifications[51] Parameter Description External frequency range Input duty cycle range Input edge rate 11.9.6 Phase-Locked Loop Table 11-70. PLL DC Specifications Parameter IDD Description PLL operating current Conditions In = 3 MHz, Out = 67 MHz In = 3 MHz, Out = 24 MHz Table 11-71. PLL AC Specifications Parameter Fpllin Fpllout PLL input Description frequency[52] Output of prescaler PLL intermediate frequency[53] PLL output frequency[52] Lock time at startup Jperiod-rms Jitter (rms)[51] Conditions Min 1 1 24 - - Typ - - - - - Max 48 3 67 250 250 Units MHz MHz MHz s ps Min - - Typ 400 200 Max - - Units A A Measured at VDDIO/2 VIL to VIH Conditions Min 0 30 0.1 Typ - 50 - Max 33 70 - Units MHz % V/ns
Notes 51. Based on device characterization (Not production tested). 52. This specification is guaranteed by testing the PLL across the specified range using the IMO as the source for the PLL. 53. PLL input divider, Q, must be set so that the input frequency is divided down to the intermediate frequency range. Value for Q ranges from 1 to 16.
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12. Ordering Information
In addition to the features listed in Table 12-1, every CY8C55 device includes: up to 256 KB flash, 64 KB SRAM, 2 KB EEPROM, a precision on-chip voltage reference, precision oscillators, flash, DMA, a fixed function I2C, JTAG/SWD programming and debug, and more. In addition to these features, the flexible UDBs and analog subsection support a wide range of peripherals. To assist you in selecting the ideal part, PSoC Creator makes a part recommendation after you choose the components required by your application. All CY8C55 derivatives incorporate device and flash security in user-selectable security levels; see the TRM for details. Table 12-1. CY8C55 Family with ARM Cortex-M3 CPU
MCU Core LCD Segment Drive CPU Speed (MHz) Analog SC/CT Analog Blocks[54] Opamps Digital 16-bit Timer/PWM I/O[56]
EEPROM (KB)
SRAM (KB)
Flash (KB)
CapSense
Part Number
Comparators
Package CAN 2.0b Total I/O FS USB USBIO GPIO
JTAG ID
UDBs[55]
ADCs
DAC
DFB
CY8C5568AXI-060 CY8C5568LTI-114 CY8C5567AXI-019 CY8C5567LTI-079 CY8C5566AXI-061 CY8C5566LTI-017
67 256 67 256 67 128 67 128 67 67 64 64
64 64 32 32 16 16
2 2 2 2 2 2

1x 20-bit Del-Sig 2x 12-bit SAR 1x 20-bit Del-Sig 2x 12-bit SAR 1x 20-bit Del-Sig 1x 12-bit SAR 1x 20-bit Del-Sig 1x 12-bit SAR 1x 20-bit Del-Sig 1x 12-bit SAR 1x20-bit Del-Sig 1x12-bit SAR
4 4 4 4 4 4
4 4 4 4 4 4
4 4 4 4 4 4
4 4 4 4 4 4
24 24 24 24 24 24
4 4 4 4 4 4

70 46 70 46 70 46
60 36 60 36 60 36
SIO 8 8 8 8 8 8
2 2 2 2 2 2
100-pin TQFP 0x0E116069 68-pin QFN 0x0E134069
100-pin TQFP 0x0E141069 68-pin QFN 0x0E114069
100-pin TQFP 0x0E143069 68-pin QFN 0x0E13C069
12.1 Part Numbering Conventions
PSoC 5 devices follow the part numbering convention described here. All fields are single character alphanumeric (0, 1, 2, ..., 9, A, B, ..., Z) unless stated otherwise. CY8Cabcdefg-xxx

a: Architecture 3: PSoC 3 5: PSoC 5 b: Family group within architecture 2: CY8C52 family 3: CY8C53 family 4: CY8C54 family 5: CY8C55 family c: Speed grade 4: 40 MHz 8: 67 MHz d: Flash capacity 5: 32 KB 6: 64 KB 7: 128 KB 8: 256 KB ef: Package code
Two character alphanumeric AX: TQFP LT: QFN

g: Temperature range C: commercial I: industrial A: automotive xxx: Peripheral set Three character numeric No meaning is associated with these three characters
Notes 54. Analog blocks support a wide variety of functionality including TIA, PGA, and mixers. See Example Peripherals on page 32 for more information on how analog blocks can be used. 55. UDBs support a wide variety of functionality including SPI, LIN, UART, timer, counter, PWM, PRS, and others. Individual functions may use a fraction of a UDB or multiple UDBs. Multiple functions can share a single UDB. See Example Peripherals on page 32 for more information on how UDBs can be used. 56. The I/O Count includes all types of digital I/O: GPIO, SIO, and the two USB I/O. See 6.4 I/O System and Routing on page 26 for details on the functionality of each of these types of I/O.
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Examples
Cypress Prefix 5: PSoC 5 5: CY8C55 Family 8: 80 MHz 8: 256 KB AX: TQFP I: Industrial Architecture Family Group within Architecture Speed Grade Flash Capacity Package Code Temperature Range Peripheral Set
CY8C
5 5 8 8 AX/PV I
-xxx
All devices in the PSoC 5 CY8C55 family comply to RoHS-6 specifications, demonstrating the commitment by Cypress to lead-free products. Lead (Pb) is an alloying element in solders that has resulted in environmental concerns due to potential toxicity. Cypress uses nickel-palladium-gold (NiPdAu) technology for the majority of leadframe-based packages. A high level review of the Cypress Pb-free position is available on our website. Specific package information is also available. Package Material Declaration Datasheets (PMDDs) identify all substances contained within Cypress packages. PMDDs also confirm the absence of many banned substances. The information in the PMDDs will help Cypress customers plan for recycling or other "end of life" requirements.
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13. Packaging
Table 13-1. Package Characteristics Parameter TA TJ Tja Tja Tjc Tjc Description Operating ambient temperature Operating junction temperature Package JA (68-pin QFN) Package JA (100-pin TQFP) Package JC (68-pin QFN) Package JC (100-pin TQFP) Conditions Min -40 -40 - - - - Typ 25 - 10.93 29.50 6.08 7.32 Max 85 100 - - - - Units C C C/Watt C/Watt C/Watt C/Watt
Table 13-2. Solder Reflow Peak Temperature Package 68-pin QFN 100-pin TQFP Maximum Peak Temperature 260 C 260 C Maximum Time at Peak Temperature 30 seconds 30 seconds
Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package 68-pin QFN 100-pin TQFP MSL MSL 3 MSL 3
Figure 13-1. 68-pin QFN 8x8 with 0.4 mm Pitch Package Outline (Sawn Version)
001-09618 *C
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Figure 13-2. 100-pin TQFP (14 x 14 x 1.4 mm) Package Outline
51-85048 *E
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14. Acronyms
Table 14-1. Acronyms Used in this Document Acronym abus ADC AG AHB analog local bus analog-to-digital converter analog global AMBA (advanced microcontroller bus architecture) high-performance bus, an ARM data transfer bus arithmetic logic unit analog multiplexer bus application programming interface application program status register advanced RISC machine, a CPU architecture automatic thump mode bandwidth Controller Area Network, a communications protocol common-mode rejection ratio central processing unit cyclic redundancy check, an error-checking protocol digital-to-analog converter, see also IDAC, VDAC digital filter block digital input/output, GPIO with only digital capabilities, no analog. See GPIO. direct memory access, see also TD differential nonlinearity, see also INL do not use port write data registers digital system interconnect data watchpoint and trace external crystal oscillator electrically erasable programmable read-only memory electromagnetic interference end of conversion end of frame execution program status register electrostatic discharge embedded trace macrocell finite impulse response, see also IIR flash patch and breakpoint Description
Table 14-1. Acronyms Used in this Document (continued) Acronym FS GPIO HVI IC IDAC IDE I2C, or IIC IIR ILO IMO INL I/O IPOR IPSR IRQ ITM LCD LIN LR LUT LVD LVI LVTTL MAC MCU MISO NC NMI NRZ NVIC NVL opamp PAL PC PCB PGA PHUB PHY full-speed general-purpose input/output, applies to a PSoC pin high-voltage interrupt, see also LVI, LVD integrated circuit current DAC, see also DAC, VDAC integrated development environment Inter-Integrated Circuit, a communications protocol infinite impulse response, see also FIR internal low-speed oscillator, see also IMO internal main oscillator, see also ILO integral nonlinearity, see also DNL input/output, see also GPIO, DIO, SIO, USBIO initial power-on reset interrupt program status register interrupt request instrumentation trace macrocell liquid crystal display Local Interconnect Network, a communications protocol. link register lookup table low-voltage detect, see also LVI low-voltage interrupt, see also HVI low-voltage transistor-transistor logic multiply-accumulate microcontroller unit master-in slave-out no connect nonmaskable interrupt non-return-to-zero nested vectored interrupt controller nonvolatile latch, see also WOL operational amplifier programmable array logic, see also PLD program counter printed circuit board programmable gain amplifier peripheral hub physical layer
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Description
ALU AMUXBUS API APSR ARM(R) ATM BW CAN CMRR CPU CRC DAC DFB DIO DMA DNL DNU DR DSI DWT ECO EEPROM EMI EOC EOF EPSR ESD ETM FIR FPB
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Table 14-1. Acronyms Used in this Document (continued) Acronym PICU PLA PLD PLL PMDD POR PRES PRS PS PSoC(R) PSRR PWM RAM RISC RMS RTC RTL RTR RX SAR SC/CT SCL SDA S/H SINAD SIO SOC SOF Description port interrupt control unit programmable logic array programmable logic device, see also PAL phase-locked loop package material declaration datasheet power-on reset precise power-on reset pseudo random sequence port read data register Programmable System-on-ChipTM power supply rejection ratio pulse-width modulator random-access memory reduced-instruction-set computing root-mean-square real-time clock register transfer language remote transmission request receive successive approximation register switched capacitor/continuous time I2C serial clock I2C serial data sample and hold signal to noise and distortion ratio special input/output, GPIO with advanced features. See GPIO. start of conversion start of frame
Table 14-1. Acronyms Used in this Document (continued) Acronym SPI SR SRAM SRES SWD SWV TD THD TIA TRM TTL TX UART UDB USB USBIO VDAC WDT WOL WRES XRES XTAL Description Serial Peripheral Interface, a communications protocol slew rate static random access memory software reset serial wire debug, a test protocol single-wire viewer transaction descriptor, see also DMA total harmonic distortion transimpedance amplifier technical reference manual transistor-transistor logic transmit Universal Asynchronous Transmitter Receiver, a communications protocol universal digital block Universal Serial Bus USB input/output, PSoC pins used to connect to a USB port voltage DAC, see also DAC, IDAC watchdog timer write once latch, see also NVL watchdog timer reset external reset I/O pin crystal
15. Reference Documents
PSoC(R) 3, PSoC(R) 5 Architecture TRM PSoC(R) 5 Registers TRM
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16. Document Conventions
16.1 Units of Measure
Table 16-1. Units of Measure Symbol C dB fF Hz KB kbps Khr kHz k ksps LSB Mbps MHz M Msps A F H s V W mA ms mV nA ns nV pF ppm ps s sps sqrtHz V decibels femtofarads hertz 1024 bytes kilobits per second kilohours kilohertz kilohms kilosamples per second least significant bit megabits per second megahertz megaohms megasamples per second microamperes microfarads microhenrys microseconds microvolts microwatts milliamperes milliseconds millivolts nanoamperes nanoseconds nanovolts ohms picofarads parts per million picoseconds seconds samples per second square root of hertz volts Unit of Measure degrees Celsius
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17. Revision History
Description Title: PSoC(R) 5: CY8C55 Family Datasheet Programmable System-on-Chip (PSoC(R)) Document Number: 001-66235 Rev. ** ECN No. 3198501 Submission Date 03/17/2011 Orig. of Change MKEA New data sheet. Description of Change
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(c) Cypress Semiconductor Corporation, 2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-66235 Rev. **
(R) (R) (R) (R) (R)
Revised March 28, 2011
Page 112 of 112
CapSense , PSoC 3, PSoC 5, and PSoC CreatorTM are trademarks and PSoC is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. ARM is a registered trademark, and Keil, and RealView are trademarks, of ARM Limited. All products and company names mentioned in this document may be the trademarks of their respective holders.
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